US-12621056-B2 - Optical module

US12621056B2US 12621056 B2US12621056 B2US 12621056B2US-12621056-B2

Abstract

Provided is an optical module including a circuit board and an optical transceiver device. The circuit board is provided with a mounting hole and a data processor. The optical transceiver device is mounted on the circuit board and is electrically connected to the data processor. The optical transceiver device includes a mounting shell, a first cover member, a light emission component and a light reception component. The first cover member is disposed on the front surface of the circuit board. A laser assembly and a translation prism assembly of the light emission component are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole, and a light exiting direction of a light processing assembly of the light emission component forms a first preset angle with a light entering direction thereof in a plane parallel to the circuit board.

Inventors

Honghao ZHANG
Fei Liu
Wei Cui

Assignees

Hisense Broadband Multimedia Technologies Co., Ltd.

Dates

Publication Date: 20260505
Application Date: 20231228
Priority Date: 20220929

Claims (20)

1 . An optical module, comprising: a circuit board provided, on a front surface thereof, with a data processor and with a mounting hole; and an optical transceiver device mounted on the circuit board adjacent to the mounting hole and configured to be electrically connected to the data processor, wherein the optical transceiver device comprises: a first cover member mounted on the front surface of the circuit board; a mounting shell configured to be mounted, with a top surface thereof, on a back surface of the circuit board, a bottom surface of the mounting shell being provided with an accommodation cavity; a light emission component comprising a laser assembly, a translation prism assembly and a light processing assembly, wherein the laser assembly and the translation prism assembly are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole; emission light emitted from the laser assembly can be incident into the light processing assembly disposed on the first cover member after being reflected by the translation prism assembly; and the light processing assembly is connected to a fiber adapter via a fiber pigtail, and is configured such that a light exiting direction thereof forms a first preset angle with a light entering direction thereof within a plane parallel to the circuit board; and a light reception component that is disposed within the accommodation cavity of the mounting shell and is connected to the fiber adapter via another fiber pigtail.
2 . The optical module according to claim 1 , wherein the first cover member comprises a first sub-cover member and a second sub-cover member connected to each other at an angle equivalent to the first preset angle, a top surface of the first sub-cover member being protruded relative to a top surface of the second sub-cover member; and the first cover is mounted on the front surface of the circuit board in such a way that a bottom surface of the second sub-cover member is connected to the front surface of the circuit board, while the first sub-cover member extends along a length direction of the circuit board above the circuit board and is located between the second sub-cover member and the mounting hole.
3 . The optical module according to claim 2 , wherein the light processing assembly comprises: a wavelength division multiplexer disposed on a bottom surface of the first sub-cover member that faces towards the front surface of the circuit board and arranged to be corresponded to the translation prism assembly so as to composite several paths of emission light leaving the translation prism assembly into a composite light; an angle-turning prism disposed on the top surface of the first sub-cover member with a light entering surface of the angle-turning prism corresponding to a light output of the wavelength division multiplexer, the angle-turning prism being configured to reflect the composite light from the wavelength division multiplexer such that an angle formed between a light exiting direction of the angle-turning prism and a light entering direction thereof is equivalent to the first preset angle; a converging lens disposed on the top surface of the second sub-cover member and configured to convert light from the angle-turning prism into a converged light; and an optical coupler disposed on the top surface of the second sub-cover member and configured to couple the converged light to the fiber pigtail.
4 . The optical module according to claim 3 , wherein the top surface of the first sub-cover member is provided with a mounting recess with a through hole running through the first sub-cover member; and the angle-turning prism is disposed in the mounting recess such that the composite light from the wavelength division multiplexer can be incident to the angle-turning prism through the through hole.
5 . The optical module according to claim 2 , further comprising a second cover member configured to cover above the mounting hole and to engage with the first sub-cover member so as to package the laser assembly and the translation prism assembly located within the mounting hole of the circuit board.
6 . The optical module according to claim 4 , wherein the converging lens and the optical coupler are disposed in a mounting recess on the top surface of the second sub-cover member; and the optical module further comprises a third cover member configured to cover above the mounting recess of the first sub-cover member and the mounting recess of the second sub-cover member so as to package the light processing assembly together with the first sub-cover member and the second sub-cover member.
7 . The optical module according to claim 5 , wherein the second cover member comprises a cover portion and a first protruding side plate and a second protruding side plate connected with the cover portion, respectively, wherein the cover portion is configured to cover above the mounting hole, and the first protruding side plate and the second protruding side plate are configured such that the first sub-cover member is sandwiched therebetween.
8 . The optical module according to claim 2 , wherein the top surface of the mounting shell is provided with a groove recessed relative to the top surface of the mounting shell and a boss protruded relative to the top surface of the mounting shell; the laser assembly is disposed in the groove such that a wire bonding height of the laser assembly is on the same plane as the front surface of the circuit board; and the translation prism assembly is disposed on the boss.
9 . The optical module according to claim 8 , wherein the light emission component further comprises a collimating lens array in the groove, and the collimating lens array is arranged to be aligned with the laser assembly to convert the emission light from the laser assembly into a collimated light; and the translation prism assembly comprises a first set of translation prisms and a second set of translation prisms that are stacked with each other on the boss, the first set of translation prisms being arranged to align with the collimating lens array so as to reflect light from the collimating lens array, such that a reflected light from the first set of translation prisms is incident to the second set of translation prisms, and can be incident to the light processing assembly on the first cover member after being reflected by the second set of translation prisms.
10 . The optical module according to claim 9 , wherein the second set of translation prisms are disposed on the bottom surface of the first sub-cover member, or are disposed on the first set of translation prisms.
11 . The optical module according to claim 9 , wherein the light emission component further comprises a semiconductor cooler disposed in the groove of the mounting shell; and the laser assembly and the collimating lens array are disposed on a cooling surface of the semiconductor cooler.
12 . The optical module according to claim 1 , wherein the optical transceiver device comprises two sets of light emission components that are disposed in the groove in the top surface of the mounting shell, wherein the laser assembly of each set of light emission component comprises 4 lasers, and the two sets of light emission components are connected to the fiber adapter through two fiber pigtails; and the data processor comprises a digital signal processing chip electrically connected to a golden finger of the circuit board and configured to drive each laser to emit light.
13 . The optical module according to claim 12 , wherein the light reception component comprises: an optical coupler connected to the fiber adapter through said another fiber pigtail; a collimating lens configured to convert light from the optical coupler into a collimated light; a wavelength division demultiplexer configured to demultiplex the collimated light into four paths of light; a converging lens array configured to convert the four paths of light into four paths of converged light; and a reflecting prism configured to change propagation directions of the four paths of converged light from the converging lens such that the four paths of converged light are incident to a detector array disposed on the back surface of the circuit board.
14 . The optical module according to claim 13 , wherein the optical transceiver device comprises two sets of light reception components; the accommodation cavity in the bottom surface of the mounting shell comprises a first accommodation cavity and a second accommodation cavity having the same structure; and the two sets of light reception components are accommodated within the first accommodation cavity and the second accommodation cavity, respectively; and the circuit board comprises two sets of detector arrays for the two sets of light reception components, and the two sets of detector arrays are electrically connected to the data processor.
15 . The optical module according to claim 14 , further comprising a reception component-cover plate configured to cover above the bottom surface of the mounting shell and the back surface of the circuit board, so as to package the collimating lens, the wavelength division demultiplexer, the converging lens array, the reflecting prism and the detector array in combination with the mounting shell and the circuit board.
16 . An optical module, comprising: a circuit board provided, on a front surface thereof, with a first data processor and a second data processor, and with a mounting hole between the first data processor and the second data processor; a first optical transceiver device connected to an end of the circuit board in a plug-in manner and configured to be electrically connected to the first data processor; and a second optical transceiver device mounted on the circuit board adjacent to the mounting hole and configured to be electrically connected to the second data processor, wherein the second optical transceiver device comprises: a first cover member mounted on the front surface of the circuit board; a mounting shell configured to be mounted, with a top surface thereof, on a back surface of the circuit board, a bottom surface of the mounting shell being provided with an accommodation cavity; a light emission component comprising a laser assembly, a translation prism assembly, and a light processing assembly, wherein the laser assembly and the translation prism assembly are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole; emission light emitted from the laser assembly can be incident into the light processing assembly disposed on the first cover member after being reflected by the translation prism assembly; and the light processing assembly is connected to a fiber adapter via a fiber pigtail, and is configured such that a light exiting direction thereof forms a first preset angle with a light entering direction thereof within a plane parallel to the circuit board; and a light reception component that is disposed within the accommodation cavity of the mounting shell and is connected to the fiber adapter via another fiber pigtail.
17 . The optical module according to claim 16 , wherein the first cover member comprises a first sub-cover member and a second sub-cover member integrally formed, with an angle formed between the first sub-cover member and the second sub-cover member being equivalent to the first preset angle; and the first cover member is arranged on the circuit board in such a way that a bottom surface of the second sub-cover member is connected to the front surface of the circuit board, while the first sub-cover member extends along a length direction of the circuit board above the circuit board; and the top surface of the mounting shell is provided with a groove recessed relative to the top surface of the mounting shell and a boss protruded from the top surface of the mounting shell, wherein the laser assembly is disposed in the groove such that a wire bonding height of the laser assembly is on the same plane as the front surface of the circuit board, and the translation prism assembly is disposed on the boss.
18 . The optical module according to claim 17 , wherein the second optical transceiver device comprises two sets of light emission components disposed in the groove in the top surface of the mounting shell, and the laser assembly of each set of light emission component comprises 4 lasers; the second optical transceiver device comprises two sets of light reception components, the accommodation cavity in the bottom surface of the mounting shell comprises a first accommodation cavity and a second accommodation cavity having the same structure, and the two sets of light reception components are accommodated in the first accommodation cavity and the second accommodation cavity, respectively; and two sets of fiber pigtails connected from the fiber adapter are connected to the two sets of light emission components and the two sets of light reception components, respectively, after passing through a mounting shell of the first optical transceiver device.
19 . The optical module according to claim 18 , wherein one set of fiber pigtails of the two sets of fiber pigtails passes through the mounting shell of the first optical transceiver device from a front-surface side of the circuit board and are connected to the two sets of light emission components located at the front-surface side of the circuit board; and the other set of fiber pigtails passes through the mounting shell of the first optical transceiver device from a back-surface side of the circuit board and are connected to the two sets of light reception components located at the back-surface side of the circuit board.
20 . The optical module according to claim 18 , wherein the mounting shell of the first optical transceiver device comprises two cavities respectively located at the front-surface side and the back-surface side of the circuit board, to allow the two sets of fiber pigtails to pass through.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation application of PCT/CN2022/141868 which claims priority to Chinese patent application No. 202211203799.5, filed on Sep. 29, 2022, the entire disclosure of which are incorporated herein by reference. FIELD OF THE INVENTION The present disclosure relates to the technical field of optical communication, and in particular, to an optical module. BACKGROUND OF THE INVENTION With developments of new businesses and applications such as cloud computing, mobile Internet, and video, development and progress of optical communication technologies have become increasingly important. Moreover, in the optical communication technology, optical module is a tool for mutual conversion between an optical signal and an electrical signal, and is one of key components in an optical communication device. Moreover, with the development of the optical communication technology, it is desired that transmission rate of the optical module is increased continuously. SUMMARY OF THE INVENTION According to an exemplary embodiment of the present disclosure, an optical module is provided, which includes: a circuit board provided, on a front surface thereof, with a data processor and with a mounting hole; and an optical transceiver device mounted on the circuit board adjacent to the mounting hole and is configured to be electrically connected to the data processor. The optical transceiver device includes: a first cover member mounted on the front surface of the circuit board; a mounting shell configured to be mounted, with a top surface thereof, on a back surface of the circuit board, a bottom surface of the mounting shell being provided with an accommodation cavity; a light emission component comprising a laser assembly, a translation prism assembly, and a light processing assembly, wherein the laser assembly and the translation prism assembly are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole; emission light emitted from the laser assembly can be incident into the light processing assembly disposed on the first cover member after being reflected by the translation prism assembly; and the light processing assembly is connected to a fiber adapter via a fiber pigtail, and is configured such that a light exiting direction thereof forms a first preset angle with a light entering direction thereof within a plane parallel to the circuit board; and a light reception component that is disposed within the accommodation cavity of the mounting shell and is connected to the fiber adapter via another fiber pigtail. According to another exemplary embodiment of the present disclosure, an optical module is provided, including: a circuit board provided, on a front surface thereof, with a first data processor and a second data processor, and with a mounting hole between the first data processor and the second data processor; a first optical transceiver device connected to an end of the circuit board in a plug-in manner and is configured to be electrically connected to the first data processor; and a second optical transceiver device mounted on the circuit board adjacent to the mounting hole and configured to be electrically connected to the second data processor. The second optical transceiver device includes: a first cover member mounted on the front surface of the circuit board; a mounting shell configured to be mounted, with a top surface thereof, on a back surface of the circuit board, a bottom surface of the mounting shell being provided with an accommodation cavity; a light emission component comprising a laser assembly, a translation prism assembly, and a light processing assembly, wherein the laser assembly and the translation prism assembly are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole; emission light emitted from the laser assembly can be incident into the light processing assembly disposed on the first cover member after being reflected by the translation prism assembly; and the light processing assembly is connected to a fiber adapter via a fiber pigtail, and is configured such that a light exiting direction thereof forms a first preset angle with a light entering direction thereof within a plane parallel to the circuit board; and a light reception component that is disposed within the accommodation cavity of the mounting shell and is connected to the fiber adapter via another fiber pigtail. BRIEF DESCRIPTION OF THE DRAWINGS To illustrate the technical schemes of the present disclosure more clearly, drawings required for some embodiments of the present disclosure will be described briefly below. Apparently, these drawings as described below are merely drawings of some embodiments of the present disclosure, and other drawings may also be obtained by one of ordinary skills in the art from these drawings. FIG. 1 is a schematic diagram illustra