US-12620963-B2 - Vibration device

US12620963B2US 12620963 B2US12620963 B2US 12620963B2US-12620963-B2

Abstract

A vibration device includes a vibration element; a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base, and a resin layer disposed at the outer surface of the package.

Inventors

Akihiro Murata

Assignees

SEIKO EPSON CORPORATION

Dates

Publication Date: 20260505
Application Date: 20220425
Priority Date: 20210426

Claims (9)

1 . A vibration device comprising: a vibration element; a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base; and a resin layer disposed at an outer surface of the package, wherein the base and the lid are directly bonded to each other via a metal layer, in a plan view, an outer edge of the metal layer is located inside an outer edge of the base and an outer edge of the lid, and the resin layer is disposed in a gap formed between the base and the lid by the metal layer, and the resin layer is disposed at the outer edge of a side surface connecting the first surface and the second surface of the package has a flat surface at a portion corresponding to the gap.
2 . The vibration device according to claim 1 , wherein the resin layer is disposed so as to cover corners of the package.
3 . The vibration device according to claim 1 , wherein the resin layer has insulating properties.
4 . The vibration device according to claim 1 , wherein the base and the lid are coupled to fixed potential.
5 . The vibration device according to claim 1 , wherein the resin layer covers a portion where the base and the lid are bonded to each other.
6 . The vibration device according to claim 1 , wherein the oscillation circuit is disposed at the second surface of the base.
7 . The vibration device according to claim 1 , wherein the oscillation circuit is disposed at the first surface of the base.
8 . The vibration device according to claim 1 , wherein the metal layer is not directly electrically connected to the vibration element, the metal layer is electrically connected to each of the base and the lid, and the metal layer is electrically connected to a fixed potential.
9 . The vibration device according to claim 1 , wherein a side surface of the resin layer is flush with a side surface of the base located below a step of the base.

Description

The present application is based on, and claims priority from JP Application Serial Number 2021-074355, filed Apr. 26, 2021, the disclosure of which is hereby incorporated by reference herein in its entirety. BACKGROUND 1. Technical Field The present disclosure relates to a vibration device. 2. Related Art The piezoelectric vibrator described in JP-A-2010-081415 includes a recessed package, a piezoelectric vibration piece bonded to the bottom of the package, and a lid member that hermetically seals the package. The package and the lid member are bonded to each other, for example, by surface activation bonding. The package and the lid member are each formed, for example, of a silicon substrate, and an oscillation circuit and other components are formed at the surface of the silicon substrate that forms the package. In the piezoelectric vibrator described in JP-A-2010-081415, however, the package and the lid members are each formed of a silicon substrate and therefore more brittle, for example, than a ceramic package and more easily damaged by impact produced, for example, when the piezoelectric vibrator is dropped. SUMMARY A vibration device according to an aspect of the present disclosure includes a vibration element; a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base; and a resin layer disposed at an outer surface of the package. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a vibration device according to a first embodiment taken along the line A-A in FIG. 2. FIG. 2 is a plan view showing the upper surface of a base. FIG. 3 is a step diagram showing the steps of manufacturing the vibration device. FIG. 4 is a cross-sectional view for describing a method for manufacturing the vibration device. FIG. 5 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 6 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 7 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 8 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 9 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 10 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 11 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 12 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 13 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 14 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 15 is a cross-sectional view showing the vibration device according to a second embodiment. FIG. 16 is a step diagram showing the steps of manufacturing the vibration device. FIG. 17 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 18 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 19 is a cross-sectional view for describing the method for manufacturing the vibration device. FIG. 20 is a cross-sectional view showing the vibration device according to a third embodiment. FIG. 21 is a cross-sectional view showing the vibration device according to a fourth embodiment. DESCRIPTION OF EXEMPLARY EMBODIMENTS Preferable embodiments of a vibration device will be described below with reference to the accompanying drawings. The upper side in FIG. 1, FIGS. 4 to 15, and FIGS. 17 to 21 is also called “above”, and the lower side in the figures is also called “below” for convenience of description. In this case, in FIG. 2, the near side of the plane of view is “above”, and the far side of the plane of view is “below”. First Embodiment FIG. 1 is a cross-sectional view showing a vibration device according to a first embodiment taken along the line A-A in FIG. 2. FIG. 2 is a plan view showing the upper surface of a base. FIG. 3 is a step diagram showing the steps of manufacturing the vibration device. FIGS. 4 to 14 are cross-sectional views for describing a method for manufacturing the vibration device. A vibration device 1 shown in FIG. 1 includes a package 10 having an airtight housing S, a vibration element 4 accommodated in the housing S, and a resin layer 9 disposed at part of the outer surface of the package 10. The package 10 includes a base 2, to which the vibration element 4 is bonded via a pair of metal bumps 81 and 82, and a lid 3, which