US-12620560-B2 - Apparatus for treating substrate and method for aligning dielectric plate using the same

US12620560B2US 12620560 B2US12620560 B2US 12620560B2US-12620560-B2

Abstract

An apparatus for treating a substrate includes a housing including an open top and a treatment space therein, a gas supply unit configured to supply gas to the treatment space, a support unit including a chuck configured to support the substrate in the treatment space and an upper electrode provided to surround the check when viewed from the top, a dielectric plate unit including a dielectric plate arranged to oppose the substrate supported by the support unit in the treatment space, an upper electrode unit coupled to the dielectric plate unit and including an upper electrode arranged to oppose the lower electrode, and an aligning unit configured to align a horizontal arrangement of the dielectric plate unit, in which a lid extending from the housing in the horizontal direction and coupled to the upper electrode unit is provided on the housing, and the aligning unit is coupled to the lid.

Inventors

Kwang-Sung YOO
Ju-Young Park

Assignees

PSK INC.

Dates

Publication Date: 20260505
Application Date: 20211029
Priority Date: 20210825

Claims (16)

1 . An apparatus for treating a substrate, the apparatus comprising: a housing comprising an open top and a treatment space therein; a gas supply unit, comprising a gas supply source and a gas supply line, configured to supply a gas to the treatment space; a support unit comprising a chuck configured to support the substrate in the treatment space and a lower electrode configured to surround the chuck when viewed from the open top; a dielectric plate unit comprising a dielectric plate arranged to oppose the substrate supported by the support unit in the treatment space; an upper electrode unit coupled to the dielectric plate unit and comprising an upper electrode arranged to oppose the lower electrode; and an aligning unit, comprising a body and a plurality of aligning bolts, configured to align a horizontal arrangement of the dielectric plate unit, wherein a lid extending from the housing in a horizontal direction and coupled to the upper electrode unit, and wherein the lid is provided on the open top of the housing, and the aligning unit is coupled to the lid.
2 . The apparatus of claim 1 , wherein the body is coupled to the lid, and wherein the plurality of aligning bolts are provided to be inserted into a thread formed on the body and to push the upper electrode unit in the horizontal direction.
3 . The apparatus of claim 2 , wherein the body is provided in a form to be attachable to and removable from the lid.
4 . The apparatus of claim 2 , wherein the lid is provided in a ring shape, and the plurality of aligning bolts are provided symmetrically with respect to a center of the lid.
5 . The apparatus of claim 1 , wherein the lid and the upper electrode unit are bolt-coupled to each other.
6 . The apparatus of claim 1 , further comprising: a view port penetrating the dielectric plate unit; and an aligning mark provided on the support unit and aligned with the view port at a preset position.
7 . The apparatus of claim 6 , wherein the view port is provided at a position that does not overlap with the lid, when viewed from the open top.
8 . The apparatus of claim 1 , wherein the dielectric plate unit and the upper electrode unit are coupled to a temperature control plate.
9 . The apparatus of claim 8 , wherein the dielectric plate unit further comprises a first base arranged between the dielectric plate and the temperature control plate, and the upper electrode unit further comprises a second base surrounding the first base and arranged between the upper electrode and the temperature control plate, when viewed from the open top.
10 . The apparatus of claim 9 , wherein the gas supply unit further comprises: a gas channel formed in a space where the first base and the second base are separated from each other, wherein, the gas supply source comprises a first gas supply source configured to supply a process gas excited by plasma to the gas channel, and wherein a discharge end of the gas channel is oriented toward an edge region of the substrate supported by the support unit.
11 . The apparatus of claim 9 , wherein the gas supply unit further comprises: a gas flow path provided in the dielectric plate, wherein the gas supply source comprises a second gas supply source configured to supply an inert gas to the gas flow path, and wherein a discharge end of the gas flow path is formed toward a center region of the support supported by the support unit.
12 . A method of aligning a dielectric plate using the apparatus of treating the substrate of claim 2 , the method comprising aligning the dielectric plate at a preset position with respect to the support unit before or after treating the substrate in the treatment space, wherein when the dielectric plate is not aligned at the preset position, any one of the plurality of aligning bolts is tightened to move the upper electrode unit to left and right, thus aligning the dielectric plate at the preset position.
13 . The method of claim 12 , wherein the aligning unit is provided to be removably attached to the lid.
14 . The method of claim 12 , wherein the lid and the upper electrode unit are bolt-coupled to each other, the lid and the upper electrode unit are completely coupled to each other during treatment of the substrate in the treatment space, and the lid and the upper electrode unit are loosely coupled to each other during alignment of the dielectric plate.
15 . The method of claim 12 , wherein the preset position is a position where the dielectric plate is aligned at a position where the support unit is placed, during treatment of the substrate in the treatment space.
16 . The method of claim 12 , wherein any one of the plurality of aligning bolts is tightened to place a view port penetrating the dielectric plate unit and an aligning mark provided on the support unit to correspond to the view port on a straight line.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application is a National Stage of International Application No. PCT/KR2021/015421 filed Oct. 29, 2021, claiming priority based on Korean Patent Application No. 10-2021-0112160 filed Aug. 25, 2021, the disclosures of which are incorporated herein by reference in their entireties. TECHNICAL FIELD The present disclosure relates to an apparatus for treating a substrate and a method of aligning a dielectric plate, and more particularly, to an apparatus for treating a substrate by using plasma and a method of aligning a dielectric plate provided in the apparatus. BACKGROUND ART Plasma is an ionized gas state including ions, radicals, electrons, etc., and is generated in response to very high temperatures, strong electric fields, or radio frequency (RF) electromagnetic fields. A semiconductor device manufacturing process includes an ashing or etching process to remove a film material from a substrate by using plasma. The ashing or etching process is performed by collision or reaction of ions and radical particles, contained in plasma, with a film material on the substrate. A process of treating a substrate by using plasma may be performed in various manners. A bevel etching apparatus for etching an edge region of the substrate treats the edge region of the substrate by irradiating plasma to the edge region of the substrate. The bevel etching apparatus performs etching on the substrate by supplying a processing gas excited to a plasma state to the edge of the substrate. To prevent etching of other regions than the edge region of the substrate, a dielectric plate provided to an insulator is located on the substrate. To process the edge region of the substrate, adjustment of a relative position between the dielectric plate and the substrate is crucial. However, separate inclusion of a structure for moving the dielectric plate causes spatial constraints in forming the interior of an existing bevel etching apparatus and increases the volume of the bevel etching apparatus. DESCRIPTION OF EMBODIMENTS Technical Problem The present disclosure provides an apparatus for treating a substrate and a method of aligning a dielectric plate to efficiently control a relative position between an insulator and the substrate. The present disclosure also provides an apparatus for treating a substrate and a method of aligning a dielectric plate, by which the efficiency of plasma treatment with respect to an edge region of the substrate may be further improved. Problems to be solved by the present disclosure are not limited to the above-mentioned problems, and the problems not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the present specification and the accompanying drawings. Solution to Problem The present disclosure provides an apparatus for treating a substrate. In an embodiment, the apparatus for treating the substrate includes a housing including an open top and including a treatment space therein, a gas supply unit configured to supply a gas to the treatment space, a support unit including a chuck configured to support the substrate in the treatment space and an upper electrode provided to surround the check when viewed from the top, a dielectric plate unit including a dielectric plate arranged to oppose the substrate supported by the support unit in the treatment space, an upper electrode unit coupled to the dielectric plate unit and including an upper electrode arranged to oppose the lower electrode, and an aligning unit configured to align a horizontal arrangement of the dielectric plate unit, in which a lid extending from the housing in the horizontal direction and coupled to the upper electrode unit is provided on the housing, and the aligning unit is coupled to the lid. In an embodiment, the aligning unit may include a body coupled to the lid and a plurality of aligning bolts provided to be inserted into a thread formed in the body and to push the upper electrode unit in the horizontal direction. In an embodiment, the body may be provided in a form to be attachable to and removable from the lid. In an embodiment, the lid may be provided in a ring shape, and the plurality of aligning bolts may be provided symmetrically with respect to a center of the lid. In an embodiment, the lid and the upper electrode unit may be bolt-coupled to each other. In an embodiment, the apparatus may further include a view port configured to penetrate the dielectric plate unit and an aligning mark provided on the support unit to correspond to the view port at a preset position. In an embodiment, the view port may be provided at a position that does not overlap with the lid, when viewed from the top. In an embodiment, the dielectric plate unit and the upper electrode unit may be configured to be coupled to a temperature control plate. In an embodiment, the dielectric plate unit may further include a first base arranged between the