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US-12622224-B2 - Integrated tool lift

US12622224B2US 12622224 B2US12622224 B2US 12622224B2US-12622224-B2

Abstract

Semiconductor processing tools are provided that include a support framework, semiconductor processing chambers arranged along an axis, an attachment point connected to the support framework, and a detachable hoist system. Each chamber includes a base portion fixedly mounted relative to the support framework and a removable top cover including one or more hoisting features. The detachable hoist system includes a vertical member including a top end including a complementary attachment point and a bottom end including a movement mechanism supported by a floor. The complementary attachment point is detachably connected to the attachment point. The detachable hoist system further includes a hoist arm connected to the vertical member. The hoist arm is configured to pivot about a vertical axis substantially perpendicular to the axis, and includes one or more links and a hoist feature engagement interface configured to engage with the hoisting features of any of the removable top covers.

Inventors

  • Paul Albert Avanzino
  • Jerrel K. Antolik
  • Daniel Arthur Brown
  • Jason Lee Treadwell

Assignees

  • LAM RESEARCH CORPORATION

Dates

Publication Date
20260505
Application Date
20240521

Claims (15)

  1. 1 . A semiconductor processing tool comprising: an upper support framework extending along a first axis; a linear guide system connected to the upper support framework and extending along the first axis; and a carriage movably connected to the linear guide system and having: a hoist arm configured to rotate about a second axis perpendicular to the first axis and having a hoist feature engagement interface configured to engage with a hoisting feature on a component of the semiconductor processing tool, and a vertical translation system configured to move the hoist arm up and down along the second axis, wherein: the carriage and the hoist arm are configured to be moved without mechanical power, the hoist feature engagement interface has a beam with a first end and a second end, the first end has a first hole on a top side of the beam, the second end has a second hole on the top side of the beam, and the first hole and the second hole are without structures positioned therein when not engaged with the hoisting feature on the component.
  2. 2 . The semiconductor processing tool of claim 1 , wherein: the hoist arm includes a first link, and the hoist feature engagement interface is rotatably connected to the first link.
  3. 3 . The semiconductor processing tool of claim 2 , wherein the hoist feature engagement interface is configured to rotate about a plurality of axes perpendicular to the second axis.
  4. 4 . The semiconductor processing tool of claim 1 , further comprising the component, wherein: the component is configured to be movable and has one or more hoisting features, the one or more hoisting features are configured to be engaged with the hoist feature engagement interface, and when the one or more hoisting features are engaged with the hoist feature engagement interface, the vertical translation system is configured to move the hoist arm and the component up and down the second axis.
  5. 5 . The semiconductor processing tool of claim 4 , wherein: the component has two hoisting features, each hoisting feature is a saddle post having a two vertical riser rods and a saddle plate spanning between the two vertical riser rods, the saddle plate has a pin extending downwards a direction parallel to the second axis, and the pin is configured to be positioned in the first hole or the second hole of the beam.
  6. 6 . The semiconductor processing tool of claim 4 , further comprising: an engagement sensor configured to generate data about whether the hoist feature engagement interface is engaged with the hoisting features of the component, and a controller comprising one or more processors and one or more non-transitory memory devices that store instructions for controlling the one or more processors to: determine, based on the data generated by the engagement sensor, whether the hoist feature engagement interface is engaged with the hoisting features of the component, cause, in response to determining that the hoist feature engagement interface is engaged with the hoisting features of the component, power to be provided to the vertical translation system, and cause, in response to determining that the hoist feature engagement interface is not engaged with the hoisting features of the component, power not to be provided to the vertical translation system.
  7. 7 . The semiconductor processing tool of claim 6 , wherein the engagement sensor is a proximity sensor, a contact switches, or a visual sensor.
  8. 8 . The semiconductor processing tool of claim 1 , further comprising: a power source, and an electrical cable configured to electrically connect the power source and the carriage, wherein: the electrical cable is detachably connected to the power source, and first vertical translation system includes an electric motor configured to be powered by the power source when the electrical cable electrically connects the power source and the carriage.
  9. 9 . The semiconductor processing tool of claim 8 , further comprising a controller comprising one or more processors and one or more non-transitory memory devices that store instructions for controlling the one or more processors to detect whether the power source is electrically connected to the carriage.
  10. 10 . The semiconductor processing tool of claim 1 , wherein the carriage is configured to be moved along the linear guide system without mechanical power.
  11. 11 . The semiconductor processing tool of claim 1 , wherein: the linear guide system has a plurality of tracks, and the carriage has a plurality of wheels engaged with the plurality of tracks.
  12. 12 . The semiconductor processing tool of claim 1 , further comprising a plurality of semiconductor processing chambers arranged along the first axis, wherein the linear guide system is above the plurality of semiconductor processing chambers.
  13. 13 . The semiconductor processing tool of claim 1 , wherein the first axis is parallel to a floor of a fabrication facility.
  14. 14 . A semiconductor processing tool comprising: an upper support framework extending along a first axis; a linear guide system connected to the upper support framework and extending along the first axis; and a carriage movably connected to the linear guide system and having: a hoist arm configured to rotate about a second axis perpendicular to the first axis and having a hoist feature engagement interface configured to engage with a hoisting feature on a component of the semiconductor processing tool, and a vertical translation system configured to move the hoist arm up and down along the second axis, wherein: the carriage and the hoist arm are configured to be moved without mechanical power, the hoist feature engagement interface has a beam with a first end and a second end, the first end has a first hole on a top side of the beam, the second end has a second hole on the top side of the beam, the component is configured to be movable and has two hoisting features, the two hoisting features are configured to be engaged with the hoist feature engagement interface, each hoisting feature has two vertical riser rods and a saddle plate spanning between the two vertical riser rods, the saddle plate has a pin extending downwards in a direction parallel to the second axis, and the pin is configured to be positioned in the first hole or the second hole of the beam.
  15. 15 . The semiconductor processing tool of claim 14 , wherein the vertical translation system is configured to move the hoist arm and the component up and down the second axis.

Description

INCORPORATION BY REFERENCE An Application Data Sheet is filed concurrently with this specification as part of the present application. Each application that the present application claims benefit of or priority to as identified in the concurrently filed Application Data Sheet is incorporated by reference herein in their entireties and for all purposes. BACKGROUND Many semiconductor processing tools have large and heavy components that are removed during maintenance, servicing, and repair. SUMMARY Described herein are novel apparatuses and systems to move components of a semiconductor processing tool for maintenance, servicing, and repair. These tools may have multiple semiconductor processing chambers that are mounted, directly or indirectly, to a support framework of the tool and that are arranged side by side in a linear array. While many components of semiconductor processing chambers are traditionally lifted and moved using conventional hoisting equipment that is separate from the tool and fully supported by the floor, e.g., a crane or forklift, some tools described herein have hoisting systems for moving removable components that are integrated into the tool itself. In some implementations, hoisting systems may include a linear guide system directly or indirectly mounted to the support framework and extending along the linear array of semiconductor processing chambers. Connected to and supported by the linear guide system may be a moveable carriage that has a moveable hoist arm that can connect with, lift, and move components of any of the semiconductor processing chambers; together, the carriage and its hoist arm can be moved along the linear guide system so that the hoist arm can connect with and move the removable components of any of the semiconductor processing chambers. The hoist arm and the removable components may have complementary connecting features that allow the hoist arm to connect with and lift the removable components. When the carriage lifts the removable component, the weight of that removable component is fully transferred through the hoist arm, the carriage, and the linear guide system to the support framework. In some embodiments, the carriage may hang from the linear guide system, such as below the linear guide system or to the side of the linear guide system. In some implementations, a person may move the carriage along the linear guide system and also move the hoist arm into position to connect with a removable component. In some such implementations, various aspects of the carriage may be powered by a motor, such as a lifting mechanism on the carriage to raise and lower the hoist arm. In some other embodiments, motors and other movement mechanisms may move the carriage along the linear guide system and/or move the hoist arm horizontally and/or vertically. A controller having a processor and a memory can control the movement of the carriage and hoist arm. In some alternate embodiments, the tool may have a different hoisting system than the carriage and linear guide system. These alternate embodiments use a detachable hoist system that connects to one or more attachment points which are connected to the support framework. This detachable hoist system is positioned on and supported by the floor and has a vertical member that is connected to an attachment point on the support framework in order to provide lateral support to the vertical member. The detachable hoist system also includes a hoist arm moveably attached to the vertical member that can, once the vertical member is connected to the one or more attachment points, connect with and lift a removable component from one of the semiconductor processing chambers. In some embodiments, the detachable hoist system, except for its hoist arm, is stationary once connected to the one or more attachment points while in some other embodiments, the detachable hoist system and the attachment point to which it is connected are simultaneously moveable along the array of semiconductor processing chambers. In some embodiments a semiconductor processing tool may be provided. The semiconductor processing tool may include an upper support framework, a first plurality of semiconductor processing chambers arranged along a first axis, a first linear guide system fixedly supported by the upper support framework and extending along a second axis substantially parallel to the first axis, and a first carriage. Each semiconductor processing chamber may have a base portion fixedly mounted relative to the upper support framework and may have a removable top cover with one or more hoisting features, the first carriage may include a first hoist arm with one or more links, the first hoist arm may be configured to pivot about a vertical axis that is substantially perpendicular to the second axis, the first carriage may be configured to movably engage with the first linear guide system and to translate along the second axis relative to the first linear guide sys