US-12622059-B2 - Array substrate and manufacturing method thereof, display panel and manufacturing method therefor, and display device

US12622059B2US 12622059 B2US12622059 B2US 12622059B2US-12622059-B2

Abstract

The present disclosure relates to a manufacturing method for an array substrate, including: forming a first electrode material layer, a conductive enhancement material layer and a protective material layer in sequence, oxidation resistance of the protective material layer being stronger than that of the conductive enhancement material layer; forming a mask pattern on a side of the protective material layer away from the first electrode material layer, the mask pattern including a first portion and a second portion, and a thickness of the first portion being greater than that of the second portion; performing ashing on the mask pattern to remove the second portion to expose the protective material layer covered by the second portion; patterning the first electrode material layer to form a first electrode; and patterning the protective material layer and the conductive enhancement material layer to form a protective layer and a conductive enhancement layer.

Inventors

Chengzhi YE
Binbin CAO
Yanming LV
HUI AN
Jinnian MA

Assignees

HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
BOE TECHNOLOGY GROUP CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20210930

Claims (19)

1 . A manufacturing method for an array substrate, comprising: forming a first electrode material layer, a conductive enhancement material layer and a protective material layer in sequence, wherein oxidation resistance of the protective material layer is stronger than oxidation resistance of the conductive enhancement material layer; forming a mask pattern on a side of the protective material layer away from the first electrode material layer, wherein the mask pattern comprises a first portion and a second portion, and a thickness of the first portion is greater than a thickness of the second portion; performing ashing on the mask pattern to remove the second portion to expose the protective material layer covered by the second portion; patterning the first electrode material layer to form a first electrode; and patterning the protective material layer and the conductive enhancement material layer to form a protective layer and a conductive enhancement layer correspondingly.
2 . The manufacturing method for the array substrate according to claim 1 , wherein before the performing the ashing on the mask pattern, the manufacturing method further comprises: patterning the protective material layer and the conductive enhancement material layer to expose a part of the first electrode material layer.
3 . The manufacturing method for the array substrate according to claim 1 , wherein the forming the mask pattern on the side of the protective material layer away from the first electrode material layer comprises: forming a mask layer on the side of the protective material layer away from the first electrode material layer; and performing a half-mask process on the mask layer to form the mask pattern.
4 . The manufacturing method for the array substrate according to claim 1 , wherein before the forming the first electrode material layer, the manufacturing method further comprises: forming an organic insulating material layer; and patterning the organic insulating material layer to form an organic insulating layer and a second via hole.
5 . The manufacturing method for the array substrate according to claim 1 , wherein before the forming the first electrode material layer, the manufacturing method further comprises: forming a gate line and a thin film transistor on a side of a base substrate, wherein an orthographic projection of the conductive enhancement layer on the base substrate is at least partially overlapped with an orthographic projection of the gate line on the base substrate, and an orthographic projection of the protective layer on the base substrate is at least partially overlapped with the orthographic projection of the gate line on the base substrate; wherein the first electrode, the conductive enhancement layer and the protective layer are disposed on a side the thin film transistor away from the base substrate.
6 . The manufacturing method for the array substrate according to claim 5 , wherein after the forming the protective layer and the conductive enhancement layer, the manufacturing method further comprises: forming a second insulating layer on a side of the protective layer away from the first electrode, and patterning the second insulating layer to form a fourth via hole; and forming a second electrode on a side of the second insulating layer away from the first electrode, wherein the second electrode is electrically coupled with a data line of the thin film transistor.
7 . A manufacturing method for a display panel, comprising: providing an array substrate, wherein the array substrate is manufactured by a manufacturing method, wherein the manufacturing method comprises: forming a first electrode material layer, a conductive enhancement material layer and a protective material layer in sequence, wherein oxidation resistance of the protective material layer is stronger than oxidation resistance of the conductive enhancement material layer; forming a mask pattern on a side of the protective material layer away from the first electrode material layer, wherein the mask pattern comprises a first portion and a second portion, and a thickness of the first portion is greater than a thickness of the second portion; performing ashing on the mask pattern to remove the second portion to expose the protective material layer covered by the second portion; patterning the first electrode material layer to form a first electrode; and patterning the protective material layer and the conductive enhancement material layer to form a protective layer and a conductive enhancement layer correspondingly; and providing a color filter substrate, and oppositely aligning the color filter substrate with the array substrate, wherein the color filter substrate comprises a black matrix, and an orthographic projection of the conductive enhancement layer on a base substrate is located within an orthographic projection of the black matrix on the base substrate, and an orthographic projection of the protective layer on the base substrate is located within the orthographic projection of the black matrix on the base substrate.
8 . An array substrate, comprising: a first electrode; a conductive enhancement layer, disposed on a side of the first electrode; and a protective layer, disposed on a side of the conductive enhancement layer away from the first electrode, wherein oxidation resistance of the protective layer is stronger than oxidation resistance of the conductive enhancement layer, wherein the array substrate further comprises: a base substrate; a thin film transistor and a gate line, disposed on a side of the base substrate, wherein an orthographic projection of the conductive enhancement layer on the base substrate is at least partially overlapped with an orthographic projection of the gate line on the base substrate, and an orthographic projections of the protective layer on the base substrate is at least partially overlapped with the orthographic projection of the gate line on the base substrate; and a first spacer, disposed on a side of the first electrode away from the base substrate, and located between the thin film transistor and an adjacent thin film transistor; wherein the first electrode, the conductive enhancement layer and the protective layer are disposed on a side the thin film transistor away from the base substrate; and the orthographic projection of the conductive enhancement layer on the base substrate is set as a curve, and the conductive enhancement layer is recessed and bent to a side away from the first spacer at a position of the conductive enhancement layer adjacent to the first spacer.
9 . The array substrate according to claim 8 , wherein an orthographic projection of the conductive enhancement layer on the first electrode is coincided with an orthographic projection of the protective layer on the first electrode.
10 . The array substrate according to claim 8 , wherein the array substrate comprises: a data line, disposed on a side of the base substrate; an extension direction of the conductive enhancement layer is consistent with an extension direction of the data line, and the orthographic projection of the conductive enhancement layer on the base substrate is at least partially within an orthographic projection of the data line on the base substrate; and an extension direction of the protective layer is consistent with the extension direction of the data line, and an orthographic projection of the protective layer on the base substrate is at least partially within the orthographic projection of the data line on the base substrate.
11 . The array substrate according to claim 8 , wherein an extension direction of the conductive enhancement layer is consistent with an extension direction of the gate line; and an extension direction of the protective layer is consistent with the extension direction of the gate line.
12 . The array substrate according to claim 8 , wherein the array substrate further comprises: an organic insulating layer, disposed between the thin film transistor and the first electrode.
13 . The array substrate according to claim 12 , wherein the array substrate further comprises: a second insulating layer, disposed on a side of the first electrode away from the base substrate; and a second electrode, disposed on a side of the second insulating layer away from the base substrate, wherein the second electrode is electrically coupled to a data line of the thin film transistor.
14 . The array substrate according to claim 8 , wherein a material of the protective layer is a titanium alloy, and a thickness of the protective layer is greater than or equal to 300 A and less than or equal to 500 A; a material of the conductive enhancement layer is copper, and a thickness of the conductive enhancement layer is greater than or equal to 1000 A and less than or equal to 1500 A; and the first electrode is a common electrode, and a material of the first electrode is ITO.
15 . The array substrate according to claim 14 , wherein the titanium alloy comprises at least three metal materials.
16 . The array substrate according to claim 8 , wherein an extension direction of the conductive enhancement layer is consistent with an extension direction of the gate line, and an extension direction of the protective layer is consistent with the extension direction of the gate line.
17 . The array substrate according to claim 16 , wherein the orthographic projection of the protective layer on the base substrate is set as a curve, and the protective layer is recessed and bent to the side away from the first spacer at a position of the protective layer adjacent to the first spacer.
18 . The array substrate according to claim 17 , wherein the conductive enhancement layer comprises a first straight portion and a first curved portion, and an orthographic projection of the first straight portion on the base substrate is located within the orthographic projection of the gate line on the base substrate, an orthographic projection of the first curved portion on the base substrate is at least partially not overlapped with the orthographic projection of the gate line on the base substrate; and the protective layer comprises a second straight portion and a second curved portion, an orthographic projection of the second straight portion on the base substrate is located within the orthographic projection of the gate line on the base substrate, and an orthographic projection of the second curved portion on the base substrate is at least partially not overlapped with the orthographic projection of the gate line on the base substrate.
19 . The array substrate according to claim 16 , wherein a plurality of strips of conductive enhancement layers are disposed, and the plurality of strips of conductive enhancement layers are extended in a same direction; and a plurality of strips of protective layers are disposed, and the plurality of strips of protective layers are extended in a same direction.

Description

TECHNICAL FIELD The present disclosure relates to the field of display technologies, and in particular, to an array substrate and a manufacturing method for the array substrate, a display panel including the array substrate and a manufacturing method for the display panel, and a display device including the display panel. BACKGROUND In recent years, users have increasingly demanding requirements for display picture quality, which leads to the display picture quality of existing display products failing to meet the users' requirements. It should be noted that the information disclosed in the Background section above is only for enhancing the understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY An objective of the present disclosure is to overcome the above-mentioned deficiencies of the prior art, and to provide an array substrate and a manufacturing method thereof, a display panel and a manufacturing method thereof, and a display device. According to an aspect of the present disclosure, there is provided a manufacturing method for an array substrate, and the manufacturing method includes: forming a first electrode material layer, a conductive enhancement material layer and a protective material layer in sequence, wherein oxidation resistance of the protective material layer is stronger than oxidation resistance of the conductive enhancement material layer;forming a mask pattern on a side of the protective material layer away from the first electrode material layer, wherein the mask pattern includes a first portion and a second portion, and a thickness of the first portion is greater than a thickness of the second portion;performing ashing on the mask pattern to remove the second portion to expose the protective material layer covered by the second portion;patterning the first electrode material layer to form a first electrode; andpatterning the protective material layer and the conductive enhancement material layer to form a protective layer and a conductive enhancement layer correspondingly. In an embodiment of the present disclosure, before the performing the ashing on the mask pattern, the manufacturing method further includes: patterning the protective material layer and the conductive enhancement material layer to expose a part of the first electrode material layer. In an embodiment of the present disclosure, the forming the mask pattern on the side of the protective material layer away from the first electrode material layer includes: forming a mask layer on the side of the protective material layer away from the first electrode material layer, and performing a half-mask process on the mask layer to form the mask pattern. In an embodiment of the present disclosure, before the forming the first electrode material layer, the manufacturing method further includes: forming an organic insulating material layer, and patterning the organic insulating material layer to form an organic insulating layer and a second via hole. In an embodiment of the present disclosure, before the forming the first electrode material layer, the manufacturing method further includes: forming a plurality of gate lines and a plurality of thin film transistors arranged in an array on a side of a base substrate, wherein an orthographic projection of the conductive enhancement layer on a base substrate is overlapped with an orthographic projection of a gate line on the base substrate, and an orthographic projection of the protective layer on the base substrate is overlapped with the orthographic projection of the gate line on the base substrate. In an embodiment of the present disclosure, after the forming the protective layer and the conductive enhancement layer, the manufacturing method further includes: forming a second insulating layer on a side of the protective layer away from the first electrode, and patterning the second insulating layer to form a fourth via hole; andforming a second electrode on a side of the second insulating layer away from the first electrode, wherein the second electrode is electrically coupled with a data line of the thin film transistor. According to another aspect of the present disclosure, there is provided a manufacturing method for a display panel, and the manufacturing method includes: providing an array substrate, wherein the array substrate is manufactured by the manufacturing method described in any one of the above embodiments; andproviding a color filter substrate, and oppositely aligning the color filter substrate with the array substrate, wherein the color filter substrate includes a black matrix, and the orthographic projection of the conductive enhancement layer on the base substrate is located within an orthographic projection of the black matrix on the base substrate, and the orthographic projection of the protective layer on the base substrate is located within t