US-12622274-B2 - Packages with liquid metal as heat-dissipation media and method forming the same

Abstract

A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.

Inventors

• Wensen Hung
• Tsung-Yu Chen

Assignees

• TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Dates

Publication Date

20260505

Application Date

20230106

Claims (20)

1. 1 . A method comprising: attaching a permeable plate to a metal lid, wherein the permeable plate comprises a metallic material; dispensing a liquid-metal-comprising media to a first package component, wherein the first package component is over and bonded to a second package component, and wherein the liquid-metal-comprising media comprises a liquid metal therein; and attaching the metal lid to the second package component, wherein during the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.
2. 2 . The method of claim 1 , wherein at a time after the liquid-metal-comprising media is dispensed to the first package component and before the metal lid is attached to the second package component, the liquid-metal-comprising media is a solid plate.
3. 3 . The method of claim 2 , wherein the liquid metal is molten during the attaching the metal lid to the second package component, and is molten by an elevated temperature, and wherein after the attaching, the liquid metal is returned to a solid state.
4. 4 . The method of claim 3 , wherein the liquid metal is configured to be molten by heat generated in the first package component when the first package component is powered up.
5. 5 . The method of claim 1 , wherein at a time after the liquid-metal-comprising media is dispensed to the first package component and before the metal lid is attached to the second package component, the liquid metal is in a liquid form.
6. 6 . The method of claim 5 , wherein the liquid-metal-comprising media further comprises solid particles mixed in the liquid metal.
7. 7 . The method of claim 1 further comprising dispensing a blocker on the first package component, wherein the liquid-metal-comprising media is encircled by the blocker.
8. 8 . The method of claim 1 further comprising dispensing a solid thermal interface material on the first package component, wherein the first package component comprises a device die and a molding compound encircling the device die, and wherein the solid thermal interface material overlaps the molding compound, and the liquid-metal-comprising media is over and contacting the device die.
9. 9 . The method of claim 1 , wherein after the attaching, the liquid-metal-comprising media penetrates through the permeable plate to contact the metal lid.
10. 10 . The method of claim 1 , wherein the attaching the permeable plate to the metal lid comprises attaching a metal mesh to the metal lid, wherein the metal mesh comprises woven metal wires.
11. 11 . A method comprising: placing a first package component; attaching a second package component over the first package component; attaching an adhesive over the first package component; attaching a metal lid to the first package component through the adhesive, wherein a composite thermal interface material is formed between, and in physical contact with both of, the second package component and the metal lid, and wherein the composite thermal interface material comprises: a permeable plate; and a liquid-metal-comprising media in the permeable plate, wherein the liquid-metal-comprising media comprises a liquid metal, and the liquid-metal-comprising media is a solid at room temperature, and wherein the attaching the metal lid comprises heating the liquid-metal-comprising media as a liquid during the attaching the metal lid to the first package component.
12. 12 . The method of claim 11 , wherein the liquid-metal-comprising media is a paste at room temperature, and the method further comprises heating the liquid-metal-comprising media as a liquid during the attaching the metal lid to the first package component.
13. 13 . The method of claim 11 , wherein: at a first time before the attaching the metal lid to the first package component, the liquid-metal-comprising media and the permeable plate are discrete components; and at a second time after the attaching the metal lid to the first package component, the liquid-metal-comprising media fills first parts of through-channels of the permeable plate, and wherein second parts of the through-channels in the permeable plate are air gaps.
14. 14 . The method of claim 11 , wherein the composite thermal interface material comprises: a first middle portion overlapping a second middle portion of the second package component, wherein the first middle portion has a first thickness; and a first edge portion overlapping a second edge portion of the second package component, wherein the first edge portion has a second thickness different from the first thickness.
15. 15 . The method of claim 11 further comprising attaching a solid thermal interface material between, and in physical contact with both of, the second package component and the metal lid.
16. 16 . The method of claim 11 further comprising placing a blocker over the first package component, wherein the composite thermal interface material is encircled by the blocker.
17. 17 . The method of claim 11 , wherein the permeable plate comprises a plurality of layers of wires.
18. 18 . A method comprising: encapsulating a device die in a molding compound; dispensing a liquid-metal-comprising media as a paste over the molding compound and the device die; after the liquid-metal-comprising media is dispensed, forming a composite thermal interface material over and contacting the molding compound and the device die, wherein the composite thermal interface material comprises: a metal mesh; and the liquid-metal-comprising media extending to opposing sides of the metal mesh, wherein the liquid-metal-comprising media comprises a liquid metal, and wherein the liquid metal comprises a material selected from the group consisting of a gallium-based alloy, a bismuth-base alloy, and combinations thereof.
19. 19 . The method of claim 18 , wherein the liquid-metal-comprising media is a solid at room temperature, and the liquid-metal-comprising media is configured to change phase to a liquid when the device die is provided with power.
20. 20 . The method of claim 18 , wherein the metal mesh comprises a plurality of layers of wires.

Description

PRIORITY CLAIM AND CROSS-REFERENCE This application claims the benefit of U.S. Patent Provisional Application No. 63/380,844, filed Oct. 25, 2022 and entitled “Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same,” and U.S. Patent Provisional Application No. 63/369,675, filed on Jul. 28, 2022, and entitled “3DIC Package for Ultra Low TR,” which applications are hereby incorporated herein by reference. BACKGROUND In order to increase the functionality and integration level of integrated circuit packages, a plurality of package components such as device dies and package substrates may be bonded together. Due to the difference between different materials of the plurality of package components, warpage may occur. With the increase in the size of the packages, warpage become more severe. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIGS. 1A, 1B, and 2-5 illustrate the cross-sectional views and a top view of intermediate stages in the formation of a package in accordance with some embodiments. FIGS. 6A, 6B, 6C, 6D, 6E, 6F, and 6G illustrate the plane views and cross-sectional views of some permeable plates in accordance with some embodiments. FIGS. 7-9 illustrate the cross-sectional views and a top view of intermediate stages in the formation of a package including a permeable plate with different portions having different densities in accordance with some embodiments. FIGS. 10A, 10B, and 11 illustrate the cross-sectional views and a top view of intermediate stages in the formation of a package including a permeable plate with a non-uniform thickness in accordance with some embodiments. FIGS. 12 and 13 illustrate the cross-sectional views of intermediate stages in the formation of a package including two permeable plates in accordance with some embodiments. FIGS. 14A, 14B, and 15 illustrate the cross-sectional views and a top view of intermediate stages in the formation of a package including a blocker in accordance with some embodiments. FIGS. 16A, 16B, and 17 illustrate the cross-sectional views and a top view of intermediate stages in the formation of a package including a hybrid thermal interface material in accordance with some embodiments. FIG. 18 illustrates the cross-sectional view of a package including a fan-cooling heat sink in accordance with some embodiments. FIG. 19 illustrates the cross-sectional view of a package including a fan-cooling heat sink and a package including a liquid-cooling heat sink in accordance with some embodiments. FIG. 20 illustrates the cross-sectional view of a package used in an immersion-cooling system in accordance with some embodiments. FIGS. 21A, 21B, and 21C illustrate the cross-sectional views of permeable plates with uniform or non-uniform densities in accordance with some embodiments. FIG. 22 illustrates a process flow for forming a package in accordance with some embodiments. DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as “underlying,” “below,” “lower,” “overlying,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. A package including a liquid metal as a heat-dissipation media and the method of forming the same are provided. In accordance with some embo