US-12622157-B2 - Encapsulation structure and display device having the encapsulation structure

US12622157B2US 12622157 B2US12622157 B2US 12622157B2US-12622157-B2

Abstract

An encapsulation structure includes an organic encapsulation layer. The organic encapsulation layer includes a base resin and hygroscopic composite particles including a hygroscopic composite particle. The hygroscopic composite particle includes a core and a silica layer around the core. The core includes a polymer. The silica layer includes silica.

Inventors

Jieun Ko
HYEONSEO CHO
Yohan Kim
Yisu Kim
Wonmin Yun
Byoungduk Lee
SeungJu Lee
Jaehyuk Lee
Hyungdong Lee
Yoonhyeung Cho

Assignees

SAMSUNG DISPLAY CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20211028
Priority Date: 20210303

Claims (19)

1 . An encapsulation structure comprising: an organic encapsulation layer that comprises a base resin and a plurality of hygroscopic composite particles, each of the hygroscopic composite particles comprising a core and a silica layer directly around the core, wherein the core comprises a polymer, wherein the silica layer consists of silica and is configured to maintain a shape of the hygroscopic composite particle, and wherein the hygroscopic composite particles are uniformly dispersed in the entire organic encapsulation layer.
2 . The encapsulation structure of claim 1 , wherein an average diameter of the hygroscopic composite particles is in a range from about 30 nm to about 1 μm.
3 . The encapsulation structure of claim 1 , wherein a thickness of the silica layer is in a range from about 10 nm to about 500 nm.
4 . The encapsulation structure of claim 1 , wherein the polymer comprises at least one selected from the group consisting of polyacrylate (poly(acrylate)), polyacrylamide (poly(acrylamide)), polyacrylic acid (poly(acrylic acid)), polyvinyl alcohol (poly(vinyl alcohol)), polyacrylonitrile (poly(acrylonitrile)), ethylene maleic anhydride copolymer, cellulose, starch, cross-linked polyethylene oxide and copolymers thereof.
5 . The encapsulation structure of claim 1 , wherein the base resin comprises at least one selected from the group consisting of a silicon-based resin, an epoxy-based resin, and an acrylic-based resin.
6 . The encapsulation structure of claim 1 , wherein a content of the hygroscopic composite particles is in an amount of about 0.1 wt % to about 40 wt % in the base resin.
7 . The encapsulation structure of claim 1 , wherein a silane group or a compound that comprises the silane group is bonded to a surface of the silica layer.
8 . The encapsulation structure of claim 7 , wherein the base resin comprises a silicon-based resin.
9 . The encapsulation structure of claim 1 , wherein an epoxy group or a compound that comprises the epoxy group is bonded to a surface of the silica layer.
10 . The encapsulation structure of claim 9 , wherein the base resin comprises an epoxy-based resin.
11 . The encapsulation structure of claim 1 , wherein an acryl group or a compound that comprises the acryl group is bonded to a surface of the silica layer.
12 . The encapsulation structure of claim 11 , wherein the base resin comprises an acrylic-based resin.
13 . The encapsulation structure of claim 1 , further comprising an inorganic encapsulation layer.
14 . A display device comprising: a substrate; a display unit on the substrate; and a thin film layer on the display unit, the thin film layer comprising an organic encapsulation layer, wherein the organic encapsulation layer comprises a base resin and a plurality of hygroscopic composite particles, each of the hygroscopic composite particles comprising a core and a silica layer directly around the core, wherein the core comprises a polymer, wherein the silica layer consists of silica and is configured to maintain a shape of the hygroscopic composite particle, and wherein the hygroscopic composite particles are uniformly dispersed in the entire organic encapsulation layer.
15 . The display device of claim 14 , wherein the thin film layer entirely covers the display unit.
16 . The display device of claim 14 , further comprising an inorganic encapsulation layer.
17 . A display device comprising: a first substrate; a second substrate facing the first substrate; a display unit on the first substrate; and a filling layer on the display unit, wherein the filling layer comprises a base resin and a hygroscopic composite particle, the hygroscopic composite particle comprising a core and a silica layer directly around the core, wherein the core comprises a polymer, and wherein the silica layer consists of silica and is configured to maintain a shape of the hygroscopic composite particle.
18 . The display device of claim 17 , further comprising a thin film layer that entirely covers the display unit, the thin film layer being between the filling layer and the display unit.
19 . The display device of claim 18 , wherein the filling layer entirely covers the display unit.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims priority to and the benefit of Korean Patent Application No. 10-2021-0027901 filed on Mar. 3, 2021 in the Korean Intellectual Property Office (KIPO), the entire disclosure of which is incorporated by reference herein. BACKGROUND 1. Field Embodiments relate to an encapsulation structure and a display device having the encapsulation structure. 2. Description of the Related Art An organic electronic device is a device comprising at least one layer of an organic material that can conduct an electric current. The organic electronic device may include an organic light emitting device (OLED), an organic solar cell, an organic photoconductor (OPC), or an organic transistor. The organic light emitting device, that is, a related art organic electronic device, may include a substrate, a first electrode, a light emitting layer, and a second electrode in sequence (e.g., stacked and/or laminated in sequence). In a structure of a bottom emitting device, the first electrode may be formed as a transparent electrode, and the second electrode may be formed as a reflective electrode layer. In addition, in a structure of a top emitting device, the first electrode may be formed as a reflective electrode, and the second electrode may be formed as a transparent electrode. Electrons and holes injected by the electrode may recombine in the emission layer to generate light. Generally, durability may be desired and/or important in the organic electronic devices. For example, the light emitting layer or the electrode of an organic electronic device may be easily oxidized by foreign substances such as moisture or oxygen. Therefore, it may be desirable to improve durability by protecting against environmental factors. The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure, and therefore, it may contain information that does not constitute prior art SUMMARY In order to ensure durability, moisture or oxygen penetrating an organic electronic device may be prevented or substantially prevented by including a thin film layer or a filling layer that includes an encapsulation structure including a hygroscopic material. Aspects of one or more embodiments of the present disclosure are directed toward an encapsulation structure with improved moisture absorption. Aspects of one or more embodiments of the present disclosure are directed toward a display device that includes the encapsulation structure. An encapsulation structure according to an embodiment may include an organic encapsulation layer. The organic encapsulation layer may include a base resin and hygroscopic composite particles including a hygroscopic composite particle. The hygroscopic composite particle may include a core and a silica layer around the core. The core may include a polymer. The silica layer may include silica (e.g., SiO2). In an embodiment, an average diameter of the hygroscopic composite particles may be in a range from about 30 nm to about 1 μm. In an embodiment, a thickness of the silica layer may be in a range from about 10 nm to about 500 nm. In an embodiment, the polymer may include at least one selected from the group consisting of polyacrylate (poly(acrylate)), polyacrylamide (poly(acrylamide)), polyacrylic acid (poly(acrylic acid)), polyvinyl alcohol (poly(vinyl alcohol)), polyacrylonitrile (poly(acrylonitrile)), ethylene maleic anhydride copolymer, cellulose, starch, cross-linked polyethylene oxide and copolymers thereof. In an embodiment, the base resin may include at least one selected from the group consisting of a silicon-based resin, an epoxy-based resin, and an acrylic-based resin. In an embodiment, a content of the hygroscopic composite particles may be in an amount of about 0.1 wt % to about 40 wt % in the base resin. In an embodiment, the hygroscopic composite particles may be uniformly dispersed in the base resin. In an embodiment, a silane group or a compound that includes the silane group may be bonded to a surface of the silica layer. In an embodiment, the base resin may include a silicon-based resin. In an embodiment, an epoxy group or a compound that includes the epoxy group may be bonded to a surface of the silica layer. In an embodiment, the base resin may include an epoxy-based resin. In an embodiment, an acryl group or a compound that includes the acryl group may be bonded to a surface of the silica layer. In an embodiment, the base resin may include an acrylic-based resin. In an embodiment, the encapsulation structure may further include an inorganic encapsulation layer. A display device according to an embodiment may include a substrate, a display unit on the substrate and a thin film layer on the display unit. The thin film layer may include an organic encapsulation layer. The organic encapsulation layer may include a base resin and a hygroscopic composite particle. The hygroscopic composite part