US-12622223-B2 - Substrate processing device and substrate processing method

US12622223B2US 12622223 B2US12622223 B2US 12622223B2US-12622223-B2

Abstract

A substrate is held by an upper holding device, and a lower-surface center region of the substrate is cleaned with use of a lower-surface brush. The substrate is lowered from an upper holding device and transferred to a suction holder of a lower holding device. The substrate held by the suction holder is cleaned with use of a processing liquid. A cup is provided to be liftable and lowerable between an upper cup position and a lower cup position. The cup is in the lower cup position when waiting. A period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other.

Inventors

Yoshifumi Okada
Nobuaki Okita
Kazuki Nakamura

Assignees

SCREEN Holdings Co., Ltd.

Dates

Publication Date: 20260505
Application Date: 20231220
Priority Date: 20221223

Claims (1)

1 . A substrate processing device comprising: a first substrate holder configured to hold a substrate at a first height position; a second substrate holder configured to hold the substrate at a second height position lower than the first height position; a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder; a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder; and a controller, wherein the second processing includes processing with use of a processing liquid, the processor includes a processing cup formed to surround the second substrate holder in plan view and provided to be liftable and lowerable between an upper cup position corresponding to the second height position and a lower cup position lower than the upper cup position, and a cup driver that lifts and lowers the processing cup, and the controller, by controlling the substrate mover and the cup driver, causes the substrate lowering operation performed by the substrate mover and a cup lifting operation of lifting the processing cup from the lower cup position toward the upper cup position to be performed such that a period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other, the processor includes: a lower-surface brush that cleans a lower surface of the substrate by coming into contact with the lower surface; a lower-surface brush mover configured to move the lower-surface brush between a lower-surface brush processing position at which the lower-surface brush comes into contact with the lower-surface of the substrate held by the second substrate holder and a lower-surface brush waiting position spaced apart from the lower-surface brush processing position; a fluid nozzle that discharges fluid including the processing liquid to an upper surface of the substrate; a nozzle mover configured to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holder and a nozzle waiting position spaced apart from the substrate held by the second substrate holder; an end-portion brush that cleans an outer peripheral end of the substrate by coming into contact with the outer peripheral end; and an end-portion brush mover configured to move the end-portion brush between an end-portion brush processing position at which the end-portion brush comes into contact with the outer peripheral end of the substrate held by the second substrate holder and an end-portion brush waiting position spaced apart from the substrate held by the second substrate holder, the second processing includes cleaning processing for the lower surface of the substrate performed by the lower-surface brush, cleaning processing for the upper surface of the substrate performed by the fluid nozzle and cleaning processing for the outer peripheral end of the substrate performed by the end-portion brush as processing with use of the processing liquid, and the controller, by controlling the lower-surface brush mover, the nozzle mover and the end-portion brush mover in addition to the substrate mover and the cup mover, causes the substrate lowering operation, the cup lifting operation, a lower-surface brush preparing operation of moving the lower-surface brush from the lower-surface brush waiting position to the lower-surface brush processing position, a nozzle preparing operation of moving the fluid nozzle from the nozzle waiting position to the nozzle processing position and an end-portion brush preparing operation of moving the end-portion brush from the end-portion brush waiting position to the end-portion brush processing position to be performed such that three or more than three periods out of at least part of a period for the substrate lowering operation, at least part of a period for the cup lifting operation, at least part of a period for the lower-surface brush preparing operation, at least part of a period for the nozzle preparing operation and at least part of a period for the end-portion brush preparing operation overlap with one another.

Description

BACKGROUND Technical Field The present disclosure relates to a substrate processing device and a substrate processing method for cleaning of a substrate. Description of Related Art A substrate processing device is used to perform various processing on various substrates such as a substrate for an FPD (Flat Panel Display) that is used for a liquid crystal display device, an organic EL (Electro Luminescence) display device or the like, a semiconductor substrate, a substrate for an optical disc, a substrate for a magnetic disc, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate or a substrate for a solar cell. A substrate cleaning device is used to clean a substrate. For example, the substrate cleaning device described in JP 5904169 B2 includes two suction pads for holding the back-surface peripheral portion of a wafer, a spin chuck for holding the back-surface center portion of the wafer and a brush for cleaning the back surface of the wafer. The two suction pads hold the wafer and are moved in a transverse direction. In this state, the back-surface center portion of the wafer is cleaned by the brush. Thereafter, the spin chuck receives the wafer from the suction pads. Further, the spin chuck rotates while holding the back-surface center portion of the wafer. In this state, the back-surface peripheral portion of the wafer is cleaned by the brush. SUMMARY In the above-mentioned substrate cleaning device, a large number of substrates are sequentially carried in and out, so that cleaning processing is performed on each substrate. Therefore, if the period required for processing for one substrate can be shortened, the processing efficiency for a large number of substrates can be greatly improved. In the substrate cleaning device, further improvement of the throughput of the substrate processing is required. An object of the present disclosure is to provide a substrate processing device and a substrate processing method that enable improvement of throughput of substrate processing. A substrate processing device according to one aspect of the present disclosure includes a first substrate holder configured to hold a substrate at a first height position, a second substrate holder configured to hold the substrate at a second height position lower than the first height position, a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder, a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder, and a controller, wherein the second processing includes processing with use of a processing liquid, the processor includes a processing cup formed to surround the second substrate holder in plan view and provided to be liftable and lowerable between an upper cup position corresponding to the second height position and a lower cup position lower than the upper cup position, and a cup driver that lifts and lowers the processing cup, and the controller, by controlling the substrate mover and the cup driver, causes the substrate lowering operation performed by the substrate mover and a cup lifting operation of lifting the processing cup from the lower cup position toward the upper cup position to be performed such that a period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other. A substrate processing device according to another aspect of the present disclosure includes a first substrate holder configured to hold a substrate at a first height position, a second substrate holder configured to hold the substrate at a second height position lower than the first height position, a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder, a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder, and a controller, wherein the processor includes a lower-surface brush that cleans a lower surface of the substrate by coming into contact with the lower surface, and a lower-surface brush mover configured to move the lower-surface brush between a lower-surface brush processing position at which the lower-surface brush comes into contact with the lower surface of the substrate held by the second substrate holder and a lower-surface brush waiting position spaced apart from the lower-surface brush processing position, the second processing includes cleaning processing for the lower surface of the substrate by the lower-