US-12621955-B2 - Heat dissipation device

US12621955B2US 12621955 B2US12621955 B2US 12621955B2US-12621955-B2

Abstract

A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.

Inventors

Chih-Wei Chen
Kang-Ming FAN
Tsung-Han Tsai
Fu-Hsuan HSIEH
Chien-Yu Liu

Assignees

AURAS TECHNOLOGY CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20240411
Priority Date: 20231128

Claims (13)

1 . A heat dissipation device, comprising: an inclined heat pipe having an inclined heat dissipation area; and a plurality of inclined heat dissipation fins, each of the inclined heat dissipation fins having an inclined heat dissipation portion, wherein the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion to form a predetermined angle between the inclined heat dissipation area of the inclined heat pipe and a horizontal plane, a first heat dissipation portion connected to a bottom of the inclined heat dissipation portion to horizontally fix on a base board, wherein the first heat dissipation portion of the each of the inclined heat dissipation fins further comprises: a lower inclined portion to allow at least part of a bottom of the first heat dissipation portion forming an angle with a horizontal plane.
2 . The heat dissipation device of claim 1 , wherein each of the inclined heat dissipation fins further comprises: an extended heat dissipation portion connected to a top of the first heat dissipation portion and a lateral side of the inclined heat dissipation portion.
3 . The heat dissipation device of claim 1 , wherein the inclined heat pipe further comprises: a heat absorption area horizontally fixed on a heat source.
4 . The heat dissipation device of claim 1 , wherein each of the inclined heat dissipation fins further comprises: an extended air inlet located on the first heat dissipation portion to guide a cooling air into the inclined heat dissipation fins.
5 . The heat dissipation device of claim 1 , wherein each of the inclined heat dissipation fins further comprises: a wind guide protrusion to guide a cooling air toward the inclined heat dissipation portion.
6 . The heat dissipation device of claim 5 , wherein each of the inclined heat dissipation fins further comprises: a wind guide opening, wherein the wind guide protrusion is protruded on the wind guide opening to guide the cooling air passing through the wind guide opening.
7 . The heat dissipation device of claim 6 , wherein the wind guide opening and the wind guide protrusion are rectangular, triangular or polygonal.
8 . The heat dissipation device of claim 1 , wherein each of the inclined heat dissipation fins further comprises: a wind guide opening to guide a cooling air passing through the each of the inclined heat dissipation fins.
9 . The heat dissipation device of claim 1 , wherein the first heat dissipation portion of the each of the inclined heat dissipation fins further comprises: a wind guide flange protruding on the lower inclined portion to guide a cooling air.
10 . The heat dissipation device of claim 2 , wherein the inclined heat dissipation portion of the each of the inclined heat dissipation fins further comprises: a wind guide flange to increase a contact area with the inclined heat dissipation area of the inclined heat pipe to guide a cooling air.
11 . The heat dissipation device of claim 10 , wherein the extended heat dissipation portion of the each of the inclined heat dissipation fins further comprises: an L-shaped wind guide flange to connect to the wind guide flange of the inclined heat dissipation portion.
12 . The heat dissipation device of claim 1 , further comprising a fan located on one side of the inclined heat dissipation fins to blow a cooling air to the inclined heat dissipation fins and the inclined heat dissipation area of the inclined heat pipe.
13 . The heat dissipation device of claim 1 , wherein the predetermined angle between the inclined heat dissipation area of the inclined heat pipe and the horizontal plane is 5 to 45 degrees.

Description

RELATED APPLICATIONS This application claims priorities to U.S. Provisional Application Ser. No. 63/462,108, filed Apr. 26, 2023 and Taiwan Application Serial Number 112146005, filed Nov. 28, 2023, the disclosures of which are incorporated herein by reference in their entireties. TECHNICAL FIELD The present disclosure relates to a heat dissipation device. More particularly, the present disclosure relates to a heat dissipation device having an inclined heat pipe. BACKGROUND With the advancement of technology, electronic products have become more popular, and gradually changed the life or work of many people. As the calculating power of the computers increases, the temperature control of the electronic components such as the central processing units and graphics chips is more important. Electronic components such as the central processing units and graphics chips generate heat during operation and require proper cooling to achieve the best performance. In order to keep the central processing unit and graphics chips operating at a proper temperature, an appropriate heat dissipation device configuration may influence the performance of the electronic device. In addition, when the appearance size of current electronic devices is getting smaller and the number of cores of the computing chip is increased, the heat generated by the computing chip is also increased. In a small space, not only the computing chip and the heat dissipation device are installed, but other mechanisms and electronic components are also installed. Therefore, there is a need to take into account space utilization and improve heat dissipation efficiency to reduce the operating temperature of the computing chip so as to effectively improve the overall working efficiency of the electronic device. SUMMARY The summary of the present invention is intended to provide a simplified description of the disclosure to enable readers to have a basic understanding of the disclosure. The summary of the present invention is not a complete overview of the disclosure, and it is not intended to point out the importance of the embodiments/key elements of the present invention or define the scope of the invention. One objective of the embodiments of the present invention is to provide a heat dissipation device to improve the heat dissipation efficiency of the heat dissipation device and further improve the overall working efficiency of the electronic device. To achieve these and other advantages and in accordance with the objective of the embodiments of the present invention, as the embodiment broadly describes herein, the embodiments of the present invention provides a heat dissipation device including an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe has an inclined heat dissipation area, and each of the inclined heat dissipation fins has an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion to form a predetermined angle between the inclined heat dissipation area of the inclined heat pipe and a horizontal plane. In some embodiments, each of the inclined heat dissipation fins further includes a first heat dissipation portion connected to a bottom of the inclined heat dissipation portion to horizontally fix on a base board. In some embodiments, each of the inclined heat dissipation fins further includes an extended heat dissipation portion connected to a top of the first heat dissipation portion and a lateral side of the inclined heat dissipation portion. In some embodiments, the inclined heat pipe further includes a heat absorption area horizontally fixed on a heat source. In some embodiments, each of the inclined heat dissipation fins further includes an extended air inlet located on the first heat dissipation portion to guide a cooling air into the inclined heat dissipation fins. In some embodiments, each of the inclined heat dissipation fins further includes a wind guide protrusion to guide a cooling air toward the inclined heat dissipation portion. In some embodiments, each of the inclined heat dissipation fins further includes a wind guide opening, and the wind guide protrusion is protruded on the wind guide opening to guide the cooling air passing through the wind guide opening. In some embodiments, the wind guide opening and the wind guide protrusion are rectangular, triangular or polygonal. In some embodiments, each of the inclined heat dissipation fins further includes a wind guide opening to guide a cooling air passing through the each of the inclined heat dissipation fins. In some embodiments, the first heat dissipation portion of the each of the inclined heat dissipation fins further includes a lower inclined portion to allow at least part of a bottom of the first heat dissipation portion forming an angle with a horizontal plane. In some embodiments, the first heat dissipation portion of the each of