US-12622093-B2 - Chip transferring apparatus for self-assembly and method for supplying semiconductor light emitting diode

US12622093B2US 12622093 B2US12622093 B2US 12622093B2US-12622093-B2

Abstract

A chip transferring apparatus for supplying a micro-LED provides a chip tray for carrying semiconductor light emitting diodes in a fluid received in an assembly chamber. The transferring apparatus includes a tray unit for receiving a plurality of semiconductor light emitting diodes, a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets, and a transfer unit configured to move the tray unit and the chip alignment unit. The transfer unit can vertically move one of the tray unit and the chip alignment unit with respect to the other one thereof.

Inventors

Inbum YANG
Junghun RHO
Sangsik JUNG
Bongwoon CHOI

Assignees

LG ELECTRONICS INC.

Dates

Publication Date: 20260505
Application Date: 20200213
Priority Date: 20190919

Claims (14)

1 . A chip transferring apparatus for transferring semiconductor light emitting devices in a fluid accommodated in an assembly chamber to an assembly surface of an assembly substrate, the chip transferring apparatus comprising: a tray unit for accommodating a plurality of semiconductor light emitting devices, wherein the tray unit comprises a plurality of recesses; a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets disposed at the same distance as the plurality of recesses; a transfer unit configured to transfer the tray unit and the chip alignment unit, unit; and a connection unit connecting the tray unit and the chip alignment unit to the transfer unit, wherein the transfer unit is configured to vertically move the tray unit with respect to the chip alignment unit.
2 . The chip transferring apparatus according to claim 1 , wherein the transfer unit is configured to bring the tray unit closer to the assembly substrate within a first distance at which some of the plurality of semiconductor light emitting devices accommodated in the tray unit are aligned on a surface of the assembly substrate submerged in the fluid.
3 . The chip transferring apparatus according to claim 2 , wherein the transfer unit is configured to bring the tray unit closer to the assembly substrate within the first distance while the tray unit and the chip alignment unit are spaced apart from each other by a predetermined distance.
4 . The chip transferring apparatus according to claim 3 , wherein the transfer unit is configured to separate the tray unit from the assembly substrate by the first distance or more after some of the plurality of semiconductor light emitting devices accommodated in the tray unit move to the assembly substrate.
5 . The chip transferring apparatus according to claim 4 , wherein the transfer unit is configured to vertically move so that the tray unit and the chip alignment unit are adjacent to each other within the first distance after some of the plurality of semiconductor light emitting devices accommodated in the tray unit are moved to the assembly substrate.
6 . The chip transferring apparatus according to claim 1 , wherein the plurality of recesses and the plurality of magnets are arranged to overlap each other.
7 . The chip transferring apparatus according to claim 1 , wherein the connection unit includes first and second connection units, the first connection unit is configured to connect a portion of the transfer unit in which a vertical movement does not occur and the chip alignment unit.
8 . The chip transferring apparatus according to claim 7 , wherein the second connection unit is configured to connect a portion of the transfer unit in which a vertical movement occurs and the tray unit.
9 . The chip transferring apparatus according to claim 1 , wherein the transfer unit is configured to transport the tray unit and the chip alignment unit together horizontally with respect to a bottom surface of the assembly chamber.
10 . The chip transferring apparatus according to claim 9 , wherein when the chip alignment unit is being fixed, the tray unit is configured to move vertically with respect to the bottom surface of the assembly chamber.
11 . The chip transferring apparatus according to claim 1 , wherein the connection unit include first and second connection units, and wherein the first connection unit is connected to the chip alignment unit.
12 . The chip transferring apparatus according to claim 11 , wherein the first connection unit is configured to move horizontally and does not move in a vertical direction.
13 . The chip transferring apparatus according to claim 11 , wherein the second connection unit is connected to the tray unit.
14 . The chip transferring apparatus according to claim 13 , wherein the second connection unit is configured to move perpendicularly to a bottom surface of the assembly chamber.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application is the National Phase of PCT/KR2020/002020 filed on Feb. 13, 2020, which claims priority under 35 U.S.C. § 119(a) to Patent Application Nos. 10-2019-0115574 and 10-2020-0008861 filed in the Republic of Korea on Sep. 19, 2019 and Jan. 22, 2020, respectively, all of these applications are hereby expressly incorporated by reference into the present application. TECHNICAL FIELD The present disclosure relates to a method for manufacturing a display device, and more particularly, to a chip tray for suppling a micro-LED. BACKGROUND ART In recent years, in the field of display technology, liquid-crystal displays (LCD), organic light-emitting diode (OLED) displays, micro-LED displays, etc. have been competing to realize large-area displays. Meanwhile, semiconductor light-emitting diodes (micro-LEDs (μLED)) with a diameter or cross-sectional area less than 100 microns, when used in displays, can offer very high efficiency because the displays do not need a polarizer to absorb light. However, large-scale displays require several millions of semiconductor light-emitting diodes, which makes it difficult to transfer the devices compared to other technologies. Some of the technologies currently in development for the transfer process include pick and place, laser lift-off (LLO), and self-assembly. Among these technologies, the self-assembly approach is a method that allows semiconductor light-emitting diodes to find their positions on their own in a fluid, which is most advantageous in realizing large-screen display devices. Recently, U.S. Pat. No. 9,825,202 disclosed a micro-LED structure suitable for self-assembly, but there is not enough research being carried out on technologies for manufacturing displays by the self-assembly of micro-LEDs. In view of this, the present disclosure proposes a new manufacturing device for self-assembling micro-LEDs. DISCLOSURE Technical Problem One object of the present invention is to provide a new manufacturing process having high reliability in a large-screen display using a micro-sized semiconductor light emitting device. Another object of the present invention is to provide an apparatus for uniformly supplying a semiconductor light emitting device during self-assembly. Technical Solution In order to achieve the above object, the present invention provides a chip tray for transferring semiconductor light emitting devices in a fluid contained in an assembly chamber. The chip tray includes a tray unit for accommodating a plurality of semiconductor light emitting devices, a chip alignment unit disposed on one side of the tray unit, a chip alignment unit including a plurality of magnets, and a transfer unit configured to move the tray unit and the chip alignment unit. The transfer unit is characterized in that it is configured to vertically move any one of the tray unit and the chip alignment unit with respect to the other one. In an embodiment, the transfer unit may bring the tray unit closer to the assembly substrate within a predetermined distance so that some of the semiconductor light emitting devices accommodated in the tray unit are aligned on the surface of the assembly substrate submerged in the fluid. In an embodiment, the transfer unit may bring the tray unit closer to the assembly substrate within a predetermined distance in a state where the tray unit and the chip alignment unit are spaced apart from each other by a predetermined distance. In an embodiment, the transfer unit may separate the tray unit from the assembly substrate by a predetermined distance or more after some of the semiconductor light emitting devices accommodated in the tray unit move to the assembly substrate. In one embodiment, the transfer unit may vertically move so that the tray unit and the chip alignment unit are adjacent to each other within a predetermined distance after some of the semiconductor light emitting devices accommodated in the tray unit are moved to the assembly substrate. In an embodiment, the tray unit may include a plurality of recesses, and the magnets provided in the chip alignment unit may be disposed at the same intervals as the plurality of recesses. In an embodiment, the plurality of recesses and the magnets may be arranged to overlap each other. In one embodiment, the tray unit and the chip alignment unit may further include a connection unit for connecting the transfer unit. In an embodiment, the connection unit includes first and second connection units, the first connection unit is configured to connect a portion of the transfer unit in which a vertical movement does not occur and the chip alignment unit, and the second connection unit may connect a portion of the transfer unit in which a vertical movement occurs and the tray unit. The present invention also provides a method for supplying semiconductor light emitting devices to an assembly substrate in a fluid contained in an assembly chamber. Specifically, the prese