US-12621929-B2 - Elastic interposer and conductive device thereof

US12621929B2US 12621929 B2US12621929 B2US 12621929B2US-12621929-B2

Abstract

The present disclosure provides an elastic interposer including a flexible substrate and a conductive device. The flexible substrate includes multiple circuits, of which first terminals are exposed on a first surface of the flexible substrate and show a first pattern, and of which second terminals are exposed on a second surface of the flexible substrate and show a second pattern different from the first pattern. The conductive device includes a first flexible conductive element and a second flexible conductive element. The first flexible conductive element is disposed on the first surface of the flexible substrate, and includes multiple first elastic conductive portions electrically connected to the first terminals of the circuits. The second flexible conductive element is disposed on the second surface of the flexible substrate, and includes multiple second elastic conductive portions electrically connected to the second terminals of the circuits.

Inventors

Choon Leong Lou
Ho-Yeh Chen

Assignees

XINGR TECHNOLOGIES (ZHEJIANG) LIMITED

Dates

Publication Date: 20260505
Application Date: 20231228
Priority Date: 20230928

Claims (16)

1 . An elastic interposer, comprising: a flexible substrate, comprising a plurality of circuits, wherein first terminals of the circuits are exposed on a first surface of the flexible substrate, second terminals of the circuits are exposed on a second surface of the flexible substrate, the first terminals of the circuits show a first pattern on the first surface, the second terminals of the circuits show a second pattern on the second surface, and the first pattern is different from the second pattern; and a conductive device, comprising: a first flexible conductive element, disposed on the first surface of the flexible substrate, comprising a plurality of first elastic conductive portions, wherein first terminals of the first elastic conductive portions are exposed on a third surface of the first flexible conductive element, and second terminals of the first elastic conductive portions are exposed on a fourth surface of the first flexible conductive element and are electrically connected to the first terminals of the circuits; and a second flexible conductive element, disposed on the second surface of the flexible substrate, comprising a plurality of second elastic conductive portions, wherein first terminals of the second elastic conductive portions are exposed on a fifth surface of the second flexible conductive element and are electrically connected to the second terminals of the circuits, and second terminals of the second elastic conductive portions are exposed on a sixth surface of the second flexible conductive element; wherein each of the first elastic conductive portions comprises a plurality of first metal particles, and each of the second elastic conductive portions comprises a plurality of second metal particles, wherein an average size of the first metal particles is different from an average size of the second metal particles.
2 . The elastic interposer of claim 1 , wherein a total contact area of electrical contacts between the first flexible conductive element and the first surface of the flexible substrate is less than a total contact area of electrical contacts between the second flexible conductive element and the second surface of the flexible substrate.
3 . The elastic interposer of claim 1 , wherein the second terminals of the first elastic conductive portions are configured to come into electrical contact with a plurality of contacts of an object under test, and the second terminals of the second elastic conductive portions are configured to come into electrical contact with a plurality of contacts of a hard substrate.
4 . The elastic interposer of claim 3 , wherein when the object under test comes into contact with the first terminals of the first elastic conductive portions, the flexible substrate, the first flexible conductive element and the second flexible conductive element are simultaneously deformed based on a force of contact with the object under test.
5 . The elastic interposer of claim 1 , wherein the first flexible conductive element is detachably fixed on the first surface of the flexible substrate, and the second flexible conductive element is detachably fixed on the second surface of the flexible substrate.
6 . The elastic interposer of claim 5 , further comprising a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the first flexible conductive element and the flexible substrate, and the second adhesive layer is disposed between the second flexible conductive element and the flexible substrate.
7 . The elastic interposer of claim 6 , wherein the first adhesive layer and the first flexible conductive element are integrally detached from the flexible substrate, and the second adhesive layer and the second flexible conductive element are integrally detached from the flexible substrate.
8 . The elastic interposer of claim 6 , wherein the first elastic conductive portions pass through the first adhesive layer so as to be electrically connected to the first terminals of the circuits, and the second elastic conductive portions pass through the second adhesive layer so as to be electrically connected to the second terminals of the circuits.
9 . The elastic interposer of claim 1 , wherein dimensions of the first flexible conductive element are different from dimensions of the second flexible conductive element.
10 . A conductive device of an elastic interposer, the conductive device comprising: a first flexible conductive element, disposed on a first surface of a flexible substrate, comprising: a first flexible body; and a plurality of first elastic conductive portions, disposed in the first flexible body, and configured to be electrically connected to first terminals of a plurality of circuits of the flexible substrate; and a second flexible conductive element, disposed on a second surface of the flexible substrate, comprising: a second flexible body; a plurality of second elastic conductive portions, disposed in the second flexible body, and configured to be electrically connected to second terminals of the circuits of the flexible substrate; wherein, the first terminals of the circuits are exposed on the first surface and show a first pattern, the second terminals of the circuits are exposed on the second surface and show a second pattern, and the first pattern is different from the second pattern; wherein each of the first elastic conductive portions comprises a plurality of first metal particles, and each of the second elastic conductive portions comprises a plurality of second metal particles, wherein an average size of the first metal particles is different from an average size of the second metal particles.
11 . The conductive device of claim 10 , wherein the first elastic conductive portions are disposed in the first flexible body, first terminals of the first elastic conductive portions are exposed on a third surface of the first flexible body, and second terminals of the first elastic conductive portions are exposed on a fourth surface of the first flexible body.
12 . The conductive device of claim 11 , wherein the second elastic conductive portions are disposed in the second flexible body, first terminals of the second elastic conductive portions are exposed on a fifth surface of the second flexible body, and second terminals of the second elastic conductive portions are exposed on a sixth surface of the second flexible body.
13 . The conductive device of claim 12 , wherein the second terminals of the first elastic conductive portions are configured to be electrically connected to the first terminals of the circuits of the flexible substrate, and the first terminals of the second elastic conductive portions are configured to be electrically connect to the second terminals of the circuits of the flexible substrate.
14 . The conductive device of claim 13 , wherein the second terminals of the first flexible conductive portions exposed on the fourth surface of the first flexible body show a third pattern on the fourth surface of the first flexible body, the first terminals of the second flexible conductive portions exposed on the fifth surface of the second flexible body show a fourth pattern on the fifth surface of the second flexible body, and the third pattern is different from the fourth pattern.
15 . The conductive device of claim 10 , wherein each of the first elastic conductive portions is shaped as a column in the first flexible body, and each of the second elastic conductive portions is shaped as a column in the second flexible body.
16 . The conductive device of claim 10 , wherein the first flexible conductive element and the second flexible conductive element are a conductive paste.

Description

CROSS REFERENCE TO RELATED APPLICATION This application claims priority of China patent application No. CN202311285157.9 filed on Sep. 28, 2023, which is incorporated by reference in its entirety. TECHNICAL FIELD The present disclosure relates to an elastic interposer and, more particularly, to a flexible elastic interposer and a conductive device thereof. DISCUSSION OF THE BACKGROUND Various integrated circuit chips need to undergo electrical testing during the process of manufacturing. When an object under test needs to undergo high-frequency signal testing, a test result is considered more reliable when an electrical path for signal transmission is shorter. In the prior art, space transformation substrates or pogo pins are frequently used for transmission of high-frequency test signals between the object under test and a circuit board. However, regarding the use of pogo pins, due to inherent mechanism properties of pogo pins, it is difficult to further reduce sizes such that a shorter signal transmission path can hardly be achieved. Moreover, for the use of space transformation substrates, due to manufacturing complications and cost considerations, it is similarly difficult to provide a shorter signal transmission path. In addition, since current space transformation substrates are mostly made of hard materials that provide limited resilience and flexibility, an object under test can be easily damaged when the space transformation substrates come into contact with the object under test. Accordingly, there is a need for a solution for a structure that provides a shorter signal transmission path and has high flexibility, so as to stably transmit high-frequency test signals between the object under test and a circuit board. The details of the “prior art” above describe merely background techniques, and are not to be construed as description for the subject matter of the present disclosure or the prior art of the present disclosure. In addition, the details of the “prior art” above are not to be considered as any part of the present application. SUMMARY In view of the above, it is an objective of the present disclosure to provide an elastic interposer with a shorter conductive path as well as high resilience and high flexibility. An embodiment of the disclosure provides an elastic interposer. The elastic interposer includes a flexible substrate and a conductive device. The flexible substrate includes a plurality of circuits. First terminals of the circuits are exposed on a first surface of the flexible substrate and second terminals of the circuits are exposed on a second surface of the flexible substrate. The first terminals of the circuits show a first pattern on the first surface, the second terminals of the circuits show a second pattern on the second surface, and the first pattern is different from the second pattern. The conductive device includes a first flexible conductive element and a second flexible conductive element. The first flexible conductive element is disposed on the first surface of the flexible substrate, and includes a plurality of first elastic conductive portions. First terminals of the first elastic conductive portions are exposed on a third surface of the first flexible conductive element, and second terminals of the first elastic conductive portions are exposed on a fourth surface of the first flexible conductive element and are electrically connected to the first terminals of the circuits. The second flexible conductive element is disposed on the second surface of the flexible substrate, and includes a plurality of second elastic conductive portions. First terminals of the second elastic conductive portions are exposed on a fifth surface of the second flexible conductive element and are electrically connected to the second terminals of the circuits, and second terminals of the second elastic conductive portions are exposed on a sixth surface of the second flexible conductive element. An embodiment of the disclosure provides a conductive device. The conductive device includes a first flexible conductive element and a second flexible conductive element. The first flexible conductive element is disposed on a first surface of a flexible substrate, and includes a first flexible body and a plurality of first elastic conductive portions. The first elastic conductive portions are disposed in the first flexible body, and are configured to be electrically connected to first terminals of a plurality of circuits of the flexible substrate. The second flexible conductive element is disposed on a second surface of the flexible substrate, and includes a second flexible body and a plurality of second elastic conductive portions. The second elastic conductive portions are disposed in the second flexible body, and are configured to be electrically connected to second terminals of a plurality of the circuits of the flexible substrate. The first terminals of the circuits are exposed on the first surfa