US-12622116-B2 - Device and a method for manufacturing the same

US12622116B2US 12622116 B2US12622116 B2US 12622116B2US-12622116-B2

Abstract

The present disclosure provides devices and method of manufacturing the devices. An example device includes a substrate, a first electrode on the substrate, a light-emitting element electrically connected to the first electrode by a first metal wiring, and a second electrode electrically connected to the light-emitting element. The first electrode and the light-emitting element are laterally separated from each other. The light-emitting element is connected to the first metal wiring at a side that faces the substrate.

Inventors

Tsuyoshi Ogawa

Assignees

HUAWEI TECHNOLOGIES CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20221227

Claims (17)

1 . A device comprising: a substrate; a first electrode on the substrate, wherein the first electrode comprises a pad on the substrate and a first contact metal electrically connected to the pad; a light-emitting element electrically connected to the first electrode by a first metal wiring, wherein the first metal wiring is electrically connected to the first contact metal; a second electrode electrically connected to the light-emitting element, wherein the first electrode and the light-emitting element are laterally separated from each other, and wherein the light-emitting element is connected to the first metal wiring at a side that faces the substrate; a first dielectric layer including the light-emitting element, wherein a thickness of the first dielectric layer is greater than or equal to a thickness of the light-emitting element; an adhesive layer on the substrate, wherein a thickness of the pad is less than or equal to a thickness of the adhesive layer; and a second dielectric layer on the first electrode, wherein at least one of the first dielectric layer or the second dielectric layer is made of a photosensitive transparent resin.
2 . The device of claim 1 , comprising a plurality of light-emitting elements having different thicknesses.
3 . The device of claim 1 , wherein the light-emitting element is a vertical type micro-light-emitting diode (LED).
4 . The device of claim 1 , further comprising: a third electrode on the substrate; a repair light-emitting element electrically coupled to the third electrode; and a fourth electrode electrically connected to the repair light-emitting element, wherein the repair light-emitting element covers at least a portion of the third electrode.
5 . The device of claim 4 , wherein the second electrode and the fourth electrode are common electrodes.
6 . The device of claim 4 , wherein the second electrode and the fourth electrode are transparent electrodes.
7 . A method of manufacturing a device, comprising: arranging a light-emitting element on a carrier; forming a first dielectric layer on the carrier so that the light-emitting element is exposed; forming a metal wiring on the light-emitting element and the first dielectric layer; forming an adhesive layer on a substrate having a pad; bonding the carrier and the substrate, wherein the metal wiring on the carrier faces the pad and the adhesive layer on the substrate, and wherein the light-emitting element and the pad are laterally separated from each other; removing the carrier; etching the first dielectric layer and the adhesive layer until reaching the pad to form an opening; depositing a contact metal on the opening so that the pad and the metal wiring are electrically connected each other; forming a second dielectric layer on at least the first dielectric layer so that the light-emitting element is exposed; and forming an electrode on the light-emitting element.
8 . The method of claim 7 , wherein the light-emitting element is a vertical type micro-light-emitting diode (LED).
9 . The method of claim 7 , wherein a thickness of the first dielectric layer is greater than or equal to a thickness of the light-emitting element.
10 . The method of claim 7 , wherein the light-emitting element comprises a plurality of light-emitting elements having different thicknesses.
11 . The method of claim 7 , wherein a thickness of the pad is less than or equal to a thickness of the adhesive layer.
12 . The method of claim 7 , wherein arranging the light-emitting element on the carrier comprises: transferring the light-emitting element provided on a spare substrate to a spare carrier; and transferring the light-emitting element transferred to the spare carrier to the carrier.
13 . The method of claim 7 , wherein the electrode is a common electrode.
14 . The method of claim 7 , wherein the electrode is a transparent electrode.
15 . The method of claim 7 , wherein at least one of the adhesive layer, the first dielectric layer, or the second dielectric layer is made of a photosensitive transparent resin.
16 . The method of claim 7 , comprising: prior to forming the second dielectric layer, testing an operation of the light-emitting element; if the light-emitting element does not operate, cutting the metal wiring connected to the non-operating light-emitting element; and arranging a repair light-emitting element on a contact metal connected to the cut metal wiring.
17 . The device of claim 1 , wherein the adhesive layer includes a thermoset adhesive or a UV-curable adhesive.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No. PCT/CN2020/098457, filed on Jun. 28, 2020, the disclosure of which is hereby incorporated by reference in its entirety. TECHNICAL FIELD The present disclosure relates to a device and a method for manufacture the same. In particular, the present disclosure relates to a display and a method for manufacturing the same using micro-LED. BACKGROUND ART In various applications such as mobile phones, automatic display, AR, VR, monitor, TV, and large screen display, etc., high resolution, high brightness, wide viewing angle, and low power consumption, etc. are required, and the need for a display using micrometer-size LED (micro-LED) is increasing. SUMMARY OF INVENTION Technical Problem However, one of the problems with a display, which uses a micro-LED, is a high assembly cost. Conventionally, since the LED has been connected one by one by using bonding processes such as a wire bonding and a flip-chip bonding, the manufacturing cost is high. Therefore, as the number of pixels increases, the manufacturing cost increases. For example, in the case of a 4K display, about 25,000,000 micro-LED are used. Even if the yield of the micro-LED is 99.99%, it is necessary to repair about 2500 micro-LED. A gang-bonding method as shown in FIG. 1 is present as a method to reduce assembly costs. The gang-bonding method allows a plurality of micro-LED 3 to be bonded to a substrate 1 through the solder 2 at a time, by applying pressure to the plurality of micro-LED 3 by a bonding head 4. However, since the thicknesses of the plurality of micro-LED 3 may vary, the thickness variation absorption film 5 is required for canceling the difference of thicknesses. Even if the thickness variation absorption film 5 is used, the variation in the thickness of the plurality of micro-LED 3 may not be completely cancelled. As a result, different stresses can be applied on the plurality of micro-LED 3. In particular, since the red-light emitting micro-LED 3 can be fabricated from a fragile GaAs, it is easily destroyed by an excessive stress. Therefore, the production of devices using the gang-bonding method has a low yield. Also, the larger the device's area, the greater the variation of the stresses applied to the device. Moreover, the gang-bonding method has a small area that can be accurately bonded at one time, due to the limited size of the bonding head 4. Therefore, it is difficult to manufacture large screen displays by the gang-bonding method. In addition, manufacturers need to verify that the micro-LED in the device is operating normally during or after the manufacturing process. However, it is difficult to repair the micro-LED embedded in the device. Therefore, there is a need for a display and a manufacturing method that have inexpensive manufacturing cost and high yields. Solution to Problem The first aspect of the present disclosure is a device comprising: a substrate;a first electrode on the substrate;a light-emitting element electrically connected to the first electrode by a first metal wiring; anda second electrode electrically connected to the light-emitting element,wherein the first electrode and the light-emitting element are laterally separated from each other, andwherein the light-emitting element is connected to the first metal wiring at the side which faces the substrate. In the above aspect of the present disclosure, the device may further comprise a first aspect including the light-emitting element, wherein a thickness of the first dielectric layer may be greater than or equal to a thickness of the light-emitting element. In the above aspect of the present disclosure, the first electrode may comprise a pad on the substrate, a first contact metal electrically connected to the pad, and wherein the first metal wiring may be electrically connected to the first contact metal. In the above aspect of the present disclosure, the device may further comprise an adhesive layer on the substrate, wherein a thickness of the pad may be less than or equal to a thickness of the adhesive layer. In the above aspect of the present disclosure, the device may further comprise a second dielectric layer on the first electrode, wherein at least one of the first dielectric layer and the dielectric layer may be made of a photosensitive transparent resin. In the above aspect of the present disclosure, the device may comprise a plurality of the light-emitting elements having different thicknesses. In the above aspect of the present disclosure, the light-emitting element may be a vertical type micro-LED. In the above aspect of the present disclosure, the device may further comprise: a third electrode on the substrate;a repair light-emitting element electrically coupled to the third electrode; anda fourth electrode electrically connected to the repair light-emitting element,wherein the repair light-emitting element may cover at least a portion of the