US-12622299-B2 - Electronic circuit module

US12622299B2US 12622299 B2US12622299 B2US 12622299B2US-12622299-B2

Abstract

An electronic circuit module includes a substrate, a first electronic component mounted on one principal surface of the substrate, a substrate electrode provided on the one principal surface, a second electronic component supported by a support surface opposite to a surface of the first electronic component facing the one principal surface, a component electrode provided on a surface of the second electronic component, and a conductor including a connection part connecting the substrate electrode and the component electrode. The second electronic component includes a conductive portion electrically connected to the component electrode. The conductive portion is separated from a support surface of the first electronic component.

Inventors

Yoshihito OTSUBO
Hirofumi OIE

Assignees

MURATA MANUFACTURING CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20230922
Priority Date: 20210408

Claims (17)

1 . An electronic circuit module comprising: a substrate; a first electronic component mounted on one principal surface of the substrate; a substrate electrode provided on the one principal surface; a second electronic component supported by a support surface opposite to a surface of the first electronic component facing the one principal surface; a component electrode provided on a surface of the second electronic component; and a conductor including a connection part connecting the substrate electrode and the component electrode, wherein: the second electronic component includes a conductive portion electrically connected to the component electrode, the conductive portion is separated from a support surface of the first electronic component, the second electronic component is in surface contact with the support surface of the first electronic component, the component electrode is disposed in a non-contact region not in contact with the first electronic component on the surface of the second electronic component, and the conductor comprises a grounding part disposed so as to cover the first electronic component and the second electronic component, and is electrically connected to a ground to shield an electromagnetic wave.
2 . The electronic circuit module according to claim 1 , wherein the second electronic component is supported on the support surface of the first electronic component via the component electrode.
3 . The electronic circuit module according to claim 1 , wherein the first electronic component is an electronic component constituting at least a part of a transmission circuit.
4 . The electronic circuit module according to claim 1 , further comprising a first sealing resin provided on the one principal surface and covering at least a part of the first electronic component, at least a part of the second electronic component, and a part of the conductor, wherein at least a part of a surface of the conductor opposite to a surface facing the second electronic component, the surface being located on an opposite side to the first electronic component with respect to the second electronic component in a thickness direction of the substrate, is exposed from the first sealing resin provided on the one principal surface.
5 . The electronic circuit module according to claim 1 , further comprising a first sealing resin provided on the one principal surface and covering at least a part of the first electronic component, at least a part of the second electronic component, and at least a part of the conductor, wherein a through hole through which the conductor communicates with an outside of the first sealing resin provided on the one principal surface is provided in the first sealing resin provided on the one principal surface.
6 . The electronic circuit module according to claim 1 , wherein the first electronic component and the second electronic component are electronic components constituting at least a part of a transmission circuit.
7 . The electronic circuit module according to claim 1 , wherein, when the substrate is viewed from a direction orthogonal to the one principal surface, an area of the second electronic component is larger than an area of the first electronic component.
8 . The electronic circuit module according to claim 1 , further comprising a resin sheet disposed so as to cover at least one of at least a part of the first electronic component and at least a part of the second electronic component, wherein at least a part of the conductor is patterned on a surface of the resin sheet opposite to a surface facing the first electronic component and the second electronic component.
9 . The electronic circuit module according to claim 1 , wherein at least a part of the conductor is in contact with at least one of the surface of the first electronic component and the surface of the second electronic component.
10 . The electronic circuit module according to claim 2 , further comprising a resin sheet disposed so as to cover at least a part of the first electronic component, wherein at least a part of the conductor is patterned on a surface of the resin sheet opposite to a surface facing the first electronic component.
11 . The electronic circuit module according to claim 2 , wherein at least a part of the conductor is in contact with a surface of the first electronic component.
12 . The electronic circuit module according to claim 3 , wherein the first electronic component is a power amplifier, a surface acoustic wave filter, or a bulk acoustic wave filter.
13 . The electronic circuit module according to claim 3 , wherein the second electronic component is an electronic component constituting at least a part of a transmission circuit, and the first electronic component operates in a higher frequency band than the second electronic component.
14 . The electronic circuit module according to claim 4 , wherein the substrate further comprises another principal surface opposite to the one principal surface, and the electronic circuit module further comprises: a third electronic component mounted on another principal surface; a second sealing resin provided on the other principal surface and covering at least a part of the third electronic component mounted on the other principal surface; and a shield member covering a surface of the second sealing resin provided on the other principal surface, the surface of the second sealing resin being opposite to the surface in contact with the other principal surface.
15 . The electronic circuit module according to claim 6 , wherein the second electronic component operates in a higher frequency band than the first electronic component.
16 . The electronic circuit module according to claim 7 , wherein another electronic component mounted on the one principal surface is disposed in a space provided between the substrate and the second electronic component.
17 . The electronic circuit module according to claim 12 , wherein the second electronic component is an electronic component constituting at least a part of a transmission circuit, and the first electronic component operates in a higher frequency band than the second electronic component.

Description

CROSS REFERENCE TO RELATED APPLICATION This is a continuation of International Application No. PCT/2022/006914 filed on Feb. 21, 2022 which claims priority from Japanese Patent Application No. 2021-065924 filed on Apr. 8, 2021. The contents of these applications are incorporated herein by reference in their entireties. BACKGROUND OF THE DISCLOSURE Field of the Disclosure The present disclosure relates to an electronic circuit module in which an electronic component is mounted on a substrate. Description of the Related Art Conventionally, as this type of electronic circuit module, for example, an electronic circuit module described in Patent Document 1 is known. The electronic circuit module described in Patent Document 1 includes a substrate, a first filter element (hereinafter, referred to as a “first electronic component”), and a second filter element (hereinafter, referred to as a “second electronic component”). The second electronic component is supported on a principal surface of the substrate via a plurality of pillars. The first electronic component is disposed in a space between the substrate and the second electronic component, and is mounted on the principal surface of the substrate. Patent Document 1: US 2020/0077510 A BRIEF SUMMARY OF THE DISCLOSURE In the electronic circuit module described in Patent Document 1, for example, a height of each pillar from the substrate may change due to melting of solder included in each pillar at the time of manufacturing the electronic circuit module. In this case, the position and the posture of the second electronic component may be shifted to cause malfunction of the electronic circuit module. Therefore, a possible benefit of the present disclosure is to solve the above problem, and to provide an electronic circuit module in which displacement of a position and a posture of the second electronic component is suppressed. In order to solve the problem, an electronic circuit module according to the present disclosure includes: a substrate; a first electronic component mounted on one principal surface of the substrate; a substrate electrode provided on the one principal surface; a second electronic component supported by a support surface opposite to a surface of the first electronic component facing the one principal surface; a component electrode provided on a surface of the second electronic component; and a conductor including a connection part connecting the substrate electrode and the component electrode, in which the second electronic component includes a conductive portion electrically connected to the component electrode, and the conductive portion is separated from a support surface of the first electronic component. According to the present disclosure, it is possible to provide an electronic circuit module in which displacement of a position and a posture of the second electronic component is suppressed. BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS FIG. 1 is a plan view of an electronic circuit module according to a first embodiment of the present disclosure; FIG. 2 is a cross-sectional view of the electronic circuit module of FIG. 1 taken along line II-II; FIG. 3 is a cross-sectional view illustrating a cross section at a position corresponding to line II-II in FIG. 1 of a modification of the electronic circuit module according to the first embodiment of the present disclosure; FIG. 4 is a cross-sectional view illustrating a cross section at a position corresponding to line II-II in FIG. 1 of a modification of the electronic circuit module according to the first embodiment of the present disclosure; FIG. 5 is a cross-sectional view illustrating a cross section at a position corresponding to line II-II in FIG. 1 of a modification of the electronic circuit module according to the first embodiment of the present disclosure; FIG. 6 is a bottom view of an electronic circuit module according to a second embodiment of the present disclosure; FIG. 7 is a cross-sectional view of the electronic circuit module of FIG. 6 taken along line VII-VII; FIG. 8 is a cross-sectional view illustrating a cross section at a position corresponding to line VII-VII in FIG. 6 of a modification of the electronic circuit module according to the second embodiment of the present disclosure; FIG. 9 is a bottom view of an electronic circuit module according to a third embodiment of the present disclosure; FIG. 10 is a cross-sectional view of the electronic circuit module of FIG. 9 taken along line X-X; and FIG. 11 is a cross-sectional view illustrating a cross section of an electronic circuit module according to a fourth embodiment of the present disclosure at a position corresponding to line X-X in FIG. 9. DETAILED DESCRIPTION OF THE DISCLOSURE An electronic circuit module according to one aspect of the present disclosure includes: a substrate; a first electronic component mounted on one principal surface of the substrate; a substrate electrode provided on the one principa