US-12622156-B2 - Display panel encapulation structure and method of manufacturing the same

US12622156B2US 12622156 B2US12622156 B2US 12622156B2US-12622156-B2

Abstract

Embodiments of the present application provide an encapsulation structure, a display panel and a method of manufacturing the display panel. The encapsulation structure includes the barrier structure layer. In the barrier structure layer, the first barrier layer is adopted to fix the protrusion structure, and the second barrier layer is utilized to wrap the protrusion structure. The encapsulation structure provided by the embodiment of the present application implements the effective wrapping on the protrusion structure, solves the crack problem of the barrier layer caused by the protrusion structure, and thus enhances the service lifetime and reliability of the display panel.

Inventors

Yang Miao

Assignees

Huizhou China Star Optoelectronics Display Co., Ltd.
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20210903
Priority Date: 20210825

Claims (20)

1 . A display panel, comprising: an array substrate; a light-emitting device disposed on the array substrate, wherein a side surface of the light-emitting device away from the array substrate has a protrusion structure; and an encapsulation structure comprising one or multiple barrier structure layers, the barrier structure layer or each of the barrier structure layers comprising: a first barrier layer comprising a first part and a second part, wherein the first part is disposed on the side surface of the light-emitting device away from the array substrate, the second part is disposed on a side surface of the protrusion structure away from the array substrate, and a gap is formed between the first part and the second part to separate the first part from the second part; and a second barrier layer wrapping the protrusion structure, being at least partially in direct contact with the gap and covering the gap, and covering a side surface of the first barrier layer away from the array substrate.
2 . The display panel according to claim 1 , wherein the first part is formed with multiple limit slots, and the protrusion structures are correspondingly disposed in the limit slots.
3 . The display panel according to claim 1 , wherein a thickness of the first barrier layer is smaller than a height of the protrusion structure.
4 . The display panel according to claim 3 , wherein the thickness of the first barrier layer ranges from 10% to 50% of the height of the protrusion structure.
5 . The display panel according to claim 1 , wherein a thickness of the first barrier layer is greater than a thickness of the second barrier layer.
6 . The display panel according to claim 1 , wherein a thickness of the second barrier layer ranges from 5 nm to 50 nm.
7 . The display panel according to claim 1 , wherein a material of the first barrier layer is selected from a group consisting of nitride, oxide and nitrogen oxide.
8 . The display panel according to claim 1 , wherein a material of the second barrier layer is selected from a group consisting of nitride, oxide and nitrogen oxide; wherein a part of a surface of the protrusion structure is exposed from the gap, and the second barrier layer is in contact with the exposed part of the surface of the protrusion structure.
9 . The display panel according to claim 1 , wherein the encapsulation structure further comprises an organic layer disposed on one side of the barrier structure layer.
10 . The display panel according to claim 9 , wherein the encapsulation structure comprises the barrier structure layers being two barrier structure layers, and the organic layer is disposed between the two barrier structure layers.
11 . The display panel according to claim 9 , wherein the encapsulation structure further comprises an inorganic layer, and the organic layer is disposed between the barrier structure layer and the inorganic layer.
12 . The display panel according to claim 11 , wherein a thickness of the inorganic layer ranges from 20 nm to 1500 nm.
13 . The display panel according to claim 11 , wherein a material of the inorganic layer is selected from a group consisting of nitride, oxide and nitrogen oxide.
14 . The display panel according to claim 9 , wherein a material of the organic layer is selected from a group consisting of an ultra-violet light sensitive polymer, an epoxy polymer and an acrylic polymer.
15 . The display panel according to claim 9 , wherein a thickness of the organic layer ranges from 1 μm to 5 μm.
16 . The display panel according to claim 1 , wherein the display panel further comprises a flat filling layer disposed on one side of the encapsulation structure away from the array substrate.
17 . The display panel according to claim 1 , wherein the protrusion structure comprises particles, a gel or impurities.
18 . A method of manufacturing a display panel, the method comprising steps of: providing an array substrate; disposing a light-emitting device on the array substrate, wherein a side surface of the light-emitting device away from the array substrate has a protrusion structure; disposing a first part of a first barrier layer on the side surface of the light-emitting device away from the array substrate, and disposing a second part of the first barrier layer on a side surface of the protrusion structure away from the array substrate with a gap being formed between the first part and the second part to separate the first part from the second part; disposing, on one side of the first barrier layer away from the array substrate, a second barrier layer wrapping the protrusion structure, being at least partially in direct contact with the gap and covering the gap, and covering a side surface of the first barrier layer away from the array substrate.
19 . The method according to claim 18 , wherein the step of disposing the first part on the side surface of the light-emitting device away from the array substrate, and disposing the second part on the side surface of the protrusion structure away from the array substrate with the gap being formed between the first part and the second part to form the first barrier layer comprises: transferring the array substrate disposed with the light-emitting device into a chamber, and introducing a reaction gas into the chamber; and ionizing the reaction gas to form reactive plasma, wherein: the reactive plasma undergoes a chemical reaction, and is deposited on the side surface of the light-emitting device away from the array substrate to form the first part; the reactive plasma undergoes the chemical reaction and is deposited on one side of the protrusion structure away from the array substrate to form the second part, wherein the gap is formed between the first part and the second part to form the first barrier layer.
20 . The method according to claim 18 , wherein the step of disposing, on the one side of the first barrier layer away from the array substrate, the second barrier layer wrapping the protrusion structure, covering the gap, and covering the side surface of the first barrier layer away from the array substrate comprises: transferring the array substrate disposed with the light-emitting device and the first barrier layer into a chamber, and alternately introducing a first reaction gas and a second reaction gas into the chamber, wherein: the first reaction gas and the second reaction gas are deposited on the side surface of the first barrier layer embedded with the protrusion structure and undergo a chemical reaction to form the second barrier layer wrapping the protrusion structure and the gap, and covering the side surface of the first barrier layer away from the array substrate.

Description

FIELD OF INVENTION The present application relates to a technical field of a display, and more particularly to a display panel and a method of manufacturing the same. BACKGROUND OF INVENTION An organic light-emitting diode (OLED) display has the self-luminous property and does not need any backlight source. The OLED display further has the advantages including the high contrast, wide color gamut, thin thickness, fast response, application to a flexible panel and the like. However, the OLED device is sensitive to water and oxygen, and needs to be effectively encapsulated to isolate the OLED device from the water and oxygen. A common encapsulation method is to form a water and oxygen barrier film on the OLED panel. However, protrusion structures are frequently present on the OLED device, and tend to cause cracks in the barrier film. These cracks become channels through which the water and oxygen invade, thereby shortening the service lifetime of the OLED panel. SUMMARY OF INVENTION An embodiment of the present application provides a display panel and a method of manufacturing the display panel to lengthen the service lifetime of the OLED panel. Technical Solutions The embodiment of the present application provides a display panel including: an array substrate; a light-emitting device disposed on the array substrate, wherein a side surface of the light-emitting device away from the array substrate has a protrusion structure; and an encapsulation structure including one or multiple barrier structure layers, the barrier structure layer or each of the barrier structure layers including: a first barrier layer embedded with the protrusion structure, wherein the first barrier layer includes a first part and a second part, the first part is disposed on a side surface of the light-emitting device away from the array substrate, the second part is disposed on one side of the protrusion structure away from the array substrate, and a gap is formed between the first part and the second part; and a second barrier layer wrapping the protrusion structure and the gap and extending to a side surface of the first barrier layer away from the array substrate. Optionally, in some embodiments of the present application, the first part is formed with multiple limit slots, and the protrusion structures are correspondingly disposed in the limit slots. Optionally, in some embodiments of the present application, a thickness of the first barrier layer is smaller than a height of the protrusion structure. Optionally, in some embodiments of the present application, the thickness of the first barrier layer ranges from 10% to 50% of the height of the protrusion structure. Optionally, in some embodiments of the present application, the thickness of the first barrier layer is greater than a thickness of the second barrier layer. Optionally, in some embodiments of the present application, the thickness of the second barrier layer ranges from 5 nm to 50 nm. Optionally, in some embodiments of the present application, a material of the first barrier layer is selected from a group consisting of nitride, oxide and nitrogen oxide. Optionally, in some embodiments of the present application, a material of the first barrier layer is selected from a group consisting of nitride, oxide and nitrogen oxide. Optionally, in some embodiments of the present application, the encapsulation structure further includes an organic layer disposed on one side of the barrier structure layer. Optionally, in some embodiments of the present application, the encapsulation structure includes the two barrier structure layers, and the organic layer is disposed between the two barrier structure layers. Optionally, in some embodiments of the present application, the encapsulation structure further includes an inorganic layer, and the organic layer is disposed between the barrier structure layer and the inorganic layer. Optionally, in some embodiments of the present application, a thickness of the inorganic layer ranges from 20 nm to 1500 nm. Optionally, in some embodiments of the present application, a material of the inorganic layer is selected from a group consisting of nitride, oxide and nitrogen oxide. Optionally, in some embodiments of the present application, a material of the organic layer is selected from a group consisting of an ultra-violet light sensitive polymer, an epoxy polymer and an acrylic polymer. Optionally, in some embodiments of the present application, a thickness of the organic layer ranges from 1 μm to 5 μm. Optionally, in some embodiments of the present application, the display panel further includes a flat filling layer disposed on one side of the encapsulation structure away from the array substrate. Optionally, in some embodiments of the present application, the protrusion structure includes particles, a gel or impurities. Correspondingly, the embodiment of the present application further provides a method of manufacturing the display panel, the method