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US-12621935-B2 - Reel-to-reel circuit board manufacturing apparatus

US12621935B2US 12621935 B2US12621935 B2US 12621935B2US-12621935-B2

Abstract

A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller having a cylindrical shape, configured to rotate, and on which a substrate is wound; and a film body that is formed between the roller and the substrate to surround a surface of the roller and is rotatable, wherein the roller and the film body are separately rotated from each other.

Inventors

  • Chonghan PARK

Assignees

  • HAESUNG DS CO., LTD.

Dates

Publication Date
20260505
Application Date
20220914
Priority Date
20210930

Claims (12)

  1. 1 . A reel-to-reel circuit board manufacturing apparatus comprising: a reel-to-reel circuit board manufacturing roller having a cylindrical shape, configured to rotate, and on which a substrate is wound; and a film body that is formed between the reel-to-reel circuit board manufacturing roller and the substrate so as to surround, substantially enclosing in entirety, a surface of the reel-to-reel circuit board manufacturing roller, the film body being rotatable, wherein the reel-to-reel circuit board manufacturing roller and the film body are separately rotated from each other.
  2. 2 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , wherein a frictional force between the film body and the substrate is greater than a frictional force between the film body and the roller.
  3. 3 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , wherein the film body includes a thin plate film.
  4. 4 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , further comprising a coating portion coated on the surface of the roller.
  5. 5 . The reel-to-reel circuit board manufacturing apparatus of claim 4 , wherein the coating portion is between the roller and the film body and is integrally rotated along with the roller.
  6. 6 . The reel-to-reel circuit board manufacturing apparatus of claim 4 , wherein the coating portion includes a fluoride-based release coating agent.
  7. 7 . The reel-to-reel circuit board manufacturing apparatus of claim 4 , wherein the coating portion includes a silicone-based release coating agent.
  8. 8 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , wherein the film body is moved in a width direction of the roller on the basis of the roller.
  9. 9 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , wherein the roller includes a first roller and a second roller, the film body includes a first film body and a second film body, and the first film body surrounds the first roller and the second film body surrounds the second roller.
  10. 10 . The reel-to-reel circuit board manufacturing apparatus of claim 9 , further comprising a first coating portion arranged between the first roller and the first film body; and a second coating portion arranged between the second roller and the second film body.
  11. 11 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , further comprising a bearing arranged between the roller and the film body.
  12. 12 . The reel-to-reel circuit board manufacturing apparatus of claim 1 , wherein the roller and the film body being separately rotated from each other is such that the film body is configured to rotate in both of the same or opposite direction as the roller.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2021-0130306, filed on Sep. 30, 2021, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety. BACKGROUND 1. Field One or more embodiments of the disclosure relate to a reel-to-reel circuit board manufacturing apparatus. 2. Description of the Related Art Industry groups in which a circuit is formed on a reel or a film, from among the industries for manufacturing circuit boards, include industries regarding lead frame, flexible printed circuit board (FPCB), chips on film (COF), PCB, etc. Semiconductor packages are completed through processes of forming a photoresist on a substrate, forming a circuit pattern layer through a plating or an etching process, forming a solder resist layer on the circuit pattern layer, mounting a semiconductor chip, electrically connecting the circuit pattern layer and the semiconductor chip, and molding by using a molding material. Semiconductor circuit boards may be classified as rigid substrates, such as flame retardant-4 (FR-4) or bismaleimid triazine (BT), and flexible substrates having flexibility, such as polyimide. However, various rigid substrates having reduced thickness, like flexible substrates, may be manufactured by using a reel-to-reel manufacturing method. In particular, thin semiconductor packages have been developed recently, and a thickness of a circuit board has been also reduced. Thus, a reel-to-reel process may be applied. Methods of manufacturing circuit boards may be classified into panel manufacturing methods and reel manufacturing methods. According to the panel manufacturing method, individual panels are separately conveyed and processed, and then, laminated after finishing processes. According to the reel manufacturing method, a reel is wound on a cylindrical paper tube and continuously conveyed to be processed, and then, wound as a reel after finishing the process. FIGS. 1A and 1B are diagrams for describing issues in a reel manufacturing method according to the related art. FIG. 1A is a diagram showing a difference between the rotating speeds of a roller and a substrate, and FIG. 1B is a diagram showing a speed difference of a substrate in a width direction of a roller. According to the reel manufacturing method, a substrate is in contact with structures in pieces of equipment less than in a panel process, and thus, a circuit is less likely to be damaged. However, in the reel manufacturing method, in order to prevent tension and skewing, the reel may not be directly wound after the process, and the substrate may be wound up and down on various rollers. Since products come into contact with the roller, a risk of damaging the circuit may increase. Therefore, it is required that the velocity of the roller matches the substrate velocity, and thus, the substrate may not rub against a surface of the roller. However, a local friction may occur between the substrate and the roller because the substrate does not come into contact with the roller in parallel, and as shown in FIG. 1A, a velocity V1 of the substrate and a velocity V2 of the roller may not be completely equal to each other. In addition, even when a free roller is rotated according to the velocity of the substrate in a way of freely driving a driving roller by using the free roller, the roller having a relatively greater weight may not match the velocity of the substrate when there is a difference between velocities of the substrate and the roller, and thus, the substrate and the roller may rub against each other. Also, as shown in FIG. 1B, tensions on left and right sides of the substrate contacting the roller may be different from each other, and thus, a difference between the velocities (V3 and V4) of the left and right sides of the substrate may occur locally. Also, the driving roller may be formed of a plastic or metal material. In this case, even when the surface is precisely polished, there may be a limitation in controlling roughness on the surface of the roller. The roughness of a metal material may be controlled through coating or precise polishing, but due to the heavy weight, the circuit is inevitably damaged when the circuit having a size of tens of micrometers rubs against the roller. SUMMARY One or more embodiments of the present disclosure provide a reel-to-reel circuit board manufacturing apparatus capable of reducing damage to a substrate. However, the above technical features are exemplary, and the scope of the disclosure is not limited thereto. Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments of the disclosure. A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller h