US-12620564-B2 - Semiconductor substrate processing apparatus

US12620564B2US 12620564 B2US12620564 B2US 12620564B2US-12620564-B2

Abstract

A semiconductor substrate processing apparatus includes a chamber dimensioned to accommodate a plurality of strip magazines, each strip magazine configured to receive a plurality of substrates therein, a plasma generator coupled to the chamber and configured to generate plasma used to remove foreign substances on the substrates in the chamber, and a rotation support mechanism configured to rotate the plurality of strip magazines within the chamber. Each of the strip magazines includes first and second side wall plates, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates. The rotation support mechanism includes: a shaft, a motor configured to rotate the shaft, and a plurality of support frames fixed to side surfaces of the shaft and configured to fixedly support the strip magazines.

Inventors

Daewoong Heo

Assignees

SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20221229
Priority Date: 20220607

Claims (20)

1 . A semiconductor substrate processing apparatus, comprising: a chamber dimensioned to accommodate a plurality of strip magazines, each strip magazine configured to receive a plurality of substrates therein; a plasma generator coupled to the chamber and configured to generate plasma used to remove foreign substances on the substrates in the chamber; and a rotation support mechanism configured to rotate the plurality of strip magazines within the chamber, wherein each of the strip magazines includes first and second side wall plates facing each other, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates disposed between the first and second side wall plates, and wherein the rotation support mechanism includes: a shaft extending in a vertical direction in the chamber; a motor configured to rotate the shaft; and a plurality of support frames detachably fixed to side surfaces of the shaft and configured to fixedly support the strip magazines.
2 . The semiconductor substrate processing apparatus of claim 1 , wherein the shaft comprises a keyway in each of the side surfaces, and each of the support frames comprises a key that is configured to engage with a corresponding one of the keyways of the shaft.
3 . The semiconductor substrate processing apparatus of claim 1 , wherein each of the support frames includes: a horizontal plate configured to support the lower plate of the strip magazine and including a side wall plate fixing portion configured to press and fix one of the first and second side wall plates of the strip magazine; and a vertical plate extending from the horizontal plate and configured to support the other one of the first and second side wall plates of the strip magazine and including an upper plate fixing portion configured to press and fix the upper plate of the strip magazine.
4 . The semiconductor substrate processing apparatus of claim 1 , wherein the support frames include first and second support frames that are spaced apart from each other in a vertical direction along the shaft, a lower surface of the first support frame is spaced apart from the motor by a first distance, and a lower surface of the second support frame is spaced apart from the motor by a second distance greater than the first distance.
5 . The semiconductor substrate processing apparatus of claim 4 , wherein the first support frame is configured to fix a first strip magazine of the plurality of strip magazines, the first support frame includes a first horizontal plate configured to support the lower plate of the first strip magazine and including a first side wall plate fixing portion configured to press and fix one of the first and second side wall plates of the first strip magazine, and a first vertical plate configured to support the other one of the first and second side wall plates of the first strip magazine, the second support frame is configured to fix a second strip magazine of the plurality of strip magazines, and the second support frame includes a second horizontal plate configured to support the lower plate of the second strip magazine and including a second side wall plate fixing portion configured to press and fix one of the first and second side wall plates of the second strip magazine and a second upper plate fixing portion configured to press and fix the upper plate of the first strip magazine fixed to the first support frame, and a second vertical plate configured to support the other one of the first and second side wall plates of the second strip magazine and including a first upper plate fixing portion configured to press and fix the upper plate of the second strip magazine.
6 . The semiconductor substrate processing apparatus of claim 1 , wherein the rotation support mechanism further includes a bearing provided between the shaft and the motor to transmit a rotational force generated by the motor to the shaft.
7 . The semiconductor substrate processing apparatus of claim 1 , wherein the motor is configured to rotate the shaft within a rotation speed range of 1,200 rpm to 2,500 rpm.
8 . The semiconductor substrate processing apparatus of claim 1 , wherein the motor includes a direct drive motor.
9 . The semiconductor substrate processing apparatus of claim 1 , wherein each strip magazine includes an open end into which the substrates are loaded or unloaded, and the open end of the strip magazine is configured to face radially with respect to an axis of rotation of the shaft.
10 . The semiconductor substrate processing apparatus of claim 9 , wherein the number of the strip magazines is within a range of 4 to 8.
11 . A semiconductor substrate processing apparatus, comprising: a chamber dimensioned to provide a space in which a plasma cleaning process is performed; a motor on a lower wall of the chamber; a shaft rotatably connected to the motor and extending in a vertical direction in the chamber; a plurality of support frames detachably fixed to side surfaces of the shaft and fixedly supporting a plurality of strip magazines each loaded with a plurality of substrates; and a plasma generator configured to generate plasma in the chamber for removing foreign substances on the substrates, wherein each of the strip magazines includes first and second side wall plates facing each other, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates between the first and second side wall plates, and each of the strip magazines includes an open end into which the substrates are inserted or removed, and the open end of the strip magazine faces a direction parallel to or perpendicular to the side surface of the shaft to which the support frame supporting the strip magazine is fixed.
12 . The semiconductor substrate processing apparatus of claim 11 , wherein the shaft includes a keyway in the side surface, and each of the support frames includes a key that engages with the keyway of the shaft.
13 . The semiconductor substrate processing apparatus of claim 11 , wherein each of the support frames includes: a horizontal plate supporting the lower plate of the strip magazine and including a side wall plate fixing portion pressing and fixing one of the first and second side wall plates of the strip magazine; and a vertical plate extending from the horizontal plate supporting the other one of the first and second side wall plates of the strip magazine and including an upper plate fixing portion pressing and fixing the upper plate of the strip magazine.
14 . The semiconductor substrate processing apparatus of claim 11 , wherein the support frames include first and second support frames that are spaced apart from each other in a vertical direction along the shaft, a lower surface of the first support frame is spaced apart from the motor by a first distance, and a lower surface of the second support frame is spaced apart from the motor by a second distance greater than the first distance.
15 . The semiconductor substrate processing apparatus of claim 14 , wherein the first support frame fixes a first strip magazine of the plurality of strip magazines, the first support frame includes a first horizontal plate supporting the lower plate of the first strip magazine and including a first side wall plate fixing portion pressing and fixing one of the first and second side wall plates of the first strip magazine, and a first vertical plate supporting the other one of the first and second side wall plates of the first strip magazine, the second support frame fixes a second strip magazine of the plurality of strip magazines, and the second support frame includes a second horizontal plate supporting the lower plate of the second strip magazine and including a second side wall plate fixing portion pressing and fixing one of the first and second side wall plates of the second strip magazine and a second upper plate fixing portion pressing and fixing the upper plate of the first strip magazine fixed to the first support frame, and a second vertical plate supporting the other one of the first and second side wall plates of the second strip magazine and including a first upper plate fixing portion pressing and fixing the upper plate of the second strip magazine.
16 . The semiconductor substrate processing apparatus of claim 11 , wherein the motor is configured to rotate the shaft within a rotation speed range of 1,200 rpm to 2,500 rpm.
17 . The semiconductor substrate processing apparatus of claim 11 , wherein the motor includes a direct drive motor.
18 . The semiconductor substrate processing apparatus of claim 11 , wherein the open end of the strip magazine faces radially outwardly with respect to a rotation center of the shaft.
19 . The semiconductor substrate processing apparatus of claim 18 , wherein the number of the strip magazines is within a range of 4 to 8 along a circumferential direction with respect to the rotation center of the shaft on the support frames.
20 . A semiconductor substrate processing apparatus, comprising: a chamber configured to provide a space for accommodating a plurality of strip magazines that each accommodate a plurality of substrates therein; a plasma generator configured to generate a plasma for removing foreign substances on the substrates in the chamber; and a rotation support mechanism configured to rotate the strip magazines within the chamber such that ions of the plasma are uniformly applied on the substrates, wherein each of the strip magazines includes first and second side wall plates facing each other, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates loaded between the first and second side wall plates, and wherein the rotation support mechanism includes: a shaft extending vertically within the chamber and including at least one keyway on a side surface of the shaft; a motor configured to rotate the shaft; a bearing provided between the shaft and the motor to transmit a rotational force generated from the motor to the shaft; and at least one support frame fixed to the side surface of the shaft, fixedly supporting each of the strip magazines, and including a key for connecting to or disconnecting from the at least one keyway.

Description

PRIORITY STATEMENT This application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2022-0068731, filed on Jun. 7, 2022 in the Korean Intellectual Property Office (KIPO), the contents of which are herein incorporated by reference in their entirety. FIELD Example embodiments relate to a semiconductor substrate processing apparatus. More particularly, example embodiments relate to a semiconductor substrate processing apparatus for performing a plasma cleaning process on a semiconductor substrate. BACKGROUND Before proceeding with a wire bonding process for connecting conductive wires between semiconductor devices, a plasma cleaning process in which plasma is applied on a semiconductor substrate for a predetermined time in a plasma chamber may be performed to remove an oxide film, foreign substances, and the like on the semiconductor substrate. Bond ability between a bond finger of the semiconductor substrate and a gold wire may be improved through the plasma cleaning process. Since the plasma cleaning process is performed by irradiating electron ions on the semiconductor substrate held on a strip magazine, the oxide film and the foreign substances of the semiconductor substrate provided in the strip magazine may not be removed. When a sufficient cleaning effect is not obtained, there may be a problem in that an adhesive force between the bond finger of the semiconductor substrate and the wiring is lowered. SUMMARY Example embodiments provide a semiconductor substrate processing apparatus including a rotation support mechanism that rotates a strip magazine provided with a semiconductor substrate in a plasma chamber. According to example embodiments, a semiconductor substrate processing apparatus includes a chamber dimensioned to accommodate a plurality of strip magazines, each strip magazine configured to receive a plurality of substrates therein, a plasma generator coupled to the chamber and configured to generate plasma used to remove foreign substances on the substrates in the chamber, and a rotation support mechanism configured to rotate the plurality of strip magazines within the chamber. Each of the strip magazines includes first and second side wall plates facing each other, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates disposed between the first and second side wall plates. The rotation support mechanism includes: a shaft extending in a vertical direction in the chamber, a motor configured to rotate the shaft, and a plurality of support frames fixed to side surfaces of the shaft and configured to fixedly support the strip magazines. According to example embodiments, a semiconductor substrate processing apparatus includes a chamber dimensioned to provide a space in which a plasma cleaning process is performed, a motor on a lower wall of the chamber, a shaft rotatably connected to the motor and extending in a vertical direction in the chamber, a plurality of support frames detachably fixed to side surfaces of the shaft and fixedly supporting a plurality of strip magazines each loaded with a plurality of substrates, and a plasma generator configured to generate plasma in the chamber for removing foreign substances on the substrates. Each of the strip magazines includes first and second side wall plates facing each other, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates between the first and second side wall plates, and each of the strip magazines includes an open end into which the substrates are inserted or removed, and the open end of the strip magazine faces a direction parallel to or perpendicular to the side surface of the shaft to which the support frame supporting the strip magazine is fixed. According to example embodiments, a semiconductor substrate processing apparatus includes a chamber configured to provide a space for accommodating a plurality of strip magazines that each accommodate a plurality of substrates therein, a plasma generator configured to generate a plasma for removing foreign substances on the substrates in the chamber, and a rotation support mechanism configured to rotate the strip magazines within the chamber such that ions of the plasma are uniformly applied on the substrates. Each of the strip magazines includes first and second side wall plates facing each other, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates loaded between the first and second side wall plates. The rotation support mechanism includes: a shaft extending vertically within the chamber and including at least one keyway on a side surface of the shaft, a motor configured to rotate the shaft, a bearing provided between the shaft and the motor to transmit a rotational force generated from the motor to the shaft