US-12622282-B2 - High-frequency module and communication device

Abstract

A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.

Inventors

• Takashi Yamada
• Kiyoshi Aikawa
• Hiromichi Kitajima
• Takanori Uejima
• Yoshihiro DAIMON

Assignees

• MURATA MANUFACTURING CO., LTD.

Dates

Publication Date

20260505

Application Date

20230929

Priority Date

20210331

Claims (20)

1. 1 . A high-frequency module, comprising: a first module substrate including a first major surface opposite a second major surface; a second module substrate including a third major surface opposite a fourth major surface, the third major surface being disposed to face the second major surface; a plurality of electronic components disposed between the second major surface and the third major surface, on the first major surface, and on the fourth major surface; and a plurality of external connection terminals disposed on the fourth major surface, wherein a recess is formed in one of the first and second major surfaces included in the first module substrate or third and fourth major surfaces included in the second module substrate, the plurality of electronic components include a first electronic component, and a second electronic component shorter in height than the first electronic component, at least a part of the first electronic component is disposed in the recess, the second electronic component is disposed outside of the recess on the first major surface, the second major surface, the third major surface, or the fourth major surface in which the recess is formed, or on the first major surface, the second major surface, the third major surface, or the fourth major surface that faces the first major surface, the second major surface, the third major surface, or the fourth major surface in which the recess is formed.
2. 2 . The high-frequency module according to claim 1 , wherein the plurality of electronic components include a first filter, a first switch that switches whether to couple the first filter to an antenna connection terminal, and a first inductor coupled between the first switch and the first filter, and the first electronic component is the first inductor.
3. 3 . The high-frequency module according to claim 2 , wherein the recess is formed in the first major surface, the first filter is disposed on any one of the first major surface, the second major surface, and the third major surface, and the first switch is disposed on the fourth major surface.
4. 4 . The high-frequency module according to claim 1 , wherein the plurality of electronic components include a second filter, a low-noise amplifier, and a second inductor coupled between the low-noise amplifier and the second filter, and the first electronic component is the second inductor.
5. 5 . The high-frequency module according to claim 4 , wherein the recess is formed in the first major surface, the second filter is disposed on any one of the first major surface, the second major surface, and the third major surface, and the low-noise amplifier is disposed on the fourth major surface.
6. 6 . The high-frequency module according to claim 4 , wherein the recess is formed in the fourth major surface, the second filter is disposed on any one of the first major surface, the second major surface, and the third major surface, and the low-noise amplifier is disposed on the fourth major surface.
7. 7 . The high-frequency module according to claim 1 , wherein the first module substrate is thicker than the second module substrate, or the second module substrate is thicker than the first module substrate, and the recess is formed in the one of the first module substrate and the second module substrate.
8. 8 . The high-frequency module according to claim 7 , wherein the plurality of electronic components include a first filter and a second filter, a low-noise amplifier, a first switch that switches whether to couple the first filter to an antenna connection terminal, and a second inductor coupled between the low-noise amplifier and the second filter, the first electronic component is the second inductor, the high-frequency module further comprising: a first inductor coupled between the first switch and the first filter, wherein the first inductor is disposed within the one of the first module substrate and the second module substrate.
9. 9 . The high-frequency module according to claim 1 , wherein the plurality of electronic components include a power amplifier, a third filter, and a third inductor coupled between the power amplifier and the third filter, and the first electronic component is the power amplifier.
10. 10 . The high-frequency module according to claim 9 , wherein the recess is formed in the second major surface, the power amplifier is disposed on the third major surface, the third filter is disposed on any one of the first major surface, the second major surface, and the third major surface, and the third inductor is disposed on the first major surface.
11. 11 . The high-frequency module according to claim 1 , wherein the plurality of electronic components include a fourth filter including a filter body and an electrode terminal, the first electronic component is the fourth filter, and the electrode terminal of the fourth filter is joined to the bottom surface of the recess.
12. 12 . The high-frequency module according to claim 11 , wherein the recess is formed in the second major surface.
13. 13 . A communication device, comprising: a signal processing circuit processing a high-frequency signal; and the high-frequency module according to claim 1 which transfers the high-frequency signal between the signal processing circuit and an antenna.
14. 14 . The high-frequency module according to claim 1 , further comprising a resin member configured to shield the plurality of components from moisture.
15. 15 . The high-frequency module according to claim 14 , further comprising a shield electrode configured to cover the resin member and the first and second module substrates to shield the first and second module substrates from at least external noise.
16. 16 . The high-frequency module according to claim 15 , wherein the shield electrode includes a thin metallic film layer.
17. 17 . The high-frequency module according to claim 8 , wherein the first filter includes a bulk acoustic wave (BAW) filter.
18. 18 . The high-frequency module according to claim 8 , wherein the first filter includes a surface acoustic wave (SAW) filter.
19. 19 . The high-frequency module according to claim 1 , wherein at least one of the first electronic component and the second electronic component is an impedance matching network.
20. 20 . The communication device according to claim 13 , wherein the high frequency module includes an impedance matching network to connect to the antenna.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of international application no. PCT/JP2022/010867, filed Mar. 11, 2022, and which claims priority to Japanese application no. 2021-059997, filed Mar. 31, 2021. The entire contents of both prior applications are hereby incorporated by reference. TECHNICAL FIELD The present disclosure relates to a high-frequency module and a communication device. BACKGROUND ART In mobile communication devices, such as cellular phones, high-frequency front-end modules are becoming more and more complicated with an increasing number of bands to be supported in particular. A technique has been proposed to reduce the size of a high-frequency module by using two module substrates. CITATION LIST Patent Document Patent Document 1: International Publication No. WO 2020/022180 SUMMARY Technical Problem According to the aforementioned technique in the related art, however, the height of the high-frequency module is increased. The present disclosure therefore provides a high-frequency module and a communication device that can be reduced in size while being inhibited from increasing in height. Solution to Problem A high-frequency module according to an aspect of the present disclosure includes: a first module substrate including a first major surface opposite a second major surface; a second module substrate including a third major surface opposite a fourth major surface, the third major surface facing the second major surface; a plurality of electronic components disposed between the second major surface and the third major surface, on the first major surface, and on the fourth major surface; and a plurality of external connection terminals disposed on the fourth major surface. A recess is formed in one of the first and second major surfaces included in the first module substrate or one of the third and fourth major surfaces included in second module substrate. The plurality of electronic components include a first electronic component, and a second electronic component shorter in height than the first electronic component. At least a part of the first electronic component is disposed in the recess. The second electronic component is disposed outside of the recess on the first major surface, the second major surface, the third major surface, or the fourth major surface in which the recess is formed or on the first major surface, the second major surface, the third major surface, or the fourth major surface that faces the first major surface, the second major surface, the third major surface, or the fourth major surface in which the recess is formed. Exemplary Advantageous Effects The high-frequency module according to an aspect of the present disclosure can be reduced in size while being inhibited from increasing in height. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a circuit diagram of a high-frequency circuit and a communication device according to an exemplary embodiment. FIG. 2 is a plan view of a first major surface of a high-frequency module according to Example 1. FIG. 3 is a plan view of a second major surface of the high-frequency module according to Example 1. FIG. 4 is a plan view of a fourth major surface of the high-frequency module according to Example 1. FIG. 5 is a cross-sectional view of the high-frequency module according to Example 1. FIG. 6 is a plan view of a first major surface of a high-frequency module according to Example 2. FIG. 7 is a plan view of a first major surface of the high-frequency module according to Example 3. FIG. 8 is a plan view of a second major surface of the high-frequency module according to Example 3. FIG. 9 is a plan view of a fourth major surface of the high-frequency module according to Example 3. FIG. 10 is a cross-sectional view of the high-frequency module according to Example 3. FIG. 11 is a cross-sectional view of a high-frequency module according to Example 4. FIG. 12 is a plan view of a first major surface of a high-frequency module according to Example 5. FIG. 13 is a plan view of a second major surface of the high-frequency module according to Example 5. FIG. 14 is a plan view of a fourth major surface of the high-frequency module according to Example 5. FIG. 15 is a cross-sectional view of the high-frequency module according to Example 5. DESCRIPTION OF EMBODIMENTS Hereinafter, an exemplary embodiment of the present disclosure is described in detail using the drawings. The exemplary embodiment described below illustrates a comprehensive or specific example. The numerical values, shapes, materials, constituent components, arrangements and connections of the constituent components, and the like described in the following embodiment are illustrative only and will not limit the present disclosure. Each drawing is a schematic diagram including proper emphases, omissions, or adjustment of proportions in order to show the present disclosure and is not always illustrated exactly. The shapes, positional relationshi