US-12622270-B2 - Heat radiating structure and electronic apparatus

US12622270B2US 12622270 B2US12622270 B2US 12622270B2US-12622270-B2

Abstract

A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.

Inventors

Ryota Watanabe
Junki Hashiba
Masahiro Kitamura
Takuroh Kamimura

Assignees

LENOVO (SINGAPORE) PTE. LTD.

Dates

Publication Date: 20260505
Application Date: 20230612
Priority Date: 20220705

Claims (7)

1 . A heat radiating structure of an electric component which generates heat, comprising: a porous material which abuts on a surface of the electric component; and a heat radiating element which includes a recessed part into which the porous material fits, wherein the heat radiating element sandwiches and holds the porous material between the heat radiating element itself and the surface of the electric component, wherein the porous material includes: a heat generating element abutment range part into which a heat transfer fluid is impregnated and which abuts on the surface of the electric component and receives heat from the electric component, and a heat generating element non-abutment range part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the electric component, and the heat generating element non-abutment range part is fixedly adhered to the heat radiating element with a belt-shaped adhesive material; wherein the belt-shaped adhesive material is a sponge and fills a gap between the heat radiating element and a substrate around the electronic component.
2 . The heat radiating structure according to claim 1 , wherein the heat generating element non-abutment range part protrudes from the heat generating element abutment range part and a plurality of the heat generating element non-abutment range parts is at symmetrical positions, and the belt-shaped adhesive material crosses the heat generating element non-abutment range parts.
3 . The heat radiating structure according to claim 1 , further comprising: a baseplate; and a semiconductor chip mounted on the baseplate, wherein the semiconductor chip includes the substrate and a die and the electric component is the die.
4 . The heat radiating structure according to claim 1 , wherein the heat-transfer liquid is a liquid metal.
5 . The heat radiating structure according to claim 1 , wherein the porous material is a mesh.
6 . The heat radiating structure according to claim 1 , wherein the porous material is a metal material and at least a surface of the porous material is made of nickel.
7 . An electronic apparatus which has a heat radiating structure comprising: an electric component which generates heat; a porous material which abuts on a surface of the electric component; and a heat radiating element which includes a recessed part into which the porous material fits, wherein the heat radiating element sandwiches and holds the porous material between the heat radiating element itself and the surface of the electric component, wherein the porous material includes: a heat generating element abutment range part into which a heat transfer fluid is impregnated and which abuts on the surface of the electric component and receives heat from the electric component, and a heat generating element non-abutment range part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the electric component, and the heat generating element non-abutment range part is fixedly adhered to the heat radiating element with a belt-shaped adhesive material; wherein the belt-shaped adhesive material is a sponge and fills a gap between the heat radiating element and a substrate around the electronic component.

Description

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a heat radiating structure of an electric component which generates heat and an electronic apparatus which is equipped with the heat radiating structure. Description of the Related Art Semiconductor chips such as a GPU (Graphics Processing Unit), a CPU (Central Processing Unit) and so forth are installed on a portable information apparatus such as a laptop PC and so forth. Each of the GPU and the CPU is in the form of having a substrate which is adapted to mount each of the GPU and the CPU on a baseplate and a rectangular die which is installed on the surface of the substrate. In addition, there are cases where a small capacitor is installed on the surface of the substrate around the die. The semiconductor chips such as the GPU, the CPU and so forth are heat generating elements and it is preferable to radiate heat from the GPU, the CPU and so forth depending on consumption power levels (in particular, when high loads are imposed thereon) of the GPU, the CPU and so forth. There are cases where a heat radiating element such as a vapor chamber, a heat spreader, a heat sink or the like is used as an element which radiates heat from the GPU, the CPU and so forth and heat is diffused by bringing the GPU, the CPU and so forth into abutment on the surface of the die via the heat radiating element such as the heat spreader, the heat sink or the like. There are cases where a fluid such as a liquid metal, a heat transfer grease and so forth is interposed between the die and the heat radiating element in order to efficiently transfer heat (see, for example, Japanese Unexamined Patent Application Publication No. 2004-146819). SUMMARY OF THE INVENTION The liquid metal is higher than the heat transfer grease in heat transfer property and makes it possible to transfer heat from the die to the heat radiating element effectively. On the other hand, the liquid metal has such a characteristic that it is higher than the heat transfer grease in fluidity. In a case where a user moves while carrying the electronic apparatus with him/her, the electronic apparatus is susceptible to vibrations and shocks. As a result, it is feared that the liquid metal which has fluidity would leak out through a gap between the die and the heat radiating element under the influence of the force which is repetitively exerted from the die and the heat radiating element. There are cases where the liquid metal contains gallium as a main component and therefore the liquid metal would chemically react with copper and solder. In addition, since the liquid metal is electrically conductive and therefore induces short circuits in a case where the liquid metal leaks out and comes into contact with peripheral electric elements such as a capacitor and so forth, it is preferable to take some sort of countermeasures. As the countermeasures to be taken, for example, it is conceivable to install an insulation wall between an electric element and the die which are installed on the substrate. However, in a case where the electric element and the die are installed close to each other, a space for installing the insulation wall is not secured. In addition, it is feared that the amount of the liquid metal which is retained between the die and the heat radiating element would be reduced due to leakage and the heat transfer performance would be degraded. Accordingly, the inventors of the present patent application consider to install a porous material such as a mesh and so forth into which the liquid metal is impregnated between the heat generating element such as the semiconductor chip and so forth and the heat radiating element such as the vapor chamber and so forth and to sandwich and hold the porous material between the heat generating element and the heat radiating element. The liquid metal which is impregnated into the mesh almost never leaks out and is maintained in the mesh. On the other hand, in a case where the porous material is sandwiched and held between the heat generating element and the heat radiating element with the aid of appropriate pressing force, misregistration almost never occurs. However, it is desirable that the porous material be fixed more accurately. The present invention has been made in view of the above-mentioned issues and aims to provide a heat radiating structure and an electronic apparatus which make it possible to prevent the degradation of the performance of heat transfer between an electric component which generates heat and the heat radiating element and to more prevent the misregistration of the porous material. In order to solve the above-mentioned issues and to attain the objects, a heat radiating structure according to a first aspect of the present invention is the heat radiating structure which is used for an electric component which generates heat and which includes a porous material which abuts on a surface of the electric component and a heat r