US-12622091-B2 - Light-emitting photosensitive sensor structure and manufacturing method thereof

US12622091B2US 12622091 B2US12622091 B2US 12622091B2US-12622091-B2

Abstract

A method for manufacturing a light-emitting photosensitive sensor structure includes preparing a package substrate, wherein the package substrate has a cavity formed by a light-shield frame performing enclosing, and the bottom of the cavity is provided with a first line layer, forming a light transmission channel on the light-shield frame, mounting a light-emitting photosensitive sensor in the cavity of the package substrate so that the photosensitive luminescent device is electrically connected to the first line layer, filling the cavity and the light transmission channel with a transparent encapsulating material to form a transparent packaging layer on the photosensitive luminescent device, forming a light-shield layer on the transparent packaging layer, and performing cutting along a cutting line of the light-shield frame to obtain a light-emitting photosensitive sensor structure having a directional light transmission channel.

Inventors

Xianming Chen
Lei Feng
Benxia Huang
Jiangjiang ZHAO
Zhijun Zhang

Assignees

ZHUHAI ACCESS SEMICONDUCTOR CO., LTD

Dates

Publication Date: 20260505
Application Date: 20230712
Priority Date: 20220712

Claims (9)

1 . A method for manufacturing a light-emitting photosensitive sensor structure, the method comprising: preparing a package substrate, wherein the package substrate is formed with a cavity enclosed by a light-shield frame, and a first line layer is formed on the bottom of the cavity; forming a light transmission channel on the light-shield frame, wherein the light transmission channel extends beyond a cutting line of the light-shield frame; installing a light-emitting photosensitive sensor in the cavity of the package substrate so that the light-emitting photosensitive sensor is electrically connected to the first line layer; filling the cavity and the light transmission channel with a transparent packaging material to form a transparent packaging layer on the light-emitting photosensitive sensor; forming a light-shield layer on the transparent packaging layer; and obtaining a light-emitting photosensitive sensor structure having a directional light transmission channel by cutting along a cutting line of the light-shield frame.
2 . The method according to claim 1 , wherein in the forming of the light transmission channel, a height of the light-shield frame exceeds that of the light-emitting photosensitive sensor installed in the cavity.
3 . The method according to claim 1 , wherein the cutting line of the light-shield frame intersects with the light transmission channel.
4 . The method according to claim 1 , wherein in the filling of the cavity and the light transmission channel, the transparent packaging layer is arc-shaped.
5 . The method according to claim 1 , wherein the first line layer is connected to a second line layer on a back face of the package substrate via a conducting post penetrating through the package substrate.
6 . The method according to claim 1 , wherein the installing of the light-emitting photosensitive sensor further comprises: mounting the light-emitting photosensitive sensor on a first heat dissipation layer of the package substrate; and connecting the first heat dissipation layer to a second heat dissipation layer on a back face of the package substrate via a heat conducting post penetrating through the package substrate.
7 . The method according to claim 1 , wherein a cross section of the light transmission channel is groove-shaped.
8 . The method according to claim 1 , wherein the transparent packaging layer is made of an optically clear resin (OCR) glue or an optically clear adhesive (OCA) glue.
9 . The method according to claim 1 , wherein the light-shield layer is made of chromium, chromium oxide, or black resin.

Description

CROSS-REFERENCE TO RELATED APPLICATION AND CLAIM OF PRIORITY This application claims the benefit under 35 USC § 119 of Chinese Patent Application No. 2022108203136, filed on Jul. 12, 2022, in the China Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. BACKGROUND 1. Technical Field The present application relates to the technical field of electronic device packaging, and in particular to a light-emitting photosensitive sensor structure and a manufacturing method thereof. 2. Background With the development of the electronic industry, electronic products are increasingly trending towards high integration, multifunction, high performance, and miniaturization. Therefore, embedded package substrates that can provide multiple device layouts are becoming increasingly dominant. Moreover, in an embedded packaging structure, metal wires are usually used as the transmission medium of data signals. However, metal wires have many limitations, for example, metal wires have limited conductivity affected by the material, and it is difficult to improve the signal transmission speed by increasing the conductivity; in the process of signal transmission, metal wires are vulnerable to external and mutual electromagnetic interference, especially in high-frequency transmission, so additional shielding measures are needed, and such shielding protection measures cause considerable difficulties for circuit design; in addition, metal wires transmit analog signals, which need to be converted during digital processing, making it prone to distortion. In order to improve the above limitations of metal wires, a method for using optical signals to replace electrical signals for signal transmission is developed. The most obvious effect is that the optical signal is hardly interfered with by electromagnetic waves. So the signal transmission quality is good and the situations of signal transmission distortion can be reduced; also, the design of the electromagnetic shielding structure can be reduced. Therefore, optical signal transmission has become the direction of future development, and embedding a light-emitting photosensitive sensor for optical communication into a package is an inevitable choice to realize its miniaturization and integration. The light-emitting photosensitive sensor structure in the prior art is generally provided with a transparent material on the light-emitting photosensitive sensor to form a package, but the photosensitive luminescence direction of the light-emitting photosensitive sensor is difficult to control. As it has no directionality, it cannot satisfy the requirement of having light direction selectivity. SUMMARY In view of this, an aspect of this application is to propose a light-emitting photosensitive sensor packaging element and a manufacturing method. An aspect of the present application provides a manufacturing method for a light-emitting photosensitive sensor structure, including the following steps: (a) preparing a package substrate, wherein the package substrate is formed with a cavity enclosed by a light-shield frame, and a first line layer is formed on the bottom of the cavity;(b) forming a light transmission channel on the light-shield frame, wherein the light transmission channel extends beyond a cutting line of the light-shield frame;(c) installing a light-emitting photosensitive sensor in the cavity of the package substrate so that the light-emitting photosensitive sensor is electrically connected to the first line layer;(d) filling the cavity and the light transmission channel with a transparent packaging material to form a transparent packaging layer on the light-emitting photosensitive sensor;(e) forming a light-shield layer on the transparent packaging layer; and(f) obtaining a light-emitting photosensitive sensor structure having a directional light transmission channel by cutting along a cutting line of the light-shield frame. In some embodiments, in step (b), the height of the light-shield frame exceeds that of the light-emitting photosensitive sensor installed in the cavity. In some embodiments, the cutting line of the light-shield frame intersects with the light transmission channel. In some embodiments, in step (d), the transparent packaging layer is arc-shaped. In some embodiments, in step (e), the first line layer is connected to a second line layer on the back face of the package substrate via a conducting post penetrating through the package substrate. In some embodiments, step (c) further comprises: mounting the light-emitting photosensitive sensor on the first heat dissipation layer of the package substrate; andconnecting the first heat dissipation layer to a second heat dissipation layer on the back face of the package substrate via a heat conducting post penetrating through the package substrate. In some embodiments, the cross-section of the light transmission channel is groove-shaped. In some embodiments, the mate