US-12621961-B2 - Electronic device and product

Abstract

An electronic device is provided having a device part; an outer housing is provided to cover an upper side of the device part; and the electronic device also has a fiber member for joining the device part to the outer housing. The fiber member is exposed from an upper surface of the outer housing.

Inventors

• Beji Sasaki

Assignees

• Beji Sasaki

Dates

Publication Date

20260505

Application Date

20220119

Priority Date

20210119

Claims (8)

1. 1 . An electronic device comprising: a device part; an outer housing provided to cover an upper side of the device part; and a fiber member for joining the device part to the outer housing, wherein the fiber member is exposed from an upper surface of the outer housing.
2. 2 . The electronic device according to claim 1 , wherein the fiber member is made of metal.
3. 3 . The electronic device according to claim 1 , wherein the device part has an electronic element, and a device resin part that covers the electronic element, and wherein the fiber member joins the device resin part of the device part with the outer housing.
4. 4 . The electronic device according to claim 1 , wherein the device part has an electronic element, and a device housing that covers the electronic element, and wherein the fiber member joins the device housing part of the device part with the outer housing.
5. 5 . An electronic device comprising: a device part; an outer housing provided to cover an upper side of the device part; a heat transfer member provided between the upper side of the device part and the outer housing; and a fiber member for joining the device part to the heat transfer member.
6. 6 . The electronic device according to claim 5 , wherein the fiber member joins the device part with the outer housing and the heat transfer member.
7. 7 . The electronic device according to claim 5 , wherein the device part has an electronic element, and a device resin part that covers the electronic element, and wherein the fiber member joins the device resin part of the device part with the heat transfer member.
8. 8 . The electronic device according to claim 5 , wherein the device part has an electronic element, and a device housing that covers the electronic element, and wherein the fiber member joins the device housing part of the device part with the heat transfer member.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is the U.S. national phase of PCT Patent Application No. PCT/JP2022/001730 filed on Jan. 19, 2022, which claims priority to Japanese Patent Application No. 2021-006590, filed on Jan. 19, 2021, the disclosures of which are incorporated in their entireties by reference herein. TECHNICAL FIELD The present invention relates to an electronic device having a device part and a product. BACKGROUND ART As the power consumption of electronic elements and the like increases, heat dissipation in electronic devices has become important. For example, JP 2019-102485 A discloses an electronic device including a printed circuit board having a surface on which a heating element is mounted, and a sealed housing having thermal conductivity and accommodating the printed circuit board. The electronic device includes a through hole provided in the printed circuit board and a protrusion provided on a surface of the housing that faces a back surface of the printed circuit board, and the protrusion is thermally connected to the heating element via the through hole. SUMMARY OF INVENTION Problem to be Solved by Invention The present invention provides an electronic device and the like for implementing a high heat dissipation performance by an approach different from an aspect according to the related art. Means for Solving Problem An electronic device according to an aspect of the present invention may comprise: a device part; anda fiber member for joining the device part to another member other than the device part included in the electronic device. According to the present invention, heat generated from the device part can be easily transferred to another member, and the heat can be easily dissipated. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a side cross-sectional view illustrating an aspect in which a highly thermally conductive fiber member joins a device part and a heat transfer member in an electronic device according to an embodiment of the present invention. FIG. 2 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part, the heat transfer member, and an outer housing in the electronic device according to an embodiment of the present invention. FIG. 3 is a side cross-sectional view illustrating an aspect in which the fiber member penetrates through the outer housing in the electronic device according to an embodiment of the present invention. FIG. 4 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part and the outer housing in the electronic device according to an embodiment of the present invention. FIG. 5 is a side cross-sectional view illustrating an aspect in which a certain fiber member joins the device part and the heat transfer member, and another fiber member joins the heat transfer member and the outer housing in the electronic device according to an embodiment of the present invention. FIG. 6 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part and the heat transfer member, and another fiber member joins the heat transfer member and the outer housing, in an electronic device according to an embodiment of the present invention, in which the fiber member penetrates through the outer housing. FIG. 7 is a side cross-sectional view illustrating an aspect in which the fiber member having a rod shape penetrates through the outer housing in the electronic device according to an embodiment of the present invention. FIG. 8 is a side cross-sectional view illustrating an aspect in which the fiber member having a rod shape is bent on a front surface of the outer housing in the electronic device according to an embodiment of the present invention. FIG. 9 is a side cross-sectional view illustrating an aspect in which the fiber member having a rod shape is cut at a position exposed from the outer housing in the electronic device according to an embodiment of the present invention. FIG. 10 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part and a heat sink in the electronic device according to an embodiment of the present invention. FIG. 11 is a side cross-sectional view illustrating an aspect in which the fiber member joins the heat transfer member placed on a device resin part and the device part in the electronic device according to an embodiment of the present invention. FIG. 12A is a view illustrating an example of the electronic device according to an embodiment of the present invention. FIG. 12B is a view illustrating an example of the electronic device according to an embodiment of the present invention. FIG. 12C is a view illustrating an example of the electronic device according to an embodiment of the present invention. FIG. 12D is a view illustrating an example of the electronic device according to an embodiment of the present invention. FIG. 12E is a view illustrating an exampl