US-12620734-B2 - Optoelectronic component, network device, and method for manufacturing optoelectronic component

US12620734B2US 12620734 B2US12620734 B2US 12620734B2US-12620734-B2

Abstract

An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.

Inventors

Ying Guo

Assignees

HUAWEI TECHNOLOGIES CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20220930
Priority Date: 20200331

Claims (20)

1 . An optoelectronic component comprising: a host circuit board comprising: a first host circuit board surface; and a conductive sheet located on the first host circuit board surface; an optical module comprising: a first end; a second end; a module circuit board located on the host circuit board and comprising: a first module circuit board surface, wherein the first module circuit board surface faces the first host circuit board surface; and a second module circuit board surface; a gold finger in contact with the conductive sheet, wherein the gold finger is located on the first module circuit board surface; and an air duct located between and passing through the first end and the second end; and a heat sink located on the second module circuit board surface.
2 . The optoelectronic component of claim 1 , further comprising a thermally conductive layer disposed between the module circuit board and the heat sink.
3 . The optoelectronic component of claim 1 , further comprising: a plurality of first rows of gold fingers on the first module circuit board surface; and a plurality of second rows of conductive sheets on the first host circuit board surface, wherein each of the first rows is in contact with one of the second rows.
4 . The optoelectronic component of claim 1 , wherein the host circuit board further comprises a connector, wherein the connector is located between the module circuit board and the host circuit board, and wherein the conductive sheet extends out of the connector and be in contact with the gold finger.
5 . The optoelectronic component of claim 1 , wherein the module circuit board further comprises a module circuit board end adjacent to the second end, and wherein the gold finger is located proximate to the second end.
6 . The optoelectronic component of claim 1 , wherein the optical module is an optical receiving component, an optical sending component, an optical transceiver component, or an optical forwarding component.
7 . A network device comprising: an optoelectronic component comprising: a host circuit board comprising: a first host circuit board surface; and a conductive sheet located on the first host circuit board surface; an optical module comprising: a first end; a second end; a module circuit board located on the host circuit board and comprising: a first module circuit board surface, wherein the first module circuit board surface faces the first host circuit board surface; and a second module circuit board surface; a gold finger in contact with the conductive sheet, wherein the gold finger is located on the first module circuit board surface; and an air duct located between and passing through the first end and the second end; and a heat sink located on the second module circuit board surface.
8 . The network device of claim 7 , further comprising a thermally conductive layer disposed between the module circuit board and the heat sink.
9 . The network device of claim 7 , if further comprising: a plurality of first rows of gold fingers on the first module circuit board surface; and a plurality of second rows of conductive sheets on the first host circuit board surface, wherein each of the first rows is in contact with one of the second rows.
10 . The network device of claim 7 , wherein the host circuit board further comprises a connector, wherein the connector is located between the module circuit board and the host circuit board, and wherein the conductive sheet extends out of the connector and is in contact with the gold finger.
11 . The network device of claim 7 , wherein the module circuit board further comprises a module circuit board end, and wherein the gold finger is located proximate to the module circuit board end.
12 . The network device of claim 7 , wherein the optical module is an optical receiving component, an optical sending component, an optical transceiver integral component, or an optical forwarding component.
13 . A method for manufacturing an optoelectronic component and comprising: installing a gold finger on a first module circuit board surface of a module circuit board of an optical module that extends from a first end to a second end; installing a heat sink on a second module circuit board surface of the module circuit board; installing a conductive sheet on a first host circuit board surface of a host circuit board; installing the optical module on the first host circuit board surface so that the first module circuit board surface faces the first host circuit board surface, and so that the gold finger is in contact with the conductive sheet; and disposing an air duct on the optical module so that the air duct is located between and passes through a first end of the optical module and a second end of the optical module.
14 . The method of claim 13 , further comprising installing a thermally conductive layer between the second module circuit board surface and the heat sink.
15 . The method of claim 13 , further comprising: installing a connector on a second host circuit board surface of the host circuit board so that the conductive sheet is located in the connector and extends out of the connector; and further installing the optical module on the connector so that the gold finger is in contact with the connector.
16 . The method of claim 13 , further comprising: installing a plurality of first rows of gold fingers on the first module circuit board surface; installing a plurality of second rows of conductive sheets on the first host circuit board surface; and contacting each of the first rows with one of the second rows.
17 . The method of claim 13 , further comprising installing the gold finger proximate to a module circuit board end of the module circuit board that is adjacent to the second end.
18 . The method of claim 13 , wherein the optical module comprises an optical receiving component or an optical sending component.
19 . The method of claim 13 , wherein the optical module comprises an optical transceiver component.
20 . The method of claim 13 , wherein the optical module comprises an optical forwarding component.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Patent Application No. PCT/CN2021/076107 filed on Feb. 8, 2021, which claims priority to Chinese Patent Application No. 202010242637.7 filed on Mar. 31, 2020. The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties. TECHNICAL FIELD This application relates to the field of optical communication technologies, and in particular, to an optoelectronic component, a network device, and a method for manufacturing the optoelectronic component. BACKGROUND An optoelectronic component is generally an integrated component used for optical-to-electrical conversion. For example, the optoelectronic component may convert an optical signal into an electrical signal, or convert an electrical signal into an optical signal, and plays an important role in the field of optical communication. The optoelectronic component may include an optical module, a host circuit board, and the like. A module circuit board of the optical module is electrically connected to the host circuit board. For example, golden fingers (also referred to as gold fingers) may be disposed on two opposite surfaces of the module circuit board, and a connector with conductive elastomers inside may be installed on the host circuit board. When the optical module is installed on the host circuit board, the module circuit board may be inserted into the connector, so that the golden fingers on the module circuit board are in contact with the conductive elastomers in the connector, and electrical connection is implemented. In a related technology, the connector on the host circuit board is high, and occupies high space of the optoelectronic component. SUMMARY Embodiments of this application provide an optoelectronic component, a network device, and a method for manufacturing the optoelectronic component, to overcome problems of a related technology. The technical solutions are as follows. In one aspect, an optoelectronic component is provided, where the optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a golden finger, where the golden finger is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the golden finger, where the conductive elastomer is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the golden finger is in contact with the conductive elastomer. The golden finger includes many golden-yellow conductive contact sheets, and the conductive elastomer may be a metal sheet with a thin thickness, for example, may be a thin copper sheet. In some embodiments, the optical module may be installed on the host circuit board, and the first surface of the module circuit board of the optical module is close to the first surface of the host circuit board. For example, the first surface of the module circuit board is in contact with the first surface of the host circuit board. The golden finger on the module circuit board is in contact with the conductive elastomer on the host circuit board, to implement electrical connection between the optical module and the host circuit board. The golden finger on the module circuit board is disposed on one surface of the module circuit board instead of two opposite surfaces of the module circuit board. In this way, the conductive elastomer in contact with the golden finger is also disposed on one surface of the host circuit board. Therefore, the conductive elastomer is located only on one side of the module circuit board, and is not located on two sides of the module circuit board. Therefore, height space occupied by the conductive elastomer is small. Because the height space occupied by the conductive elastomer is small, some space is available for installing another component, or may be used to dispose an air duct, or the like. In an example, the height space occupied by the conductive elastomer is small, so that an air duct that passes through a first end and an opposite second end of the optical module may be formed. The air duct that passes through the first end and the second end of the optical module is formed, and convection is formed. This helps enhance a heat dissipation effect of the optical module. In an example, the height space occupied by the conductive elastomer is small, so that a side that is of the optical module and that is away from the module circuit board may be used as expansion space for installing another component during subsequent expansion. In comparison with installing another component at an end of the optical module, installing another component on one side of the optical module is more helpful for heat dissipation. This is beca