US-12622212-B2 - Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium

US12622212B2US 12622212 B2US12622212 B2US 12622212B2US-12622212-B2

Abstract

A substrate processing apparatus includes: a process chamber performing film-forming processing to a substrate; a substrate support that is provided in the process chamber and includes a plurality of mounting surfaces on which the substrate is mounted; and a detector that is disposed outside or inside the process chamber and detects a state of a film-forming material adhering to at least one of the plurality of mounting surfaces in a non-contact manner.

Inventors

Hideharu Itatani
Naofumi Ohashi
Toshiro Koshimaki
Shun Matsui

Assignees

Kokusai Electric Corporation

Dates

Publication Date: 20260505
Application Date: 20220912
Priority Date: 20210913

Claims (20)

1 . A substrate processing apparatus, comprising: a process chamber performing film-forming processing to a substrate; a substrate support that is provided in the process chamber and includes a plurality of mounting surfaces on a respective one of which the substrate is mounted; and a detector that is disposed outside the process chamber and is configured to detect a state of a film-forming material adhering to at least one of the plurality of mounting surfaces in a non-contact manner without the substrate on the mounting surfaces, wherein the state of the film-forming material includes a film thickness distribution or a crack generation situation of the film-forming material.
2 . The substrate processing apparatus according to claim 1 , wherein the detector is disposed in a position where an outer circumference of at least one of the plurality of mounting surfaces is included in a detection region of the detector.
3 . The substrate processing apparatus according to claim 1 , wherein the detector is disposed in a position close to a substrate carrying-out port of the process chamber.
4 . The substrate processing apparatus according to claim 1 , further comprising: a controller configured to be capable of controlling the detector to detect film deposition image information of the film-forming material adhering to at least one of the plurality of mounting surfaces, and transmit the film deposition image information to the controller.
5 . The substrate processing apparatus according to claim 1 , further comprising: a rotator rotating the substrate support in the process chamber; and a transferor that is capable of being controlled by a controller and transfers the substrate, wherein the plurality of mounting surfaces are disposed at an interval in a rotation direction of the substrate support, and the controller is configured to be capable of controlling the transferor such that the transfer of the substrate is retried when a position shift of the substrate with respect to at least one of the plurality of mounting surfaces is detected from film deposition image information of the at least one of the plurality of mounting surfaces.
6 . The substrate processing apparatus according to claim 5 , wherein the controller obtains the film deposition image information of the at least one of the plurality of mounting surfaces and film deposition image information of a portion other than the plurality of mounting surfaces by the detector in a state in which the rotation of the substrate support by the rotator is stopped.
7 . The substrate processing apparatus according to claim 5 , wherein the controller is configured to determine a maintenance timing of the substrate support, on the basis of at least one of the film deposition image information of at least one of the plurality of mounting surfaces and the film deposition image information of a portion other than the plurality of mounting surfaces.
8 . The substrate processing apparatus according to claim 1 , further comprising: a plurality of the detectors, wherein a first detector of the plurality of the detectors is disposed in a position where a portion on an outer circumference side of the substrate support among the outer circumference of the at least one of the plurality of mounting surfaces is included in the detection region of the first detector, and a second detector of the plurality of the detectors is disposed in a position where a portion on a rotation shaft side of the substrate support among the outer circumference of the at least one of the plurality of mounting surfaces is included in the detection region of the second detector.
9 . The substrate processing apparatus according to claim 5 , wherein the detector is movable in a direction orthogonal to a rotation shaft of the substrate support, and detects the film deposition image information of the at least one of the plurality of mounting surfaces while being moved above the at least one of the plurality of mounting surfaces in the direction orthogonal to the rotation shaft.
10 . The substrate processing apparatus according to claim 4 , wherein the controller is configured to be capable of performing maintenance of the substrate support when a crack on the film-forming material is detected by the film deposition image information.
11 . The substrate processing apparatus according to claim 4 , further comprising: a memory in which a plurality of maintenance programs are stored, wherein the controller is configured to be capable of reading out and executing a corresponding maintenance program from the memory when a thickness of film of the film-forming material on the at least one of the plurality of mounting surfaces that is obtained from the film deposition image information of the at least one of the plurality of mounting surfaces is greater than a setting value set in advance.
12 . The substrate processing apparatus according to claim 11 , further comprising: an input/output capable of displaying and editing at least one of the plurality of maintenance programs.
13 . The substrate processing apparatus according to claim 4 , wherein the controller acquires the film deposition image information by the detector after maintenance of the at least one of the plurality of mounting surfaces, and determines whether or not the maintenance is completed.
14 . The substrate processing apparatus according to claim 4 , wherein the controller obtains a distance between each of the plurality of mounting surfaces and the detector from the film deposition image information of the plurality of mounting surfaces to calculate deformation of each of the plurality of mounting surfaces.
15 . The substrate processing apparatus according to claim 14 , wherein the controller sends a message of prompting replacement of the substrate support when the deformation of at least one of the plurality of mounting surfaces becomes a predetermined value or more.
16 . The substrate processing apparatus according to claim 14 , wherein the controller cleans the at least one of the plurality of mounting surfaces when the deformation of at least one of the plurality of mounting surfaces becomes the predetermined value or more, and after the cleaning, acquires the film deposition image information of the at least one of plurality of mounting surfaces and derives the deformation of each of the plurality of mounting surfaces.
17 . The substrate processing apparatus according to claim 4 , wherein the controller continuously acquires the film deposition image information in a state in which the substrate support is rotated.
18 . The substrate processing apparatus according to claim 5 , wherein the detector is rotatively movable in a direction identical to the rotation direction of the substrate support or is movable in the direction orthogonal to a rotation shaft of the substrate support, and the controller continuously acquires the film deposition image information in a state in which the detector is moved.
19 . A method of processing a substrate, comprising: mounting a plurality of substrates on a plurality of mounting surfaces each capable of mounting a respective single substrate, wherein the plurality of mounting surfaces are included on a substrate support provided in a process chamber; performing film-forming processing to the plurality of substrates in the process chamber; and detecting a state of a film-forming material adhering to at least one of the plurality of mounting surfaces in a non-contact manner without the substrate on the mounting surfaces with a detector, wherein the state of the film-forming material includes a film thickness distribution or a crack generation situation of the film-forming material.
20 . A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising: mounting a plurality of substrates on a plurality of mounting surfaces each capable of mounting a respective single substrate, wherein the plurality of mounting surfaces are included on a substrate support provided in a process chamber; performing film-forming processing to the plurality of substrates in the process chamber; and detecting a state of a film-forming material adhering to at least one of the plurality of mounting surfaces in a non-contact manner without the substrate on the mounting surfaces with a detector, wherein the state of the film-forming material includes a film thickness distribution or a crack generation situation of the film-forming material.

Description

FIELD The present disclosure relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, and a non-transitory computer-readable recording medium. DESCRIPTION OF THE RELATED ART In a substrate processing apparatus used in the semiconductor manufacturing field, film-forming processing is performed while heating a substrate mounted on a mounting surface with a heater. However, in a film-forming processing step of the substrate, a film-forming material sneaks into the rear surface from the outer circumference of the substrate, and the film-forming material may adhere to the mounting surface. As described above, in a case where the film-forming material is deposited on the mounting surface, there is a concern that problems occur in the film-forming processing of the substrate. For this reason, the film-forming material deposited on the mounting surface is removed by regular maintenance. SUMMARY The present disclosure provides a technology of detecting a state of a mounting surface of a substrate. According to one aspect of the present disclosure, there is provided a substrate processing apparatus, including: a process chamber performing film-forming processing to a substrate; a substrate support that is provided in the process chamber and includes a plurality of mounting surfaces on which the substrate is mounted; and a detector that is disposed outside or inside the process chamber and detects a state of a film-forming material adhering to at least one of the plurality of mounting surfaces in a non-contact manner. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic transverse sectional view of a reactor provided in a substrate processing apparatus of a first embodiment of the present disclosure. FIG. 2 is a schematic longitudinal sectional view of the reactor provided in the substrate processing apparatus of the first embodiment of the present disclosure, and is a 2X-2X-line sectional view of the reactor illustrated in FIG. 1. FIG. 3 is an explanatory diagram illustrating a substrate support mechanism of the first embodiment of the present disclosure. FIG. 4 is a 4X-4X-line sectional view of FIG. 1. FIG. 5 is an explanatory diagram describing a raw material gas supplier of the first embodiment of the present disclosure. FIG. 6 is an explanatory diagram describing a reactant gas supplier of the first embodiment of the present disclosure. FIG. 7 is an explanatory diagram describing a first inert gas supplier of the first embodiment of the present disclosure. FIG. 8 is an explanatory diagram describing a second inert gas supplier of the first embodiment of the present disclosure. FIG. 9 is an explanatory diagram describing a movement mechanism of a camera of the first embodiment of the present disclosure. FIG. 10 is an explanatory diagram for describing a capturing region of the camera of the first embodiment of the present disclosure. FIG. 11 is an explanatory diagram describing a controller of the first embodiment of the present disclosure. FIG. 12 is a flowchart describing a substrate processing step of the first embodiment of the present disclosure. FIG. 13 is a flowchart describing a detecting step of the first embodiment of the present disclosure. FIG. 14 is a flowchart describing a maintenance step according to the first embodiment of the present disclosure. DETAILED DESCRIPTION Hereinafter, one embodiment of the present disclosure will be described with reference to the drawings. Note that, the drawings used in the following description are schematic views, illustrated in the drawings, dimensional relationships between elements, ratios of each of the elements, or the like are not necessarily coincident with the actual ones. In addition, even in a plurality of drawings, the dimensional relationships of the elements, the ratios of each of the elements, or the like are not coincident with each other. First Embodiment A substrate processing apparatus 100 of a first embodiment of the present disclosure is an apparatus used in a substrate processing step that is one step of a manufacturing step of a semiconductor device. Hereinafter, first, the configuration of the substrate processing apparatus 100 will be described, and then, the substrate processing step using the substrate processing apparatus 100 will be described. Substrate Processing Apparatus As illustrated in FIG. 1, the substrate processing apparatus 100 includes a reactor 200. As illustrated in FIG. 1 and FIG. 2, the reactor 200 includes a process chamber 201 performing film-forming processing to a substrate S, and a rotation table 217 as an example of a substrate support that is provided in the process chamber 201 and includes a plurality of mounting surfaces 217C on which the substrate S is mounted. In addition, as illustrated in FIG. 4, the reactor 200 includes a detector 210 detecting the state of a film-forming material 217D adhering to the mounting surface 217C in a non-contact manner. Note that, in the pre