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US-12622111-B2 - Image sensor package, method for manufacturing the same and endoscope using the same

US12622111B2US 12622111 B2US12622111 B2US 12622111B2US-12622111-B2

Abstract

A method for manufacturing an image sensor package is provided, in which a plurality of trenches is provided in the package substrate and the trenches and a plurality of predetermined dicing lines define the desired contour of the package substrate to maximize the space utilization of the image sensor package in the distal end of the endoscope. In addition, the contour of the package substrate matches the shape of the distal end of the endoscope, thus facilitating the positioning and assembly of the image sensor package. An image sensor package manufactured by the abovementioned manufacturing method and an endoscope including the image sensor package are also disclosed.

Inventors

  • SHANGYI WU
  • Jia-De ZHOU

Assignees

  • Medimaging Integrated Solution, Inc.

Dates

Publication Date
20260505
Application Date
20221110
Priority Date
20220406

Claims (18)

  1. 1 . A method for manufacturing an image sensor package, comprising steps: providing a package substrate, wherein the package substrate comprises a first surface, a second surface opposite to the first surface, a plurality trenches and a plurality of predetermined dicing lines; the plurality of trenches penetrates the first surface and the second surface and cooperates with the plurality of predetermined dicing lines to define a plurality of substrate units arranged in array; the first surface of the package substrate of each substrate unit has a plurality of first conductive contacts; the second surface of the package substrate of each substrate unit has a plurality of second conductive contacts and a plurality of third conductive contacts; the plurality of second conductive contacts and the plurality of third conductive contacts are electrically connected with the plurality of corresponding first conductive contacts; disposing an image sensor on the second surface of the package substrate and electrically connecting the image sensor with the plurality of second conductive contacts; disposing at least one light emitting element on the second surface of the package substrate and electrically connecting the at least one light emitting element with the plurality of third conductive contacts; forming an encapsulation body covering sidewalls of the image sensor and the light emitting element and avoiding covering the plurality of trenches and a light input surface of the image sensor; and cutting the package substrate along the plurality of predetermined dicing lines to separate the plurality of substrate units and generate single image sensor packages.
  2. 2 . The method for manufacturing an image sensor package according to claim 1 , wherein the light emitting element further includes a spacer, disposed on the second surface of the package substrate and having a third surface and a fourth surface opposite to the third surface, wherein the third surface has a plurality of fourth conductive contacts electrically connected with the plurality of corresponding third conductive contacts; the fourth surface has a plurality of fifth conductive contacts electrically connected with the plurality of corresponding fourth conductive contacts; and at least one light emitting diode (LED), disposed on the fourth surface of the spacer and electrically connected with the plurality of fifth conductive contacts, wherein the spacer has a preset thickness to make a level of the light input surface of the image sensor higher than or equal to a level of a light output surface of the LED; a difference of the level of the light input surface of the image sensor and the level of the light output surface of the LED is smaller than or equal to a preset value.
  3. 3 . The method for manufacturing an image sensor package according to claim 2 , wherein the difference of the level of the light input surface of the image sensor and the level of the light output surface of the LED is smaller than or equal to 0.8 mm.
  4. 4 . The method for manufacturing an image sensor package according to claim 1 , wherein a plurality of light emitting elements is disposed on the second surface of the package substrate and spatially separated from each other.
  5. 5 . The method for manufacturing an image sensor package according to claim 1 , wherein a plurality of light emitting elements is disposed on the second surface of the package substrate and emits lights respectively having different wavelengths or having an identical wavelength; alternatively, the light emitting element includes a plurality of light emitting diodes emitting lights respectively having different wavelengths or having an identical wavelength.
  6. 6 . The method for manufacturing an image sensor package according to claim 2 , wherein the light emitting element includes at least one of a thermistor and an electrostatic discharge (ESD) protection element, which is disposed on the fourth surface of the spacer and electrically connected with the spacer.
  7. 7 . The method for manufacturing an image sensor package according to claim 1 , wherein the package substrate of each substrate unit includes at least one of a thermistor and an electrostatic discharge (ESD) protection element, which is disposed on the first surface or second surface of the package substrate and electrically connected with the package substrate.
  8. 8 . The method for manufacturing an image sensor package according to claim 1 , wherein at least one of the plurality of trenches is in form of an arc, an oblique straight line, or a polyline.
  9. 9 . The method for manufacturing an image sensor package according to claim 1 , wherein the package substrate of the substrate unit has a contour of a non-rectangular shape.
  10. 10 . The method for manufacturing an image sensor package according to claim 1 , wherein the encapsulation body is manufactured with a one-time mold; the package substrate is cut in a non-demolded state.
  11. 11 . The method for manufacturing an image sensor package according to claim 1 , further comprising a step: forming a shield structure on the sidewall of at least one of the image sensor and the light emitting element.
  12. 12 . The method for manufacturing an image sensor package according to claim 11 , wherein the shield structure is made of an opaque resin or a semi-transparent resin and covers the sidewalls of the image sensor and the light emitting element.
  13. 13 . The method for manufacturing an image sensor package according to claim 1 , further comprising a step: electrically connecting a plurality of electric conduction wires with the plurality of corresponding first conductive contacts.
  14. 14 . The method for manufacturing an image sensor package according to claim 8 , further comprising a step: forming a protection resin to encapsulate joint points of the plurality of first conductive contacts and the plurality of electric conduction wires.
  15. 15 . An image sensor package manufactured by the method for manufacturing an image sensor package according to claim 1 .
  16. 16 . An endoscope, comprising a first tube, having a distal end to be extended into a cavity; a second tube, disposed inside the first tube to function as a working channel; an image sensor package, manufactured by the method for manufacturing an image sensor package according to claim 1 , disposed at the distal end of the first tube and in a receiving space between the first tube and the second tube; and an electric connector, electrically connected with the image sensor package and enabling the endoscope to be electrically connected with an external electronic device in a pluggable way.
  17. 17 . The endoscope according to claim 16 , further comprising an electronic element, electrically connected with the image sensor package and the electric connector and processing electronic signals generated by the image sensor package.
  18. 18 . The endoscope according to claim 16 , further comprising a housing, disposed between the image sensor package and the electric connector.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor package, a method for manufacturing the same and an endoscope using the same, particularly to an image sensor package having an illumination element, a method for manufacturing the same and an endoscope using the same. 2. Description of the Prior Art An endoscope can reach cavities, which the naked eyes are unlikely to observe directly. Therefore, endoscopes have been extensively used in industry and medicine. Especially, the application of endoscopes to medicine favors medical diagnosis very much. An endoscope may access cavities of a human body through tiny channels of the human body. For an example, an endoscope may reach the lung through a bronchial tube. For another example, an endoscope may enter the bladder through the urinary tract. Hence, miniaturizing an endoscope has become an important subject of the concerned field. Refer to FIG. 1. In a conventional endoscope 10, an image sensor 11 and light emitting elements 12 are disposed on a flexible circuit board 13; cables 14 are soldered to the corresponding electric-conduction contacts 131 of the flexible circuit board 13. After the flexible circuit board 13 is bent to have the desired shape, the abovementioned elements are encapsulated with a plastic material to assume a fixed form in an injection-molding method. The conventional technology is more complicated in the structure and fabrication process. Further, the endoscope 10 has a larger size. Besides, the light-output surfaces of the light emitting elements 11 are unlikely to face upwards, and the light emitting elements 12 are hard to be disposed around the image sensor 11. Therefore, the conventional endoscope has disadvantages of low light utilization efficiency, non-uniform illumination, and likeliness of shadows and blind spots. Accordingly, the manufacturers are eager to develop an endoscope that is miniaturized and able to provide uniform illumination. SUMMARY OF THE INVENTION The present invention provides an image sensor package, a method for manufacturing the same and an endoscope using the same, wherein appropriate trenches are formed in a package substrate and cooperate with a plurality of predetermined dicing lines to define the required contour of the package substrate, whereby to maximize the efficiency that the image sensor package utilizes the distal-end space of the endoscope. Further, the shape of the image sensor package matches the distal-end shape of the endoscope, favoring the positioning and assembly of the image sensor package. In one embodiment, the method for manufacturing an image sensor package of the present invention comprises steps: providing a package substrate having a first surface, a second surface opposite to the first surface, a plurality of trenches, and a plurality of predetermined dicing lines, wherein the plurality of trenches penetrates the first surface and the second surface and cooperates with the plurality of predetermined dicing lines to define a plurality of substrate units arranged in array, and wherein the first surface of the package substrate of each substrate unit has a plurality of first conductive contacts, and wherein the second surface of the package substrate of each substrate unit has a plurality of second conductive contacts and a plurality of third conductive contacts, and wherein the plurality of second conductive contacts and the plurality of third conductive contacts are electrically connected with the plurality of corresponding first conductive contacts; disposing an image sensor on the second surface of the package substrate and electrically connecting the image sensor with the plurality of second conductive contacts; disposing at least one light emitting element on the second surface of the package substrate and electrically connecting the light emitting element with the third conductive contacts; forming an encapsulation body covering the sidewalls of the image sensor and the light emitting element and avoiding covering the plurality of trenches and a light input surface of the image sensor; cutting the package substrate along the plurality of dicing lines to separate the plurality of substrate units and generate single image sensor packages. In one embodiment, the image sensor package of the present invention is manufactured according to the abovementioned method for manufacturing an image sensor package. In one embodiment, the endoscope of the present invention comprises a first tube, a second tube, an image sensor package and an electric connector. A distal end of the first tube is used to extend to a cavity. The second tube is disposed inside the first tube to function as a working channel. The image sensor package is manufactured according to the abovementioned method for manufacturing an image sensor package and disposed at a distal end of the first tube and in a receiving space between the first tube and the second tube.