US-12621958-B2 - Cooling component including supply ports and discharge ports

US12621958B2US 12621958 B2US12621958 B2US 12621958B2US-12621958-B2

Abstract

A cooling component includes a heat receiving plate that receives heat from the cooling target object; a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate; a refrigerant supplying path for supplying a refrigerant to the plurality of heat dissipating plates; a refrigerant discharging path to which the refrigerant is supplied from the plurality of heat dissipating plates; and a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed, wherein the refrigerant supplied by the refrigerant supplying path passes through some of the through-holes, while the refrigerant that passes through the remainder of the plurality of through-holes is discharged by the refrigerant discharging path, and some of the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other.

Inventors

Yasuhito NAKAMURA

Assignees

NEC PLATFORMS, LTD.

Dates

Publication Date: 20260505
Application Date: 20220420
Priority Date: 20210610

Claims (3)

1 . A cooling component comprising: a heat receiving plate configured to receive heat from a cooling target object; a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate; a refrigerant supplying path configured to supply a refrigerant to the plurality of heat dissipating plates; a refrigerant discharging path configured to be supplied with the refrigerant from the plurality of heat dissipating plates; a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed; and a plurality of convection chambers surrounded by the heat receiving plate, each of the plurality of heat dissipating plates, and the refrigerant passing member, are provided, wherein the refrigerant supplying path is configured to supply the refrigerant to each of the plurality of convection chambers from a plurality of supply ports that are some through-holes among the plurality of through-holes, wherein the refrigerant supplied to the plurality of convection chambers is discharged to the refrigerant discharging path from a plurality of discharge ports that are the remainder of the plurality of through-holes, wherein each of a second number of the discharge ports is provided between adjacent two of a first number of the supply ports, above a predetermined convection chamber among the plurality of convection chambers, each of the first number and the second number is at least one, wherein the first number is equal to the second number, and wherein the some through-holes among the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other.
2 . The cooling component according to claim 1 , wherein the refrigerant supplying path and the refrigerant discharging path are formed in the refrigerant passing member.
3 . The cooling component according to claim 1 , wherein one of a plurality of the refrigerant discharging path is disposed between adjacent two of a plurality of the refrigerant supplying path.

Description

This application is a National Stage Entry of PCT/JP2022/018252 filed on Apr. 20, 2022, which claims priority from Japanese Patent Application 2021-097539 filed on Jun. 10, 2021, the contents of all of which are incorporated herein by reference, in their entirety. TECHNICAL FIELD The present invention relates to a cooling component. BACKGROUND ART A cooling component that receives heat from an electronic component that generates heat, and cools the electronic component is present. PTL 1 describes that a partition plate is provided inside a cooling component, and that a plurality of flow paths through which a liquid refrigerant passes are formed by the partition plate. The liquid refrigerant flows in from supply holes (supply ports) of the flow paths, passes through the flow paths separated by the partition plate, and is discharged from discharge holes (discharge ports). CITATION LIST Patent Literature PTL 1: JP 2005-11928 A SUMMARY OF INVENTION Technical Problem However, in the cooling component described in PTL 1, the liquid refrigerant receives heat from an electronic component as the liquid refrigerant passes through the flow paths. Due to the reception of the heat, in each of the plurality of flow paths, the temperature of the liquid refrigerant passing through the vicinity of the discharge ports increases as compared with the temperature of the liquid refrigerant passing through the vicinity of the supply ports. In other words, a portion of the electronic component near the discharge ports is cooled by the liquid refrigerant whose temperature has increased. As described above, the cooling component described in PTL 1 has a problem that the electronic component cannot be uniformly cooled. An object of the present invention is to provide a cooling component capable of substantially uniformly cooling a cooling target object. Solution to Problem According to one aspect of the present invention, a cooling component includes a heat receiving plate that receives heat from a cooling target object, a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate, a refrigerant supplying path that supplies a refrigerant to the plurality of heat dissipating plates, a refrigerant discharging path to which the refrigerant is supplied from the plurality of heat dissipating plates, and a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed. The refrigerant supplied by the refrigerant supplying path passes through some through-holes among the plurality of through-holes, the refrigerant that has passed through a remainder of the plurality of through-holes is discharged by the refrigerant discharging path, and the some through-holes among the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other. Advantageous Effects of Invention By the cooling component of the present invention, the cooling target object can be cooled substantially uniformly. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a transparent perspective view illustrating a configuration example of a cooling component according to a first example embodiment of the present invention. FIG. 2 is an exploded perspective view of the cooling component according to the first example embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a configuration example of the cooling component according to the first example embodiment of the present invention. FIG. 4 is a top perspective view of the cooling component according to the first example embodiment of the present invention in a state where a top plate of the cooling component is removed. FIG. 5 is a plan view illustrating a configuration example of a refrigerant passing member of the cooling component according to the first example embodiment of the present invention. FIG. 6 is a top perspective view of a cooling component according to a modification of the first example embodiment of the present invention in a state where a top plate of the cooling component is removed. FIG. 7 is a plan view illustrating a configuration example of a refrigerant passing member of the cooling component according to the modification of the first example embodiment of the present invention. FIG. 8 is a transparent perspective view illustrating a configuration example of a cooling component according to a second example embodiment of the present invention. FIG. 9 is an exploded perspective view of the cooling component according to the second example embodiment of the present invention. FIG. 10 is a cross-sectional view illustrating a configuration example of the cooling component according to the second example embodiment of the present invention. FIG. 11 is a schematic view schematically illustrating a direction in which a refrigerant flows using the cross-sectional view in the cooling component according to the second example embodiment of the present invention. FI