US-12622119-B2 - Heat dissipation structure for LED light

US12622119B2US 12622119 B2US12622119 B2US 12622119B2US-12622119-B2

Abstract

Disclosed are an LED light and a heat dissipation device thereof. The LED light comprises at least one LED light bead disposed on the heat dissipation device. The heat dissipation device comprises a circuit board having a first metal layer and a second metal layer located on two opposite sides respectively; and a heat sink. The LED light bead is welded to the first metal layer. The second metal layer is welded to the heat sink. The circuit board has heat conductive holes, so that a heat energy generated by the LED light bead can be transferred to the heat sink through the heat conductive holes. Some of the heat conductive holes can be optionally filled with heat conductive material columns, so that the heat energy generated by LED light bead can be conducted to the heat sink through the heat conductive material columns in the heat conductive holes.

Inventors

Shin-Hua Tseng

Assignees

Finesse Technology Co., Ltd.

Dates

Publication Date: 20260505
Application Date: 20240924
Priority Date: 20240716

Claims (17)

1 . A heat dissipation device applicable for eliminating a heat energy generated by at least one LED light bead, comprising: a circuit board equipped with at least one first metal layer and at least one second metal layer respectively located on two opposite sides, the circuit board having at least one heat conductive hole, wherein the first metal layer of the circuit board is connected to a heat dissipation base of the LED light bead through a first heat conductive material layer, so that the heat energy generated by the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board through the first heat conductive material layer, the first metal layer and the heat conductive hole; and a heat sink, wherein the second metal layer of the circuit board is connected to the heat sink through a second heat conductive material layer, so that the heat energy generated by the LED light bead is conducted from the second metal layer to the heat sink through the second heat conductive material layer, wherein materials of the first heat conductive material layer and/or the second heat conductive material layer is/are respectively selected from a group consisting of solder tin and silver glue.
2 . The heat dissipation device as claimed in claim 1 , wherein an area of the second metal layer of the circuit board is at least larger than an area of the heat sink connected to the second metal layer of the circuit board through the second heat conductive material layer.
3 . The heat dissipation device as claimed in claim 1 , wherein a position where the heat conductive hole being formed on the circuit board is located in an area where the heat dissipation base of the LED light bead is connected to the first metal layer of the circuit board via the first heat conductive material layer.
4 . The heat dissipation device as claimed in claim 1 , wherein the heat conductive hole is filled with at least one heat conductive material column connecting with the first heat conductive material layer and the second heat conductive material layer, and the at least one heat conductive material column is used to conduct the heat energy generated by the LED light bead from the first heat conductive material layer to the second heat conductive material layer.
5 . The heat dissipation device as claimed in claim 4 , wherein material of the heat conductive material column is selected from a group consisting of solder tin and silver glue.
6 . The heat dissipation device as claimed in claim 4 , wherein material of the heat conductive material column is heat conductive adhesive.
7 . The heat dissipation device as claimed in claim 1 , wherein the heat conductive hole is formed with a third metal layer on an inner wall of the circuit board to connect with the first metal layer and the second metal layer, and the heat energy generated by the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board through the first heat conductive material layer, the first metal layer, the heat conductive hole and the third metal layer in the heat conductive hole.
8 . The heat dissipation device as claimed in claim 1 , wherein the circuit board is a copper foil circuit board, and the first metal layer and/or the second metal layer are respectively a copper foil or is a copper foil.
9 . The heat dissipation device as claimed in claim 1 , wherein a material of the heat sink is a pure copper metal.
10 . The heat dissipation device as claimed in claim 1 , wherein the heat sink is a copper column radiating fin, a water-cooling heat sink, a fan-assisted copper column radiating fin or a fan-assisted water-cooling heat sink.
11 . The heat dissipation device as claimed in claim 1 , wherein a number of the heat conductive hole is more than one, a plurality of first heat conductive holes among the heat conductive holes are respectively filled with a heat conductive material column, and a plurality of second heat conductive holes among the heat conductive holes are hollow.
12 . The heat dissipation device as claimed in claim 11 , wherein positions where the first heat conductive holes being formed on the circuit board are located in an area where the heat dissipation base of the LED light bead is connected to the first metal layer of the circuit board via the first heat conductive material layer, and positions where the second heat conductive holes being formed on the circuit board are located outside the area where the heat dissipation base of the LED light bead is connected to the first metal layer of the circuit board via the first heat conductive material layer.
13 . The heat dissipation device as claimed in claim 1 , wherein the circuit board is a double-layer board or a multi-layer board.
14 . An LED light, comprising: at least one LED light bead; and the heat dissipation device as claimed in claim 1 , wherein the LED light bead is disposed on the heat dissipation device for eliminating the heat energy generated by the LED light bead through the heat dissipation device.
15 . A heat dissipation device applicable for eliminating a heat energy generated by at least one LED light bead, comprising: a copper foil circuit board equipped with at least one first copper foil and at least one second copper foil located on two opposite sides, the LED light bead being welded to the first copper foil; and a heat sink, the heat sink being welded to the second copper foil, the copper foil circuit board having at least one copper-plated heat conductive hole, so that the heat energy generated by the LED light bead being transferred to the heat sink through the copper-plated heat conductive hole, wherein a number of the at least one copper-plated heat conductive hole is more than one, and among the copper-plated heat conductive holes, only at least one first copper-plated heat conductive hole located in a welding area between the heat sink and the second copper foil is filled with solder tin or silver glue.
16 . The heat dissipation device as claimed in claim 15 , wherein an area of the second copper foil is larger than an area of the heat sink where the second copper foil is welded.
17 . The heat dissipation device as claimed in claim 14 , wherein at least one second copper-plated heat conductive hole among the copper-plated heat conductive holes located outside the welding area between the heat sink and the second copper foil is not filled with solder tin or silver glue.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims priority from Taiwan Patent Application No. 113126584, filed on Jul. 16, 2024, each of which is hereby incorporated herein by reference in its entireties. BACKGROUND OF THE DISCLOSURE 1. Field of Disclosure The disclosure relates to a lamp and a heat dissipation device thereof, more particularly to a high heat dissipation light-emitting diode (LED) light and a heat dissipation device of the same. 2. Related Art Light-emitting diode (LED) is a semiconductor component. The wavelength of light emitted by the LED varies depending on the materials used. At present, the photoelectric conversion efficiency of high-power LEDs is generally about 15%˜25% of the input power becoming light, and the rest is converted into heat energy. Due to the small area of the LED chip, the heat density per unit area of high-power LEDs is very high, even more serious than that of ordinary IC components. This also causes the junction temperature of the LED chip to increase significantly, easily causing overheating problems. Excessively high chip junction temperature will reduce the luminous brightness of the LED, and will also cause the wavelength of the LED to shift, affecting the quality and specifications, and significantly reducing the service life of the LED. Therefore, the heat dissipation design of LED-related products is very important. At present, the commonly used welding method for high-power LEDs is to first weld the LED to an aluminum substrate or a copper substrate, and then connect the aluminum substrate or the copper substrate to the heat sink with heat dissipation glue. However, this conventional connection method needs to pass through the insulating layer on the substrate, making it impossible to achieve good heat conduction and heat dissipation effects. PCT Patent No. WO2014166113A1 (entitled: highly heat-conductive LED welding method) discloses a highly heat-conductive LED welding method, comprising the following steps: welding electrodes of the LED to a circuit board using high-temperature soldering tin; directly welding a heat-dissipation pole plate of the LED to a heat dissipation device using low-temperature soldering tin; and directly contacting the heat-dissipation pole plate of the LED with the heat dissipation device, so that the LED has good effects of heat conduction and heat dissipation. However, the method disclosed in this patent will significantly increase the difficulty and technics costs of circuit board production. In addition, Taiwan Patent No. TW201248947A (entitled: thermal structure for LED device) discloses that the circuit board is provided with multiple heat conduction circuits. The heat conduction circuits are connected to the heat conduction area of the LED, the circuit board and the heat dissipation plate are locked together with screws, and the screws are in contact with the heat conduction circuits of the LED. The heat conduction path of this patent is: the LED heat conduction area, the circuit board circuits, the screws and the heat dissipation plate. However, this heat conduction method is limited by the small areas of the heat conduction circuits and the screws, resulting in limited heat dissipation effects. SUMMARY OF THE DISCLOSURE In view of this, in order to solve the problems of declined LED specifications, quality and shortened service life due to excessive heat generation of LEDs, an object of the disclosure is to provide an LED light and a heat dissipation device of the same. The disclosure uses materials with high thermal conductivity coefficients such as solder tin or silver glue, and heat conductive holes to replace conventional heat dissipation glue and screws, enabling the solder tin/silver glue to be directly connected to a heat sink to achieve effective heat dissipation. Compared with the prior art, a circuit board of the disclosure can achieve good heat dissipation effects using a commercially available circuit board without requiring complicated circuit design and high technics costs. In order to achieve the above object, the disclosure discloses an LED light comprising at least one LED light bead; and a heat dissipation device, wherein the LED light bead is disposed on the heat dissipation device to eliminate a heat energy generated by the LED light bead through the heat dissipation device. In order to achieve the above object, the disclosure further discloses a heat dissipation device applicable for eliminating a heat energy generated by at least one LED light bead, comprising: a circuit board equipped with at least one first metal layer and at least one second metal layer respectively located on two opposite sides, the circuit board has at least one heat conductive hole, wherein the first metal layer of the circuit board is connected to a heat dissipation base of the LED light bead through a first heat conductive material layer, so that the heat energy generated by the LED light bead is transferred fro