US-12622118-B2 - Wiring substrate, display substrate and display apparatus

US12622118B2US 12622118 B2US12622118 B2US 12622118B2US-12622118-B2

Abstract

A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.

Inventors

Jie Wang
Zouming Xu
Jian Tian
Chunjian Liu
Xintao Wu
Jie Lei
Jianying Zhang

Assignees

HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
BOE TECHNOLOGY GROUP CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20250305

Claims (16)

1 . A wiring substrate, comprising: a base substrate; and a plurality of control areas on a side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas comprising: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which is electrically connected with a corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, wherein an orthographic projection of the first connection line on the base substrate not overlapping with an orthographic projection of the signal line on the base substrate; and pads in corresponding drive circuit pad groups between two adjacent control areas of the plurality of control areas are arranged in a mirror symmetry manner.
2 . The wiring substrate of claim 1 , wherein the signal line comprises a ground signal line and a power supply signal line; the drive circuit pad group comprises a ground pad and a power supply pad, wherein the ground pad is located at a side of the power supply pad close to the ground signal line, the ground pad is electrically connected with the ground signal line, and the power supply pad is electrically connected with the power supply signal line.
3 . The wiring substrate of claim 2 , further comprising a binding area; wherein the drive circuit pad group further comprises an input pad and an output pad, wherein the output pad is located at a position of the drive circuit pad group close to the functional element pad group.
4 . The wiring substrate of claim 3 , wherein the plurality of control areas comprise a third control area and a fourth control area adjacent in the second direction, wherein a plurality of drive circuit pad groups in the third control area are sequentially connected in cascade in the first direction from the side close to the binding area, a plurality of drive circuit pad groups in the fourth control area are sequentially connected in cascade in the first direction from the side close to the binding area, and a power supply signal line connected with a power supply pad in the third control area and a power supply signal line connected with a power supply pad in the fourth control area are located in a gap between a ground signal line connected with a ground pad in the third control area and a ground signal line connected with a ground pad in the fourth control area.
5 . The wiring substrate of claim 4 , wherein the plurality of drive circuit pad groups in a same one control area are electrically connected with a same power supply signal line and are electrically connected with a same ground signal line.
6 . The wiring substrate of claim 5 , wherein the third control area and the fourth control area share a same power supply signal line.
7 . The wiring substrate of claim 5 , wherein the third control area and the fourth control area are arranged in a mirror symmetry manner.
8 . The wiring substrate of claim 7 , wherein in the drive circuit pad group, the output pad and the power supply pad are located in a same row, and the output pad and the ground pad are located in a same column.
9 . The wiring substrate of claim 6 , wherein the wiring substrate further comprises a third connection line; wherein a drive circuit pad group in the third control area farthest away from the binding area is connected in cascade with a drive circuit pad group in the fourth control area farthest away from the binding area via the third connection line.
10 . The wiring substrate of claim 9 , wherein in at least one fourth control area, the first connection line comprises a third connection sub-segment and a fourth connection sub-segment; wherein an orthographic projection of the third connection sub-segment on the base substrate overlaps an orthographic projection of the drive circuit pad group on the base substrate, one end of the third connection sub-segment is electrically connected with the output pad, and the other end of the third connection sub-segment is electrically connected with one end of the fourth connection sub-segment; the other end of the fourth connection sub-segment is electrically connected with an input pad DI of a next stage of drive circuit pad group.
11 . The wiring substrate of claim 10 , wherein a main body of the third connection sub-segment extends in the first direction, and the orthographic projection of the third connection sub-segment on the base substrate is located at a gap between an orthographic projection of the input pad on the base substrate and an orthographic projection of the ground pad on the base substrate.
12 . The wiring substrate of claim 11 , wherein a width of the third connection sub-segment in the second direction is ⅕ to ⅘ of a minimum spacing between the input pad and the ground pad.
13 . The wiring substrate of claim 1 , further comprising a power line at a side of the functional element pad group far away from the power supply signal line, wherein the functional element pad groups in a same control area are electrically connected with a same power line.
14 . The wiring substrate of claim 13 , wherein the functional element pad group comprises a plurality of pad sub-groups sequentially connected in series.
15 . A display substrate, comprising a wiring substrate, wherein the wiring substrate comprises: a base substrate; and a plurality of control areas on a side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas comprising: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which is electrically connected with a corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, wherein an orthographic projection of the first connection line on the base substrate not overlapping with an orthographic projection of the signal line on the base substrate; and pads in corresponding drive circuit pad groups between two adjacent control areas of the plurality of control areas are arranged in a mirror symmetry manner; wherein the functional element pad group comprises a plurality of pad sub-groups sequentially connected in series; and the display substrate further comprises drive circuits in binding connection with the drive circuit pad groups, and light-emitting elements in binding connection with the pad sub-groups.
16 . A display apparatus, comprising the display substrate according to claim 15 .

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is continuation of U.S. application Ser. No. 17/785,522, filed on Jun. 15, 2022, which is a national phase entry under 35 U.S.C. § 371 of International Application No. PCT/CN2021/116166, filed on Sep. 2, 2021, the entire content of which is incorporated herein by reference. FIELD The disclosure relates to the technical field of semiconductors, and in particular to a wiring substrate, a display substrate and a display apparatus. BACKGROUND With the mini light-emitting diode (Mini LED) technology growing increasingly mature, display and backlight products of glass-based Mini LEDs are developed by panel factories at present. Active drive product, due to higher efficiency, larger-area drive, better brightness uniformity and greater contrast ratio, is a preferred solution of the drive circuit for the large-size Mini LED backlight product. SUMMARY The disclosure provides a wiring substrate, a display substrate and a display apparatus. The wiring substrate includes: a base substrate; anda plurality of control areas on a side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction;a plurality of functional element pad groups, each of which is electrically connected with a corresponding drive circuit pad group;a plurality of signal lines, main bodies of which extend in the first direction; andfirst connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, where an orthographic projection of the first connection line on the base substrate not overlapping with an orthographic projection of the signal line on the base substrate. In one possible implementation, the signal line includes a ground signal line and a power supply signal line, the ground signal line and the power supply signal line being located at two sides of the drive circuit pad group respectively; and the drive circuit pad group includes a ground pad and a power supply pad. The drive circuit pad group includes a ground pad and a power supply pad, where the ground pad is located at a side of the power supply pad close to the ground signal line, the ground pad is electrically connected with the ground signal line, and the power supply pad is electrically connected with the power supply signal line. In one possible implementation, the wiring substrate includes a binding area. The drive circuit pad group further includes an input pad and an output pad, where the output pad is located at a position of the drive circuit pad group close to the functional element pad group. In one possible implementation, arrangement modes of the input pad, the output pad, the ground pad and the power supply pad are different in the drive circuit pad groups of two adjacent control areas of the plurality of control areas. In one possible implementation, the plurality of control areas include a first control area and a second control area adjacent in the second direction. A plurality of drive circuit pad groups in the first control area are sequentially connected in cascade in the first direction from a side close to the binding area, and a plurality of drive circuit pad groups in the second control area are sequentially connected in cascade in the first direction from a side far away from the binding area. A drive circuit pad group in the first control area farthest away from the binding area is connected in cascade with a drive circuit pad group in the second control area farthest away from the binding area. In the drive circuit pad group in the first control area, the output pad and the input pad are located in different rows, and in the drive circuit pad group in the second control area, the output pad and the input pad are located in a same row. In one possible implementation, in the drive circuit pad group in the first control area, the output pad and the power supply pad are located in a same row, and the output pad and the ground pad are located in a same column. In the drive circuit pad group in the second control area, the output pad and the input pad are located in a same row, and the output pad and the ground pad are located in a same column. In one possible implementation, in the drive circuit pad group in the first control area, the output pad and the ground pad are located in a same row, and the output pad and the power supply pad are located in a same column. In the drive circuit pad group in the second control area, the output pad and the input pad are located in a same row, and the output pad and the ground pad are located in a same column. In one possible implementation, in at least one of the plurality of control areas, the first connection line includes a first connection sub-segm