US-12622206-B2 - Substrate processing apparatus and substrate processing method

US12622206B2US 12622206 B2US12622206 B2US 12622206B2US-12622206-B2

Abstract

A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

Inventors

Kimio Motoda
Norifumi Kohama
Norio Wada
Yosuke Omori
Kenji SUGAKAWA

Assignees

TOKYO ELECTRON LIMITED

Dates

Publication Date: 20260505
Application Date: 20220921
Priority Date: 20180123

Claims (6)

1 . A substrate processing apparatus, comprising: a holder having thereon a circular attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the circular attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the circular attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member, wherein the moving device comprises a vertical moving unit configured to move the outer attracting member with respect to the inner attracting member in a vertical direction perpendicular to the circular attraction surface, and the controller is further configured to control the distortion of the substrate attracted to the circular attraction surface by controlling a movement of the outer attracting member in the vertical direction.
2 . The substrate processing apparatus of claim 1 , wherein the outer attracting member includes multiple outer attracting members, and the multiple outer attracting members are arranged at a regular distance therebetween in a circumferential direction, and the controller is configured to control the distortion of the substrate attracted to the circular attraction surface by independently controlling the movement of at least two members from among the multiple outer attracting members in the vertical direction.
3 . The substrate processing apparatus of claim 2 , wherein the controller is configured to independently control the movement of the multiple outer attracting members by setting at least one of a moving direction, a moving speed, a moving start time and a moving end time to be different between at least one outer attracting member and another outer attracting member.
4 . The substrate processing apparatus of claim 3 , wherein the controller is configured to independently control the movement of the multiple outer attracting members based on pre-stored data in a memory regarding an anisotropy in a physical property of Young's modulus of the substrate.
5 . The substrate processing apparatus of claim 1 , further comprising: a facing holder disposed to face the holder, wherein the facing holder is configured to hold another substrate to be bonded to the substrate.
6 . The substrate processing apparatus of claim 5 , wherein the holder comprises a striker configured to press the substrate held by the holder into the another substrate held by the facing holder.

Description

CROSS-REFERENCE TO RELATED APPLICATION This is a continuation application of U.S. patent application Ser. No. 16/964,008, filed on Jul. 22, 2020, which is a U.S. national phase application under 35 U.S.C. § 371 of PCT Application No. PCT/JP2019/000623 filed on Jan. 11, 2019, which claims the benefit of Japanese Patent Application No. 2018-008891 filed on Jan. 23, 2018, the entire disclosures of which are incorporated herein by reference. TECHNICAL FIELD The various aspects and embodiments described herein pertain generally to a substrate processing apparatus and a substrate processing method. BACKGROUND A bonding apparatus described in Patent Document 1 is equipped with an upper chuck configured to attract a substrate at an upper side from above it and a lower chuck configured to attract a substrate at a lower side from below it. While being held to face each other, the two substrates are bonded. To elaborate, the bonding apparatus brings a central portion of the upper substrate attracted by the upper chuck into contact with a central portion of the lower substrate attracted by the lower chuck by pressing down the central portion of the upper substrate. Accordingly, the central portions of the two substrates are bonded by an intermolecular force or the like. Then, the bonding apparatus expands a bonding region between the two substrates from the central portions of the substrates to peripheral portions thereof. Patent Document 1: Japanese Patent Laid-open Publication No. 2015-095579 SUMMARY In an exemplary embodiment, a substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating a bonding system according to an exemplary embodiment. FIG. 2 is a side view illustrating the bonding system according to the exemplary embodiment. FIG. 3 is a side view illustrating a state before a first substrate and a second substrate are bonded according to the exemplary embodiment. FIG. 4 is a plan view illustrating a bonding apparatus according to the exemplary embodiment. FIG. 5 is a side view illustrating the bonding apparatus according to the exemplary embodiment. FIG. 6 is a cross sectional view illustrating an upper chuck and a lower chuck according to the exemplary embodiment, showing a state before an upper wafer and a lower wafer are bonded after their positions are adjusted. FIG. 7A and FIG. 7B are cross sectional views illustrating an operation through which the upper wafer and the lower wafer are gradually bonded from central portions toward peripheral portions thereof according to the exemplary embodiment. FIG. 8 is a flowchart illustrating a part of a processing performed by the bonding system according to the exemplary embodiment. FIG. 9 is a diagram illustrating the upper chuck according to the exemplary embodiment, seen from above it. FIG. 10 is a diagram illustrating the upper chuck according to the exemplary embodiment, seen from below it. FIG. 11 is a diagram illustrating an upper chuck according to a modification example, seen from above it. FIG. 12 is a diagram exaggeratingly illustrating an elastic deformation of an elastic hinge according to the modification example. DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the various drawings, same or corresponding parts will be assigned same reference numerals, and redundant description may be omitted. In the following description, the X-axis direction, the Y-axis direction and the Z-axis direction are orthogonal to each other, and the X-axis and Y-axis directions are horizontal directions whereas the Z-axis direction is a vertical direction. A rotational direction around a vertical axis is also referred to as “0 direction.” In the present specification, below means vertically below, and above means vertically above. <Bonding System> FIG. 1 is a plan view illustrating a bonding system 1 according to an exemplary embodiment. FIG. 2 is a side view illustrating the bonding system 1 according to the exemplary embodiment. FIG. 3 is a side view illustrating a state before a first substrate and a second substrate are bonded according to the exemplary embodiment. The bonding system 1 shown