US-12621429-B2 - Test device and test system comprising same

US12621429B2US 12621429 B2US12621429 B2US 12621429B2US-12621429-B2

Abstract

A test device according to an embodiment includes a first substrate including a data conversion module having a first connector for receiving data acquired from an external equipment, an FPGA (Field Programmable Gate Array) for converting the received data, and a second connector for outputting the converted data; a second substrate including a test module including a third connector connected to the second connector of the first substrate and receiving the converted data, a test unit for performing a test operation using the data received through the third connector, a communication unit for transmitting test result information according to a test operation result of the test unit to an outside, and a control unit for controlling the test unit and the communication unit; and a housing for accommodating the first substrate and the second substrate.

Inventors

Sang Uk Kim
Min Yong CHOI
Dong Choon KIM

Assignees

LG INNOTEK CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20230627
Priority Date: 20220630

Claims (10)

1 . A test device comprising: a first substrate including a data conversion module having a first connector for receiving data acquired from an external equipment, an FPGA (Field Programmable Gate Array) for converting the received data, and a second connector for outputting the converted data; a second substrate having a test module including a third connector connected to the second connector of the first substrate and receiving the converted data, a test unit for performing a test operation using the data received through the third connector, a communication unit for transmitting test result information according to a test operation result of the test unit to an outside, and a control unit for controlling the test unit and the communication unit; and a housing for accommodating the first substrate and the second substrate, wherein if the communication unit is set as a slave, the test result information is transmitted to a first destination, and if the communication unit is set as a master, the test result information is transmitted to a second destination different from the first destination.
2 . The test device of claim 1 , wherein the first connector includes a MIPI (Mobile Industry Processor Interface), and wherein the second and third connectors include a PCIe (Peripheral Component Interconnect Express).
3 . The test device of claim 1 , wherein the second substrate is disposed on the first substrate, wherein the second substrate includes a port of the third connector disposed in an open region corresponding to the second connector, and wherein the port is connected to the second connector.
4 . The test device of claim 1 , wherein the communication unit is set as the slave, and wherein the communication unit of the second substrate transmits the test result information to a test device set as a master.
5 . The test device of claim 1 , wherein the communication unit is set as the master, and wherein the communication unit of the second substrate receives test result information transmitted from a test device set as a slave, collects the received test result information with the test result information according to the test operation result of the test unit, and transmits the collected test result information to a server.
6 . The test device of claim 5 , wherein the transmitted test result information includes identification information assigned to each test device and test judgment information according to test results performed on each test device.
7 . The test device of claim 1 , wherein the first substrate includes a first sub-substrate and a second sub-substrate, wherein the first sub-substrate includes the FPGA, and wherein the second sub-substrate includes a power connector disposed between the first sub-substrate and the second substrate.
8 . The test device of claim 7 , wherein the second sub-substrate further includes a strobe substrate, and wherein the strobe substrate includes a lighting device that irradiates light to a test subject.
9 . The test device of claim 4 , wherein the control unit obtains identification information and test judgment information according to the test operation result, and transmits the test result information including the identification information and the test judgement information to the test device set as the master.
10 . The test device of claim 5 , wherein the control unit acquires identification information and test judgment information according to the test operation result, acquires the test result information including the identification information and the test judgement information, receives the test result information including the identification information and the test judgment information transmitted from the test device set as the slave, and collects the acquired test result information and the received test result information and transmits the collected test result information to the server.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS This application is a U.S. National Stage Application under 35 U.S.C. § 371 of PCT Application No. PCT/KR2023/008909, filed Jun. 27, 2023, which claims priority to Korean Patent Application No. 10-2022-0080884, filed Jun. 30, 2022, whose entire disclosures are hereby incorporated by reference. TECHNICAL FIELD An embodiment relates to a test device, and more particularly to a test device comprising a frame grabber and a test device as a single module, and a test system including the same, and a test method thereof. BACKGROUND ART Recently, a test system for testing a quality of manufactured products has been provided. The test system is equipped with a frame grabber. The frame grabber is also referred to an image collection board or an image acquisition board. The frame grabber refers to a device that converts images from image media such as TV, video, and cameras into data that can be processed by a computer. The frame grabber is provided in various forms of boards depending on a computer environment. For example, the frame grabber can be provided in a form of ISA (Industry Standard Architecture), PCI (Peripheral Component Interconnect), PCIe (PCI Express), CPCI (Compact PCI) for industrial use, VME (Versa Module Europa), etc. The frame grabber receives a test image acquired through a camera and converts the image into data in a format that can be processed by the computer. Meanwhile, the computer is commonly connected to a plurality of frame grabbers. Then, the computer receives data converted from each of the plurality of frame grabbers. In addition, the computer performs a quality test on test images acquired through each camera using the received data. At this time, recent camera technology is developing, and accordingly, pixels of an image sensor equipped with the camera are increasing. Accordingly, a performance of the CPU and GPU equipped with the frame grabber is becoming more advanced. Accordingly, a data capacity acquired from each frame grabber is increasing, and accordingly, a data capacity that the computer must process is also increasing. Accordingly, the performance of the CPU equipped with the computer must be further improved, or a number of CPU cores must be increased, and accordingly, there is a problem that the cost required to configure the computer is increasing. Furthermore, as a number of semiconductor chips equipped with the computer increases, or the data capacity processed by the semiconductor chips increases, an amount of heat generated from the semiconductor chips is increasing. In addition, there is a problem that a heat dissipation structure equipped with the computer becomes complex and a volume of the heat dissipation structure increases depending on the amount of heat generated. In addition, even if the heat dissipation structure is equipped, it may not be able to dissipate all the heat generated from the computer, and accordingly, there is a problem that the performance of the computer is deteriorated. Accordingly, the computer is separating a distance between a plurality of semiconductor chips as much as possible in order to solve the problem of heat generation, and accordingly, there is a problem that a volume of the computer is further increased. In addition, the computer must process all data provided by multiple frame grabbers, which may increase the amount of data to be processed at a specific point in time, causing a bottleneck phenomenon. In addition, the bottleneck phenomenon may cause an overall performance of the computer to deteriorate. Accordingly, a test device is required that can more efficiently process test images acquired through a camera and improve accuracy of test results based on a processed data. DISCLOSURE Technical Problem An embodiment provides a test device, a test system, and a test method thereof capable of distributing processing data to a plurality of test devices. In addition, the embodiment provides a test device, a test system, and a test method thereof capable of minimizing an amount of heat generation. In addition, the embodiment provides a test device, a test system, and a test method thereof capable of minimizing data loss of a test image. In addition, the embodiment provides a test device, a test system, and a test method thereof capable of improving test accuracy. In addition, the embodiment provides a compact test device with improved circuit integration and a test system including the same. Technical problems to be solved by the proposed embodiments are not limited to the above-mentioned technical problems, and other technical problems not mentioned may be clearly understood by those skilled in the art to which the embodiments proposed from the following descriptions belong. Technical Solution A test device according to an embodiment comprises a first substrate including a data conversion module having a first connector for receiving data acquired from an external equipment, an FPGA (