US-12620775-B2 - Electronic component and method for mounting an electronic component

US12620775B2US 12620775 B2US12620775 B2US 12620775B2US-12620775-B2

Abstract

The invention relates to a component comprising: a semiconductor chip; a casing material which at least partially surrounds the semiconductor chip; a protective layer which is formed with a material that is different from the casing material; wherein a side of the casing material facing away from the semiconductor chip is covered by the protective layer at least in places. The invention also relates to a method for assembling an electronic component.

Inventors

Andreas Fröhlich
Jens Eberhard

Assignees

OSRAM OPTO SEMICONDUCTORS GMBH

Dates

Publication Date: 20260505
Application Date: 20200319
Priority Date: 20190411

Claims (14)

1 . An electronic component which is an edge-emitting semiconductor laser component comprising: an edge-emitting semiconductor chip, a coating material which at least partially surrounds the semiconductor chip, a radiation exit surface being parallel to a radiation passing surface of the semiconductor chip, a protective layer which is formed with a material which is different from the coating material, wherein a side of the coating material facing away from the semiconductor chip is covered at least in places by the protective layer, the protective layer partially or completely covers the radiation exit surface, the protective layer runs transversely or perpendicularly to a bottom side of the semiconductor chip, and in which the protective layer is soluble in a polar solvent and the protective layer comprises a water-soluble polymer.
2 . The electronic component according to claim 1 , in which the water-soluble polymer comprises a polyvinyl alcohol or consists of a polyvinyl alcohol.
3 . The electronic component according to claim 1 , in which the coating material comprises a silicone or consists of a silicone.
4 . The electronic component according to claim 1 , in which the protective layer is in direct contact with the coating material.
5 . The electronic component according to claim 1 , in which the coating material forms a chemical bond with the protective layer.
6 . The electronic component according to claim 1 , in which an intermediate layer and/or a cover layer is arranged on the side of the protective layer facing away from the semiconductor chip.
7 . The electronic component according to claim 6 , in which the intermediate layer comprises a water-soluble adhesive material.
8 . The electronic component according to claim 1 , in which the semiconductor chip emits electromagnetic radiation of a wavelength range in the infrared range during operation.
9 . A method for mounting an electronic component comprising: A) providing the electronic component according to claim 1 , B) placing the electronic component on a carrier, and C) removing the protective layer.
10 . The method according to claim 9 , wherein the providing of the electronic component comprises the following steps: providing the semiconductor chip, surrounding the semiconductor chip at least in places with the coating material, and applying the protective layer at least in places on the coating material.
11 . The method according to claim 9 , in which the carrier comprises a printed circuit board.
12 . The method according to claim 9 , wherein the removal of the protective layer being carried out in a solvent bath.
13 . An electronic component which is an edge-emitting semiconductor laser component comprising: a semiconductor chip; a coating material which at least partially surrounds the semiconductor chip, wherein five sides of the semiconductor chip are surrounded by the coating material; a radiation exit surface; a protective layer which is formed with a material which is different from the coating material; wherein: a side of the coating material facing away from the semiconductor chip is covered at least in places by the protective layer; the protective layer partially or completely covers the radiation exit surface, and the protective layer is additionally arranged on a top surface of the electronic component that faces the semiconductor chip.
14 . An electronic component which is an edge-emitting semiconductor laser component comprising: an edge-emitting semiconductor chip, a coating material which at least partially surrounds the semiconductor chip, a radiation exit surface being parallel to a radiation passing surface of the semiconductor chip, a protective layer which is formed with a material which is different from the coating material, wherein a side of the coating material facing away from the semiconductor chip is covered at least in places by the protective layer, the protective layer partially or completely covers the radiation exit surface, and the protective layer partially or completely covers the radiation exit surface, and the protective layer comprises a thickness between at least 0.030 millimeter and at most 0.035 millimeter.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This patent application is a national stage entry from International Application No. PCT/EP2020/057681, filed on Mar. 19, 2020, published as International Publication No. WO 2020/207752 A1 on Oct. 15, 2020, and claims priority under 35 U.S.C. § 119 from German patent application 10 2019 109 586.7, filed Apr. 11, 2019, the entire contents of all of which are incorporated by reference herein. FIELD An electronic component is specified. In addition, a method for mounting an electronic component is specified. BACKGROUND One task to be solved is to specify an improved electronic component. Another problem to be solved is to provide a method for mounting an electronic component. SUMMARY An electronic component is specified. For example, the electronic component may be an integrated circuit, a transistor, a memory element, a resistor, or an optoelectronic component. For example, the optoelectronic component is a semiconductor laser component, a light emitting diode, an optical amplifier, or a photodiode. Semiconductor laser components can, for example, be realized in so-called TO designs (TO: “transistor outline”). In this case, a compact TO metal package is common. The compact TO metal package is essentially made of steel or copper. According to at least one embodiment, the electronic component comprises a semiconductor chip. The semiconductor chip is, for example, an electronic semiconductor chip. For example, the semiconductor chip is an optoelectronic semiconductor chip. The optoelectronic semiconductor chip, such as a light-emitting diode chip, a photodiode chip, and/or a laser diode chip, has an epitaxially grown semiconductor layer sequence with an active region adapted to detect or generate electromagnetic radiation. In operation, the optoelectronic semiconductor chip can emit and/or receive electromagnetic radiation from a wavelength range of UV radiation, blue light and/or in the infrared range, for example. According to at least one embodiment, the electronic component comprises a coating material that at least partially surrounds the semiconductor chip. That is, the semiconductor chip is at least partially surrounded by the coating material and is thus protected from external mechanical or chemical influences. Alternatively or additionally, the coating material may serve as a matrix material for a phosphor material for forming a conversion layer. The phosphor material is then provided to absorb the emitted electromagnetic radiation of the semiconductor chip and convert it into another electromagnetic radiation. The emitted electromagnetic radiation of the semiconductor chip is then different from the emitted further electromagnetic radiation of the phosphor material. The coating material is preferably translucent or clear transparent to electromagnetic radiation, for example visible light. Preferably, the coating material is formed from a polymer. For example, the coating material may comprise an epoxy resin or a silicone or consist of an epoxy resin or a silicone. According to at least one embodiment, the electronic component comprises a protective layer formed with a material that is different from the coating material. Preferably, the protective layer comprises as a material a polymer that is different from the polymer of the coating material. The material of the protective layer comprises different chemical and physical properties compared to the coating material. For example, the materials exhibit different solubility in different solvents and/or the materials exhibit different temperature stability. The protective layer is preferably intended to protect the coating material from environmental influences, such as contaminants and particles. Preferably, the protective layer can be removed from the coating material without leaving any residue. This can mean, for example, that when the protective layer is removed, it can be removed completely without leaving residues on the surface to which the protective layer was applied before removal. For example, the protective layer comprises a thickness between at least 0.01 millimeter and at most 0.1 millimeter. Preferably, the protective layer comprises a thickness of between at least 0.015 millimeter and at most 0.08 millimeter. A protective layer that is too thin would result in insufficient protection of the coating material against environmental influences such as contamination, and a protective layer that is too thick would result in poorer removability of the protective layer. According to at least one further embodiment, the electronic component comprises a side of the coating material facing away from the semiconductor chip which is covered at least in places by the protective layer. The protective layer may completely or locally cover the side of the coating material facing away from the semiconductor chip. The protective layer may be applied as a layer and/or as a foil. Furthermore, the protective layer may p