US-12620771-B2 - Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

Abstract

In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.

Inventors

• Tobias Gebuhr
• Jan Seidenfaden

Assignees

• AMS-OSRAM INTERNATIONAL GMBH

Dates

Publication Date

20260505

Application Date

20210527

Priority Date

20200528

Claims (20)

1. 1 . An optoelectronic semiconductor component comprising: a lead frame having a first mounting surface; a semiconductor chip arranged on the first mounting surface and having an emission surface; an optical element; and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.
2. 2 . The optoelectronic semiconductor component according to claim 1 , wherein the molded body comprises a cavity, which extends to the first mounting surface and in which the semiconductor chip is arranged.
3. 3 . The optoelectronic semiconductor component according to claim 2 , wherein a side surface of the cavity is an alignment surface.
4. 4 . The optoelectronic semiconductor component according to claim 3 , wherein the optical element is in direct contact with both the alignment surface and the emission surface, or both the alignment surface and the first mounting surface.
5. 5 . The optoelectronic semiconductor component according to claim 2 , wherein the cavity is filled with a potting compound.
6. 6 . The optoelectronic semiconductor component according to claim 5 , wherein the potting compound is flush with an upper edge of the cavity.
7. 7 . The optoelectronic semiconductor component according to claim 1 , wherein the optical element is bonded to the optoelectronic semiconductor component by an adhesive layer on the first mounting surface or the alignment surface or at least one lateral mounting surface.
8. 8 . The optoelectronic semiconductor component according to claim 1 , wherein the optical element is configured to cause the radiation axis to be deflected through an angle of at least 85° and at most 95°.
9. 9 . The optoelectronic semiconductor component according to claim 1 , wherein the alignment surface includes an angle of at least 130° and at most 140° with the first mounting surface.
10. 10 . The optoelectronic semiconductor component according to claim 1 , wherein the lead frame has a second mounting surface opposite the first mounting surface, which is free of material of the molded body.
11. 11 . A method for producing an optoelectronic semiconductor component, the method comprising: providing a lead frame having a first mounting surface; forming a molded body to the lead frame such that an alignment surface is formed transverse to the first mounting surface; mounting a semiconductor chip on the first mounting surface; and arranging an optical element on the alignment surface, wherein the alignment surface is brought into direct contact with the optical element and the optical element is aligned with respect to the semiconductor chip based on the alignment surface, and wherein the optical element is brought in direct contact with an emission surface, or wherein the optical element is brought in direct contact with the first mounting surface and wherein a radiation-transmissive encapsulation compound is arranged between the emission surface and the optical element.
12. 12 . The method according to claim 11 , further comprising forming a cavity in the molded body extending to the first mounting surface, wherein the semiconductor chip is mounted in the cavity.
13. 13 . The method according to claim 12 , further comprising filling the cavity with a potting compound by jetting or dispensing.
14. 14 . The method according to claim 11 , wherein forming the molded body comprises forming the molded body by a transfer molding process.
15. 15 . The method according to claim 11 , further comprising, after forming the molded body, performing a chemical and/or mechanical cleaning to remove residues of the molded body from the first mounting surface.
16. 16 . The method according to claim 11 , wherein the semiconductor chip is mounted by bonding, sintering or soldering.
17. 17 . The method according to claim 11 , wherein the method is performed in a wafer compound on a plurality of optoelectronic semiconductor components.
18. 18 . The method according to claim 17 , further comprising, after completion of all method steps, separating the optoelectronic semiconductor components by sawing or laser separating.
19. 19 . The method according to claim 11 , wherein the lead frame has a second mounting surface opposite the first mounting surface, and wherein the molded body is formed to the lead frame such that the second mounting surface remains free of material of the molded body.
20. 20 . An optoelectronic semiconductor component comprising: a lead frame having a first mounting surface; a semiconductor chip arranged on the first mounting surface and having an emission surface; an optical element; and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which being parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is arranged at the lead frame and has an alignment surface transverse to the first mounting surface, wherein the optical element and the alignment surface are in direct contact with each other, and wherein the optical element is in direct contact with the emission surface, or wherein the optical element is in direct contact with the first mounting surface and a radiation-transmissive encapsulation compound is arranged between the emission surface and the optical element.

Description

This patent application is a national phase filing under section 371 of PCT/EP2021/064201, filed May 27, 2021, which claims the priority of German patent application 102020114371.0, filed May 28, 2020, each of which is incorporated herein by reference in its entirety. TECHNICAL FIELD An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In particular, the optoelectronic semiconductor component is intended to generate electromagnetic radiation, for example light that is perceptible to the human eye. SUMMARY Embodiments provide an optoelectronic semiconductor component that exhibits improved efficiency. Further embodiments provide a method for producing an optoelectronic semiconductor component that enables simplified production. According to at least one embodiment, the optoelectronic semiconductor component comprises a lead frame having a first mounting surface. The lead frame is preferably formed with an electrically conductive material. For example, the lead frame is formed with copper, in particular with highly etched copper, with a NiPdAu coating or a NiAg coating. The mounting surface is preferably a main surface of the lead frame and is provided for mounting further components on the lead frame. According to at least one embodiment, the optoelectronic semiconductor component comprises a semiconductor chip with an emission surface arranged on the first mounting surface. In particular, the semiconductor chip comprises an active region having a pn junction, a double heterostructure, a single quantum well (SQW) structure or a multiple quantum well (MQW) structure for radiation generation. The semiconductor chip is preferably a laser diode or a light emitting diode. The emission surface of the semiconductor chip is provided for coupling out at least a portion of the electromagnetic radiation generated in the semiconductor chip during operation. For example, the semiconductor chip is an edge-emitting device that emits electromagnetic radiation through one of its side surfaces that is arranged transverse to the main extension direction. According to at least one embodiment, the optoelectronic semiconductor component comprises an optical element. The optical element is formed with a radiation transmitting material. Preferably, the optical element is arranged to deflect or shape a beam of an electromagnetic radiation. For example, the optical element is a prism or a lens. The optical element comprises, for example, an output-coupling surface through which at least a portion of the electromagnetic radiation coupled into the optical element is coupled out. In particular, the optical element comprises a lateral mounting surface oriented transversely, preferably perpendicularly, to the output-coupling surface. For example, the optical element comprises two lateral mounting surfaces aligned parallel to each other, which laterally limit the lateral extent of the optical element. According to at least one embodiment of the optoelectronic semiconductor component, the optoelectronic semiconductor component comprises a molded body. In particular, the molded body is formed with a plastic material. For example, the molded body is formed with an epoxy or silicone compound. Epoxy and silicone materials are particularly easy to process and sufficiently resistant to external environmental influences such as moisture or oxygen. Preferably, the material of the molded body is designed to be impermeable to radiation. The molded body is, for example, a mechanically supporting part of the optoelectronic semiconductor component and thus contributes to increasing the mechanical stability of the optoelectronic semiconductor component. According to at least one embodiment of the optoelectronic semiconductor component, the optical element has an input-coupling surface that is aligned transversely to the first mounting surface. In particular, the input-coupling surface is arranged for coupling electromagnetic radiation from the semiconductor chip into the optical element. Preferably, the input-coupling surface is oriented perpendicular to the first mounting surface. The terms “perpendicular” and “parallel” are to be understood here and in the following as perpendicular or parallel within the scope of a manufacturing tolerance. Minor deviations are tolerable within the manufacturing tolerances. According to at least one embodiment of the optoelectronic semiconductor component, the semiconductor chip is arranged to emit electromagnetic radiation through the emission surface whose radiation axis is parallel to the first mounting surface. The electromagnetic radiation propagates, for example, in the form of a radiation cone. In case of doubt, the radiation axis of the electromagnetic radiation is the axis of the radiation cone. Advantageously, this enables particularly simple mounting of a semiconductor chip designed as an edge-emitting laser diode. According to at least