US-12622222-B2 - Apparatus for processing of singulated dies and methods for using the same

Abstract

Embodiments herein are generally directed to die cleaning frames for processing and handling singulated devices and methods related thereto. The die cleaning frames may be used advantageously to minimize contact with device surfaces during post-singulation processing and to facilitate a pick and place bonding process without touching the active side of the cleaned device. Thus, the die cleaning frames and methods described herein eliminate the need for undesirable contact with clean and prepared active sides of the devices during a direct placement die-to-wafer bonding process. In one embodiment, a carrier configured to support a singulated device in a die pocket region may include a carrier plate and a frame that surrounds the carrier plate and is integrally formed therewith. The carrier plate may include a first surface and an opposite second surface, and one or more sidewalls that define an opening disposed through and extending between the first and second surfaces. Each of the sidewalls may include one or more protuberances that collectively determine a rectangular boundary of the die pocket region. Some of the protuberances may include a die supporting surface that extends beneath the die pocket region.

Inventors

• Cyprian Emeka Uzoh
• Aaron Todd Francis
• Gabriel Guevara
• Thomas Workman
• Dominik Suwito

Assignees

• ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Dates

Publication Date

20260505

Application Date

20230915

Claims (20)

1. 1 . A carrier configured to support a singulated die in a die pocket region disposed between a first surface and an opposite second surface of a carrier plate, the carrier plate comprising: one or more sidewalls that define an opening disposed through and extending between the first and second surfaces, wherein: one or more of the sidewalls comprises one or more first or second protuberances that extend laterally into the opening; the first and second protuberances collectively determine at least a portion of a boundary of the die pocket region; the boundary of the die pocket region corresponds to the size and shape of a singulated die to-be-received therein; and each of the second protuberances comprises a die supporting surface that extends beneath the die pocket region.
2. 2 . The carrier of claim 1 , wherein the first and second protuberances collectively determine the boundary of the die pocket region.
3. 3 . The carrier of claim 1 , further comprising: a frame surrounding the carrier plate and integrally formed therewith, wherein the frame is sized and shaped to support the carrier plate in a slot of a tape frame cassette.
4. 4 . The carrier of claim 1 , further comprising: a frame integrally formed with the carrier plate, wherein the frame is compatible for use with a SEMI Standard tape frame cassette.
5. 5 . The carrier of claim 1 , wherein the carrier plate comprises a rectangular array of die pocket regions.
6. 6 . The carrier of claim 1 , wherein an area of the die pocket region is determined by the size of a rectangle that will fit between curved surfaces of the plurality of first and second protuberances.
7. 7 . The carrier of claim 6 , wherein each of the curved surfaces has a radius between about 0.5 mm and about 3 mm.
8. 8 . The carrier of claim 1 , wherein between protuberances, the die pocket region is spaced apart from the sidewalls of the opening by a distance between about 0.5 mm and about 2 mm.
9. 9 . The carrier of claim 1 , wherein a combined area of the die supporting surface is about 5% or less than an area of the die pocket region.
10. 10 . The carrier of claim 1 , further comprising one or more resilient members disposed on one or more of the sidewalls, wherein each resilient member is positioned to exert a lateral force on an edge of a singulated die disposed in the die pocket region.
11. 11 . The carrier of claim 10 , wherein the first and second protuberances and the one or more resilient members collectively determine the boundary of the die pocket region.
12. 12 . The carrier of claim 1 , further comprising one or more alignment features that when engaged with one or more alignment features of a substantially similar carrier cause the die pocket region of the carrier and the substantially similar carrier to be aligned.
13. 13 . A first carrier and a second carrier each configured to support a plurality of singulated die in an array of die pocket regions, the first and second carriers each comprising: a carrier plate having a plurality of openings disposed therethrough; and one or more alignment features, wherein each of the openings is defined by one or more sidewalls that extend between a first surface and an opposite second surface, each of the sidewalls comprises one or more protuberances that extend laterally into a respective opening to collectively determine a boundary of a die pocket region, the boundary of the die pocket region corresponds to the size and shape of a singulated die to-be-received therein, at least three of the protuberances comprises a die supporting surface disposed beneath the die pocket region, and when engaged with the one or more alignment features of the other carrier, the alignment features cause the die pocket regions of the respective arrays to be aligned.
14. 14 . The first and second carriers of claim 13 , each further comprising: a frame surrounding the carrier plate and integrally formed therewith, wherein the frame is sized and shaped to support the respective first or second carrier in a slot of a tape frame cassette.
15. 15 . The first and second carriers of claim 13 , each further comprising: a frame integrally formed with the carrier plate, wherein the frame is compatible for use with a SEMI-Standard tape frame cassette.
16. 16 . The first and second carriers of claim 13 , wherein a curved surface of each protuberance has a radius between about 0.5 mm and about 3 mm, and the boundary of each die pocket region is determined by lines tangent to the curved surfaces.
17. 17 . The first and second carriers of claim 13 , wherein the carrier plate of the first or second carrier comprises one or more resilient members disposed in each of the plurality of openings, and the one or more resilient members are each positioned to exert a force against a singulated die disposed in a respective die pocket region of the other carrier.
18. 18 . The first and second carriers of claim 17 , wherein the resilient member comprises a spring.
19. 19 . The first and second carriers of claim 13 , wherein between protuberances, the die pocket region is spaced apart from the sidewalls of the opening by a distance between about 0.5 mm and about 2 mm.
20. 20 . The first and second carriers of claim 13 , wherein a combined area of the die supporting surface is about 5% or less than an area of the die pocket region.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims benefit to U.S. Provisional Application 63/407,059, filed on Sep. 15, 2022, which is incorporated by reference herein. FIELD The present disclosure generally relates to advanced integrated circuit (IC) packaging and, more particularly, to apparatus for concurrent processing of singulated dies and methods of using the same. BACKGROUND Heterogeneous integration (HI) generally refers to the incorporation of dissimilar devices into a single device package. The dissimilar devices may be of different sizes, have different functionalities, comprise different materials, or may be manufactured using different technologies. Often, adjacent devices are arranged in a face-to-face or face-to-back stack using an assembly method that forms relatively short interconnects therebetween. One such method is direct placement die-to-wafer bonding, where singulated devices are positioned face down on a wafer one by one and interconnects are formed therebetween by direct hybrid bonding. Unfortunately, conventional methods of positioning the singulated devices have relatively high defectivity due to contamination transferred between the devices and the device handling apparatus. Such defectivity can interfere with the bonding process or cause misalignment between the devices, ultimately resulting in reduced yield and increased manufacturing costs. Further, the multiple handoffs typically required to position a device face down may be problematic for larger die, which are both more expensive and more prone to breakage from stress-induced micro-cracks. Accordingly, there is a need in the art for improved apparatus for handling singulated devices and methods related thereto. SUMMARY Aspects of the disclosure are generally directed to die cleaning frames for processing and handling singulated devices and methods related thereto. The die cleaning frames may be used advantageously to minimize contact with device surfaces during post-singulation processing and to facilitate a pick and place bonding process without touching the active side of the cleaned device. Thus, the die cleaning frames and methods described herein eliminate the need for undesirable contact with clean and prepared active sides of the devices during a direct placement die-to-wafer bonding process. In one general aspect, a carrier configured to support a singulated device in a die pocket region is provided. The carrier may include a carrier plate and a frame that surrounds the carrier plate and is integrally formed therewith. The carrier plate may include a first surface and an opposite second surface, and one or more sidewalls that define an opening disposed through and extending between the first and second surfaces. Each of the sidewalls may include one or more protuberances that extend laterally into the opening and collectively determine at least a portion of a boundary of the die pocket region. Typically, the boundary of the die pocket reaction corresponds to the size and shape of a singulated die to-be-received therein. Some of the protuberances may include a die supporting surface that extends beneath the die pocket region. Implementations of the general aspect above may include one or more of the following features. The carrier where the frame is sized and shaped to support the carrier plate in a slot of a tape frame cassette. The carrier where the frame is compatible for use with a SEMI Standard tape frame cassette. The carrier where the carrier plate includes a rectangular array of die pocket regions. The carrier where each of the protuberances has a curved surface that collectively determine at least a portion of the boundary of the die pocket region. The carrier where the plurality of first and second protuberances collectively determine the boundary of the die pocket region. The carrier further including one or more resilient members disposed on one or more of the sidewalls, wherein each resilient member is positioned to exert a lateral force on an edge of a singulated die disposed in the die pocket region. The carrier where the first and second protuberances and the one or more resilient members collectively determine the boundary of the die pocket region. The carrier where the plurality of first and second protuberances collectively determine the boundary of the die pocket region. The carrier where each of the curved surfaces has a radius between about 0.5 mm and about 3 mm. The carrier where, between protuberances, the die pocket region is spaced apart from the sidewalls of the opening by a distance between about 0.5 mm and about 2 mm. The carrier where a combined area of the die supporting surfaces is about 5% or less than an area of the die pocket region. The carrier may include one or more alignment features that, when engaged with one or more alignment features of a substantially similar carrier, cause the die pocket regions of the carrier and the substantially similar carrier to be ali