Search

US-12621938-B2 - Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor

US12621938B2US 12621938 B2US12621938 B2US 12621938B2US-12621938-B2

Abstract

The present invention provides a circuit board structure and manufacturing method thereof. Select a processing area for electronic components on a circuit board containing a copper foil layer, and calculate marking points without setting the electronic components. Spray water-based environmentally friendly paint on the circuit board to form a first insulating layer. Cut the circuit board outside the marking points to form through holes, and spray water-based environmentally friendly conductive paint on the first insulating layer to form a conductive layer that forms an electrical connection with the copper foil layer. Finally, spray water-based environmentally friendly paint on the conductive layer to form a second insulating layer, so that electromagnetic waves and other interference of the electronic components are guided to the internal ground plane of the circuit board through the conductive layer for elimination, and heat is dispersed on the first and second insulating layers.

Inventors

  • Hsien-Chiang SU

Assignees

  • Hsien-Chiang SU

Dates

Publication Date
20260505
Application Date
20210830

Claims (9)

  1. 1 . A manufacturing method of circuit board structure with shielding and heat dissipation functions, comprising steps of: Step A: using a control processing device to select a processing area on a circuit board where multiple electronic components are set on said circuit board, and calculating multiple marking points based on the area where said multiple electronic components are not set in said processing area, wherein said marking points are selectively in a shape of points, lines or irregular shapes, and said circuit board comprises at least one layer of copper foil layer capable of forming a contact surface; Step B: using a preset glue dispenser to place points one by one on a surface of said circuit board at a preset distance to form said marking points; Step C: using a first preset atomizer to spray a water-based environmentally friendly paint on the surface of said circuit board, which said water-based environmentally friendly paint comprising a base material with a weight percentage of about 20% to 50%, a heat dissipation material with a weight percentage of about 10% to 40%, a polymer material cross-linking agent with a weight percentage of about 0.5% to 30% and a deionized water with a weight percentage of about 10% to 30%, so as to form a first insulating layer on the surface of said circuit board when said water-based environmentally friendly paint is solidified; Step D: using a preset laser cutting tool to perform cutting operations on said circuit board outside said marking points one by one; Step E: using a preset robot arm to take out said circuit board that has been cut with said marking point, so that a through hole is formed at each said marking point of said circuit board; Step F: using a second preset atomizer to spray a water-based environmentally friendly conductive paint on the surface of said circuit board, said water-based environmentally friendly conductive paint comprising a base material with a weight percentage of 20% to 50%, a binder with a weight percentage of 0.5%˜20%, a polymer material cross-linking agent with a weight percentage of 0.5%˜30% and a deionized water with a weight percentage of 10%˜30%, enabling said water-based environmentally friendly conductive paint to fill in said through hole, so that said water-based environmentally friendly conductive paint forms a conductive layer when solidified, said conductive layer forming an electrical connection with said copper foil layer inside said circuit board, for allowing electromagnetic waves, crosstalk, clutter and other interference generated by an operation of said electronic components can be guided by said conductive layer and said through holes to said copper foil layer inside said circuit board for elimination; and Step G: using said first preset atomizer to spray said water-based environmentally friendly paint on a surface of said conductive layer, said water-based environmentally friendly paint comprises a base material with a weight percentage of about 20% to 50%, a heat dissipation material with a weight percentage of about 10% to 40%, a polymer material cross-linking agent with a weight percentage of about 0.5% to 30% and a deionized water with a weight percentage of about 10% to 30%, and forms a second insulating layer on the surface of said conductive layer when said water-based environmentally friendly paint is solidified.
  2. 2 . The manufacturing method of circuit board structure with shielding and heat dissipation functions as claimed in claim 1 , wherein said preset distance in Step B is 0.5 cm˜5 cm.
  3. 3 . The manufacturing method of circuit board structure with shielding and heat dissipation functions as claimed in claim 1 , wherein in Step C and Step G, said base material with a weight percentage of 20% to 50% comprises one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin, said heat dissipation material comprises boron nitride, aluminum oxide or aluminum nitride with a weight percentage of 10% to 40% in the form of sheets or fins, and said polymer material cross-linking agent with a weight percentage of 0.5% to 30% comprises: hexa(methoxymethyl)melamine (hmmm) or aziridine or carbodiimide, and further targets amino group (—NH2), carboxyl (—COOH), amide bond (—CONH— or —NHCO—) functional group.
  4. 4 . The manufacturing method of circuit board structure with shielding and heat dissipation functions as claimed in claim 1 , wherein a thickness range of said conductive layer described in Step F is 1˜100 μm, and preferably 20˜60 μm, and a resistance value measured at any two points in said conductive layer is less than 1002.
  5. 5 . The manufacturing method of circuit board structure with shielding and heat dissipation functions as claimed in claim 1 , wherein in Step F, said base material with a weight percentage of 20% to 50% of said water-based environmentally friendly conductive paint comprises: carbon nanotubes, graphene, silver-coated copper and nickel, said binder with a weight percentage of 0.5% to 20% of said water-based environmentally friendly conductive paint comprises one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin, and said polymer material cross-linking agent with a weight percentage of 0.5% to 30% of said water-based environmentally friendly conductive paint comprises hexa(methoxymethyl)melamine (hmmm) or aziridine or carbodiimide, and further targets amino group (—NH2), carboxyl (—COOH), amide bond (—CONH— or —NHCO—) functional group.
  6. 6 . The manufacturing method of circuit board structure with shielding and heat dissipation functions as claimed in claim 5 , wherein said silver-coated copper has a flake structure with a particle length ranging from 10 to 100 μm.
  7. 7 . A circuit board structure with shielding and heat dissipation functions, comprising a circuit board, a first insulating layer, a conductive layer and a second insulating layer, wherein: said circuit board is equipped with a plurality of electronic components on a surface thereof, said circuit board comprising at least one layer of copper foil layer to form a contact surface inside; said first insulating layer is formed on said circuit board surface and said electronic components, said first insulating layer comprising a base material with a weight percentage of 20%˜50%, a heat dissipation material with a weight percentage of 10%˜40%, a polymer material cross-linking agent with a weight percentage of 0.5%˜30%, and a deionized water with a weight percentage of 10%˜30%; said conductive layer is formed on said first insulating layer, said conductive layer comprising a base material with a weight percentage of 20% to 50%, a binder with a weight percentage of 0.5% to 20%, a polymer material cross-linking agent with a weight percentage of 0.5% to 30%, and a deionized water with a weight percentage of 10%˜30%; said second insulating layer is formed on said conductive layer, said second insulating layer comprising a base material with a weight percentage of 20% to 50%, a boron nitride with a weight percentage of 10% to 40%, a polymer material cross-linking agent with a weight percentage of 0.5% to 30%, and a deionized water with a weight percentage of 10%˜30%.
  8. 8 . The circuit board structure with shielding and heat dissipation functions as claimed in claim 7 , wherein said base material with a weight percentage of 20% to 50% of said first insulating layer and said second insulating layer comprises one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; said heat dissipation material of said first insulating layer and said second insulating layer comprises boron nitride, aluminum oxide or aluminum nitride with a weight percentage of 10% to 40% in the form of sheets or fins, and said polymer material cross-linking agent with a weight percentage of 0.5% to 30% of said first insulating layer and said second insulating layer comprises: hexa(methoxymethyl)melamine (hmmm) or aziridine or carbodiimide, and further targets amino group (—NH2), carboxyl (—COOH), amide bond (—CONH— or —NHCO—) functional group.
  9. 9 . The circuit board structure with shielding and heat dissipation functions as claimed in claim 7 , wherein said base material with a weight percentage of 20% to 50% of said conductive layer comprises: carbon nanotubes, graphene, silver-coated copper and nickel, said binder with a weight percentage of 0.5% to 20% of said conductive layer comprises one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin, and said polymer material cross-linking agent with a weight percentage of 0.5% to 30% of said conductive layer comprises hexa(methoxymethyl)melamine (hmmm) or aziridine or carbodiimide, and further targets amino group (—NH2), carboxyl (—COOH), amide bond (—CONH— or —NHCO—) functional group.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application is a U.S. National Stage of International Application No. PCT/CN2021/000175, filed on Aug. 30, 2021, for which priority is claimed under 35 U.S.C. § 120, the entire contents of which are hereby incorporated by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a circuit board structure and manufacturing method that can shield noises and dissipate heat, especially to solve the problems of waterproofness, electromagnetic wave prevention, crosstalk interference and heat dissipation of electronic devices, and it does not require the installation of a metal cover shell to eliminate electromagnetic waves. It can meet the trend of light, thin, short and miniaturized electronic devices, and can effectively reduce the production cost of manufacturing circuit boards. 2. Description of the Related Art Due to the rapid changes of the times and the rapid advancement of technology, people now pursue a more convenient and faster life. Portable electronic devices (such as smart phones, tablets, laptops and other electronic products) are becoming more common and more important in modern life, and have almost become an indispensable part of daily life. With the rise of the Internet and social networking sites, a single portable electronic device can handle most tasks. Whether it is communications, the Internet, multimedia applications (such as videos or games) or various types of information, they can be easily obtained, used or disseminated in portable electronic devices. However, currently, various portable electronic devices must use electricity to start and operate, so various portable electronic devices are equipped with batteries to supply power. Power is transmitted to various functional circuit boards through the battery to supply the power required for the operation of the circuit boards, and power can be transmitted between the battery and the circuit boards through electrical connectors. However, the current electrical connectors used to transmit power are assembled using interlocking and clamping methods between the base block and multiple terminals. After being positioned, they can be used directly for power transmission. In practical application and implementation, there are still some shortcomings and inconveniences. For example: after an electrical connector is assembled and positioned, a gap is formed between its base block and multiple terminals. It is easy for external moisture to penetrate into the circuit board through the electrical connector, causing corrosion and oxidation of multiple contacts on the circuit board and pins of various electronic components, which can easily affect the operation of the circuit board, leading to abnormal short circuits or open circuits. Moreover, when electronic devices encounter rainy days or are accidentally spilled with other liquids, the internal parts of the electronic devices can easily be short-circuited due to moisture, affecting their functionality. Therefore, the waterproofness of circuit boards has gradually attracted the attention of developers. Moreover, today's electronic devices require a large amount of signal processing, and their signal processing also needs to be faster. Therefore, when an electronic device is in use, its internal electronic components will produce electromagnetic waves, crosstalk interference and high heat energy, which will also interfere with other electronic devices, or cause the internal electronic components to interfere with each other and prevent them from functioning properly. Based on the above, in order to solve the problems of electromagnetic wave, crosstalk interference and heat dissipation, some manufacturers install metal covers on the circuit boards of electronic devices. The metal cover is used to cover the top of the electronic components, and then the metal cover is used to absorb and shield electromagnetic waves and crosstalk interference and provide heat dissipation. However, current electronic devices are developing towards the trend of being light, thin, short, and miniaturized, and installing a metal cover will increase the overall thickness of the electronic device. In addition, the mold opening and assembly of the metal cover will also consume a lot of manufacturing time and cost, which cannot effectively enhance the market competitiveness of electronic devices. Therefore, how to solve the problems of waterproofness, electromagnetic wave prevention, crosstalk interference and heat dissipation of the above-mentioned electronic devices, and at the same time comply with the development trend of electronic devices being light, thin, short and miniaturized, is the direction that relevant manufacturers in this industry are eager to study and improve. SUMMARY OF THE INVENTION In view of the aforementioned problems and shortcomings, the inventor has collected relevant information, conducted multiple evaluations and co