US-12622313-B2 - Metal pocket fanout package

US12622313B2US 12622313 B2US12622313 B2US 12622313B2US-12622313-B2

Abstract

Disclosed are examples of die packages that incorporate metal frames with metal pockets. One or more dies may be placed within the metal pockets. Due to the structural integrity provided by the metal frame, warpage is reduced or eliminated. As a result, die packages with thin dies may be fabricated. Further, due to the electrical conductivity provided by the metal frame, the metal frame may be used as an electrical shield to protect the dies.

Inventors

Hong Bok We
Joan Rey Villarba BUOT
Sang-Jae Lee
Zhijie Wang

Assignees

QUALCOMM INCORPORATED

Dates

Publication Date: 20260505
Application Date: 20221208

Claims (20)

1 . A die package, comprising: a metal frame comprising a metal cover and a plurality of metal walls, a metal pocket being formed in spaces below the metal cover and between adjacent metal walls; a die within the metal pocket, die connects of the die facing an open end of the metal pocket; a resin within the metal pocket, the resin encapsulating the die, and the die connects being exposed at the open end of the metal pocket through the resin, wherein the resin is in between the metal cover and the die, and wherein the resin covers all of a lower surface of the die other than portions covered by the die connects; and one or more redistribution layers (RDL) below the metal frame, each RDL comprising one or more vias and one or more traces formed in a dielectric, wherein one or more electrical paths are provided between the die and one or more components external to the die package through the die connects and through the one or more vias and the one or more traces of the one or more RDLs, and wherein a lower surface of the resin is above lower surfaces of the plurality of metal walls.
2 . The die package of claim 1 , further comprising: one or more interconnects electrically coupled to the one or more traces of a last RDL, the last RDL being an RDL furthest from the metal frame, wherein one or more electrical paths are provided between the die and the one or more interconnects through the die connects and through the one or more vias and the one or more traces of the one or more RDLs.
3 . The die package of claim 2 , wherein an electrical path, a thermal path, or both are provided between at least one interconnect and the metal frame through at least one via of each of the one or more RDLs.
4 . The die package of claim 1 , further comprising: an overmold within the metal pocket between the resin and a first RDL immediately adjacent to the metal frame, wherein the overmold and the resin encapsulate side surfaces of the die connects.
5 . The die package of claim 4 , wherein lower surfaces of the plurality of metal walls, lower surfaces of the die connects, and a lower surface of the overmold are in physical contact with an upper surface of the first RDL.
6 . The die package of claim 1 , wherein at least one via of a first RDL is in physical contact with the metal frame, the first RDL being an RDL immediately adjacent to the metal frame.
7 . The die package of claim 1 , wherein the metal frame is electrically coupled to power or to ground voltage.
8 . The die package of claim 1 , wherein the die is a first die, wherein the die package further comprises a second die within the metal pocket adjacent to the first die, the second die also being encapsulated by the resin, die connects of the second die facing the open end of the metal pocket, and wherein one or more electrical paths are provided between the second die and the one or more components external to the die package through the die connects of the second die and through the one or more vias and the one or more traces of the one or more RDLs.
9 . The die package of claim 1 , wherein the metal pocket is a first metal pocket formed in a space below the metal cover and between a first pair of adjacent metal walls, and the die is a first die within the first metal pocket, wherein a second metal pocket is formed in a space below the metal cover and between a second pair of adjacent metal walls, wherein the die package further comprises a second die within the second metal pocket, the second die also being encapsulated by the resin, die connects of the second die facing an open end of the second metal pocket, and wherein one or more electrical paths are provided between the second die and one or more components external to the die package through the die connects of the second die and through the one or more vias and the one or more traces of the one or more RDLs.
10 . The die package of claim 1 , wherein the die package is incorporated into an apparatus selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IOT) device, a laptop computer, a server, and a device in an automotive vehicle.
11 . A method of fabricating a die package, the method comprising: providing a metal frame comprising a metal cover and a plurality of metal walls, a metal pocket being formed in a space below the metal cover and between adjacent metal walls; placing a die within the metal pocket, die connects of the die facing an open end of the metal pocket; providing a resin within the metal pocket, the resin encapsulating the die, and the die connects being exposed at the open end of the metal pocket through the resin, wherein the resin is in between the metal cover and the die, and wherein the resin covers all of a lower surface of the die other than portions covered by the die connects; and forming one or more redistribution layers (RDL) below the metal frame, each RDL comprising one or more vias and one or more traces formed in a dielectric, wherein one or more electrical paths are provided between the die and one or more components external to the die package through the die connects and through the one or more vias and the one or more traces of the one or more RDLs, and wherein a lower surface of the resin is above lower surfaces of the plurality of metal walls.
12 . The method of claim 11 , further comprising: forming one or more interconnects electrically coupled to the one or more traces of a last RDL, the last RDL being an RDL furthest from the metal frame, wherein one or more electrical paths are provided between the die and the one or more interconnects through the die connects and through the one or more vias and the one or more traces of the one or more RDLs.
13 . The method of claim 12 , wherein an electrical path, a thermal path, or both are provided between at least one interconnect and the metal frame through at least one via of each of the one or more RDLs.
14 . The method of claim 11 , further comprising: forming an overmold within the metal pocket between the resin and a first RDL immediately adjacent to the metal frame, wherein the overmold and the resin encapsulate side surfaces of the die connects.
15 . The method of claim 14 , wherein lower surfaces of the adjacent metal walls, lower surfaces of the die connects, and a lower surface of the overmold are in physical contact with an upper surface of the first RDL.
16 . The method of claim 11 , wherein at least one via of a first RDL is in physical contact with the metal frame, the first RDL being an RDL immediately adjacent to the metal frame.
17 . The method of claim 11 , wherein the metal frame is electrically coupled to power or to ground voltage.
18 . The method of claim 11 , wherein the die is a first die, wherein the method further comprises placing a second die within the metal pocket adjacent to the first die, the second die also being encapsulated by the resin, die connects of the second die facing the open end of the metal pocket, and wherein one or more electrical paths are provided between the second die and the one or more components external to the die package through the die connects of the second die and through the one or more vias and the one or more traces of the one or more RDLs.
19 . The method of claim 11 , wherein the metal pocket is a first metal pocket formed in a space below the metal cover and between a first pair of adjacent metal walls, and the die is a first die within the first metal pocket, wherein a second metal pocket is formed in a space below the metal cover and between a second pair of adjacent metal walls, wherein the method further comprises placing a second die within the second metal pocket, the second die also being encapsulated by the resin, die connects of the second die facing an open end of the second metal pocket, and wherein one or more electrical paths are provided between the second die and one or more components external to the die package through the die connects of the second die and through the one or more vias and the one or more traces of the one or more RDLs.
20 . The method of claim 11 , wherein no carrier is used in fabrication of the die package.

Description

FIELD OF DISCLOSURE This disclosure relates generally to die packages, and more specifically, but not exclusively, to metal pocket fanout packages and fabrication techniques thereof. BACKGROUND Integrated circuit technology has achieved great strides in advancing computing power through miniaturization of active components. The package devices can be found in many electronic devices, including processors, servers, radio frequency (RF) integrated circuits, etc. Packaging technology becomes cost-effective in high pin count devices and/or high production volume components. Fanout package has a fundamental problem if the body size goes larger. Thus, it becomes hard to use a thin die for fanout package or single large die package due to mechanical stability considerations. Accordingly, there is a need for systems, apparatus, and methods that overcome the deficiencies of conventional die packages including the methods, system and apparatus provided herein. SUMMARY The following presents a simplified summary relating to one or more aspects and/or examples associated with the apparatus and methods disclosed herein. As such, the following summary should not be considered an extensive overview relating to all contemplated aspects and/or examples, nor should the following summary be regarded to identify key or critical elements relating to all contemplated aspects and/or examples or to delineate the scope associated with any particular aspect and/or example. Accordingly, the following summary has the sole purpose to present certain concepts relating to one or more aspects and/or examples relating to the apparatus and methods disclosed herein in a simplified form to precede the detailed description presented below. An exemplary die package is disclosed. The die package may comprise a metal frame, which may comprise a metal cover and a plurality of metal walls. One or more metal pockets may be formed in spaces below the metal cover and between adjacent metal walls. The die package may also comprise a die within a metal pocket. Die connects of the die may face an open end of the metal pocket. The die package may further comprise a resin within the metal pocket. The resin may encapsulate the die. The die connects may be exposed at the open end of the metal pocket through the resin. The die package may yet comprise one or more redistribution layers (RDL) below the metal frame. Each RDL may comprise one or more vias and one or more traces formed in a dielectric. One or more electrical paths may be provided between the die and one or more components external to the die package through the die connects and through the one or more vias and the one or more traces of the one or more RDLs. A method of fabricating an exemplary die package is disclosed. The method may comprise providing a metal frame, which may comprise a metal cover and a plurality of metal walls. One or more metal pockets may be formed in spaces below the metal cover and between adjacent metal walls. The method may also comprise placing a die within a metal pocket. Die connects of the die may face an open end of the metal pocket. The method may further comprise providing a resin within the metal pocket. The resin may encapsulate the die. The die connects may be exposed at the open end of the metal pocket through the resin. The method may yet comprise forming one or more redistribution layers (RDL) below the metal frame. Each RDL may comprise one or more vias and one or more traces formed in a dielectric. One or more electrical paths may be provided between the die and one or more components external to the die package through the die connects and through the one or more vias and the one or more traces of the one or more RDLs. Other features and advantages associated with the apparatus and methods disclosed herein will be apparent to those skilled in the art based on the accompanying drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS A more complete appreciation of aspects of the disclosure and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings which are presented solely for illustration and not limitation of the disclosure. FIGS. 1 and 2 illustrates examples of conventional die packages. FIGS. 3-5 illustrate examples of die packages in accordance with one or more aspects of the disclosure. FIGS. 6A-6K illustrate examples of stages of fabricating die packages in accordance with one or more aspects of the disclosure. FIGS. 7-8 illustrate flow charts of example methods of manufacturing a die package in accordance with one or more aspects of the disclosure. FIG. 9 illustrates various electronic devices which may utilize one or more aspects of the disclosure. Other objects and advantages associated with the aspects disclosed herein will be apparent to those skilled in the art based on the