US-12620973-B2 - Radio frequency module and communication device

Abstract

Degradation of characteristics is to be reduced. A hybrid filter of a radio frequency module includes an acoustic wave filter and a first circuit. A plurality of circuit elements of the first circuit include a plurality of inductors and a plurality of capacitors. A second input/output portion of the acoustic wave filter includes a first connection terminal, a second connection terminal, and a conductor portion. A second circuit of the first circuit is connected between the first connection terminal and a ground terminal and includes at least one circuit element. A third circuit of the first circuit is connected between the second connection terminal and a second signal terminal and includes at least one inductor among the plurality of inductors and at least one capacitor among the plurality of capacitors.

Inventors

• Masanori Kato
• Syunsuke KIDO

Assignees

• MURATA MANUFACTURING CO., LTD.

Dates

Publication Date

20260505

Application Date

20230926

Priority Date

20210331

Claims (18)

1. 1 . A radio frequency module comprising: a mounting substrate having a first main surface and a second main surface opposed to each other; a first signal terminal, a second signal terminal, and a ground terminal that are on the mounting substrate; and a hybrid filter, wherein the hybrid filter comprises: an acoustic wave filter comprising at least one acoustic wave resonator, a first input/output portion connected to the first signal terminal, and a second input/output portion connected to the second signal terminal; and a first circuit comprising a plurality of circuit elements, and connected to the second input/output portion of the acoustic wave filter, wherein the plurality of circuit elements comprises: a plurality of inductors; and a plurality of capacitors, wherein the hybrid filter has a wider pass band than the acoustic wave resonator, wherein the second input/output portion of the acoustic wave filter comprises: a first connection terminal connected to the mounting substrate; a second connection terminal located apart from the first connection terminal in a plan view in a thickness direction of the mounting substrate, and connected to the mounting substrate; and a conductor portion connecting the first connection terminal and the second connection terminal, and wherein the first circuit comprises: a second circuit connected between the first connection terminal and the ground terminal, and comprising at least a first one of the plurality of inductors or a first one of the plurality of capacitors; and a third circuit connected between the second connection terminal and the second signal terminal, and comprising at least a second one of the plurality of inductors and at least a second one of the plurality of capacitors.
2. 2 . The radio frequency module according to claim 1 , further comprising: a third signal terminal on the mounting substrate; and a second filter connected between the first signal terminal and the third signal terminal, the second filter being different from the hybrid filter.
3. 3 . The radio frequency module according to claim 2 , wherein the second filter comprises a second acoustic wave filter comprising a second acoustic wave resonator different from the acoustic wave resonator of the acoustic wave filter, wherein the first acoustic wave filter comprises a first substrate, wherein the second acoustic wave filter comprises a second substrate, and wherein the first substrate and the second substrate are identical to each other.
4. 4 . The radio frequency module according to claim 3 , wherein the first acoustic wave filter is configured to pass a transmission signal in a first communication band, and wherein the second acoustic wave filter is configured to pass a transmission signal in a second communication band.
5. 5 . The radio frequency module according to claim 2 , wherein in the plan view, the acoustic wave filter is closer to the plurality of circuit elements than the second filter.
6. 6 . The radio frequency module according to claim 1 , wherein the first connection terminal and the second connection terminal are adjacent to each other in the plan view.
7. 7 . The radio frequency module according to claim 1 , wherein the second one of the plurality of inductors is connected to the acoustic wave filter without any of the plurality of capacitors interposed therebetween.
8. 8 . The radio frequency module according to claim 1 , wherein in the plan view, the acoustic wave filter overlaps at least one of the plurality of circuit elements that is directly connected to the acoustic wave filter in the third circuit.
9. 9 . The radio frequency module according to claim 1 , wherein on the first main surface of the mounting substrate, the acoustic wave filter is adjacent to at least one of the plurality of circuit elements that is directly connected to the acoustic wave filter in the third circuit.
10. 10 . The radio frequency module according to claim 1 , wherein the third circuit comprises a parallel circuit comprising the second one of the plurality of inductors and the second one of the plurality of capacitors.
11. 11 . A communication device comprising: the radio frequency module according to claim 1 ; and a signal processing circuit configured to perform signal processing on a radio frequency signal passing through the radio frequency module.
12. 12 . A radio frequency module comprising: a mounting substrate having a first main surface and a second main surface opposed to each other; a first signal terminal, a second signal terminal, and a ground terminal that are on the mounting substrate; and a hybrid filter, wherein the hybrid filter comprises: an acoustic wave filter comprising at least one acoustic wave resonator, a first input/output portion connected to the first signal terminal, and a second input/output portion connected to the second signal terminal; and a first circuit comprising a plurality of circuit elements, and connected to the first input/output portion of the acoustic wave filter, wherein the plurality of circuit elements comprises: a plurality of inductors; and a plurality of capacitors, wherein the hybrid filter has a wider pass band than the acoustic wave resonator, wherein the first input/output portion of the acoustic wave filter comprises: a first connection terminal connected to the mounting substrate; a second connection terminal located apart from the first connection terminal in a plan view in a thickness direction of the mounting substrate and connected to the mounting substrate; and a conductor portion connecting the first connection terminal and the second connection terminal, and wherein the first circuit comprises: a second circuit connected between the first connection terminal and the ground terminal, and comprising at least a first one of the plurality of inductors or a first one of the plurality of capacitors, and a third circuit connected between the second connection terminal and the first signal terminal, and comprising at least a second one of the plurality of inductors and at least a second one of the plurality of capacitors.
13. 13 . The radio frequency module according to claim 12 , further comprising: a third signal terminal on the mounting substrate; and a second filter connected between the first signal terminal and the third signal terminal, the second filter being different from the hybrid filter.
14. 14 . The radio frequency module according to claim 13 , wherein the second filter comprises a second acoustic wave filter comprising a second acoustic wave resonator different from the acoustic wave resonator of the acoustic wave filter, wherein the first acoustic wave filter comprises a first substrate, wherein the second acoustic wave filter comprises a second substrate, and wherein the first substrate and the second substrate are identical to each other.
15. 15 . The radio frequency module according to claim 14 , wherein the first acoustic wave filter is configured to pass a transmission signal in a first communication band, and wherein the second acoustic wave filter is configured to pass a transmission signal in a second communication band.
16. 16 . The radio frequency module according to claim 13 , wherein in the plan view, the acoustic wave filter is closer to the plurality of circuit elements than the second filter.
17. 17 . The radio frequency module according to claim 12 , wherein the first connection terminal and the second connection terminal are adjacent to each other in the plan view.
18. 18 . A communication device comprising: the radio frequency module according to claim 12 ; and a signal processing circuit configured to perform signal processing on a radio frequency signal passing through the radio frequency module.

Description

CROSS REFERENCE TO RELATED APPLICATION This is a continuation of International Application No. PCT/JP2022/014141 filed on Mar. 24, 2022 which claims priority from Japanese Patent Application No. 2021-061276 filed on Mar. 31, 2021. The contents of these applications are incorporated herein by reference in their entireties. BACKGROUND OF THE DISCLOSURE Field of the Disclosure The present disclosure generally relates to a radio frequency module and a communication device, and more specifically relates to a radio frequency module including a hybrid filter and a communication device including the radio frequency module. Description of the Related Art Patent Document 1 discloses a hybrid acoustic wave LC filter (hybrid filter) including an acoustic wave resonator and a plurality of circuit elements. The plurality of circuit elements include a plurality of inductors and a plurality of capacitors. The plurality of inductors and the plurality of capacitors are outside the die of the acoustic wave resonator. Patent Document 1: Japanese Unexamined Patent Application Publication No. 2020-14204 BRIEF SUMMARY OF THE DISCLOSURE In a radio frequency module including the hybrid acoustic wave filter disclosed in Patent Document 1, for example, the wiring length between an acoustic wave resonator and a circuit element (inductor or capacitor) is long, which may degrade the characteristics. A possible benefit of the present disclosure is to provide a radio frequency module and a communication device that are capable of reducing the degradation of the characteristics. A radio frequency module according to an aspect of the present disclosure includes a mounting substrate, a first signal terminal, a second signal terminal, a ground terminal, and a hybrid filter. The mounting substrate has a first main surface and a second main surface opposed to each other. The first signal terminal, the second signal terminal, and the ground terminal are disposed on the mounting substrate. The hybrid filter includes an acoustic wave filter and a first circuit. The acoustic wave filter includes at least one acoustic wave resonator, a first input/output portion connected to the first signal terminal, and a second input/output portion connected to the second signal terminal. The first circuit includes a plurality of circuit elements and is connected to the second input/output portion of the acoustic wave filter. The plurality of circuit elements include a plurality of inductors and a plurality of capacitors. The hybrid filter has a larger pass band width than the acoustic wave resonator. The second input/output portion of the acoustic wave filter includes a first connection terminal, a second connection terminal, and a conductor portion. The first connection terminal is connected to the mounting substrate. The second connection terminal is located apart from the first connection terminal in plan view in a thickness direction of the mounting substrate and is connected to the mounting substrate. The conductor portion connects the first connection terminal and the second connection terminal. The first circuit includes a second circuit and a third circuit. The second circuit is connected between the first connection terminal and the ground terminal. The second circuit includes at least one circuit element among the plurality of inductors and the plurality of capacitors. The third circuit is connected between the second connection terminal and the second signal terminal. The third circuit includes at least one inductor among the plurality of inductors and at least one capacitor among the plurality of capacitors. A radio frequency module according to an aspect of the present disclosure includes a mounting substrate, a first signal terminal, a second signal terminal, a ground terminal, and a hybrid filter. The mounting substrate has a first main surface and a second main surface opposed to each other. The first signal terminal, the second signal terminal, and the ground terminal are disposed on the mounting substrate. The hybrid filter includes an acoustic wave filter and a first circuit. The acoustic wave filter includes at least one acoustic wave resonator, a first input/output portion connected to the first signal terminal, and a second input/output portion connected to the second signal terminal. The first circuit includes a plurality of circuit elements and is connected to the first input/output portion of the acoustic wave filter. The plurality of circuit elements include a plurality of inductors and a plurality of capacitors. The hybrid filter has a larger pass band width than the acoustic wave resonator. The first input/output portion of the acoustic wave filter includes a first connection terminal, a second connection terminal, and a conductor portion. The first connection terminal is connected to the mounting substrate. The second connection terminal is located apart from the first connection terminal in plan view in a thickness direction of the