US-12622324-B2 - Semiconductor package and method for producing a semiconductor package

US12622324B2US 12622324 B2US12622324 B2US 12622324B2US-12622324-B2

Abstract

A semiconductor package comprises an encapsulation having a first lateral side and an opposite second lateral side, at least one power semiconductor chip having a drain contact region running along the first lateral side, a source contact region running along the second lateral side, and first and second inner contact regions arranged between the drain and source contact regions, a first external terminal which is connected to the drain contact region, is arranged centrally on the first lateral side, and is configured to apply a supply voltage for the at least one power semiconductor chip, a second external terminal which is connected to the source contact region, is arranged centrally on the second lateral side, and is configured to apply a reference voltage for the at least one power semiconductor chip, third and fourth external terminals which are connected to the first inner contact region. are arranged opposite each other at a first end of the first and second lateral sides, respectively, and are configured a first output of the semiconductor package, and fifth and sixth external terminals which are connected to the second inner contact region and are arranged opposite each other at a second end of the first and second lateral sides, respectively, and are configured as a second output of the semiconductor package.

Inventors

Rainald Sander
Lars Eckert
Fortunato Lopez

Assignees

INFINEON TECHNOLOGIES AG

Dates

Publication Date: 20260505
Application Date: 20221010
Priority Date: 20211021

Claims (15)

1 . A semiconductor package comprising: an encapsulation including a first lateral side and an opposite second lateral side, at least one power semiconductor chip including a drain contact region running along the first lateral side, a source contact region running along the second lateral side, and first and second inner contact regions arranged between the drain and source contact regions, a first external terminal which is connected to the drain contact region, is arranged centrally on the first lateral side, and is configured to apply a supply voltage for the at least one power semiconductor chip, a second external terminal which is connected to the source contact region, is arranged centrally on the second lateral side, and is configured to apply a reference voltage for the at least one power semiconductor chip, third and fourth external terminals which are connected to the first inner contact region, are arranged opposite each other at a first end of the first and second lateral sides, respectively, and are configured as a first output of the semiconductor package, and fifth and sixth external terminals which are connected to the second inner contact region, are arranged opposite each other at a second end of the first and second lateral sides, respectively, and are configured as a second output of the semiconductor package.
2 . The semiconductor package according to claim 1 , wherein the semiconductor package comprises a single power semiconductor chip, wherein the power semiconductor chip comprises first, second, third, and fourth transistors, wherein the first transistor is connected to the drain contact region and the first inner contact region, wherein the second transistor is connected to the source contact region and the first inner contact region, wherein the third transistor is connected to the drain contact region and the second inner contact region, and wherein the fourth transistor is connected to the source contact region and the second inner contact region.
3 . The semiconductor package according to claim 2 , wherein the power semiconductor chip further comprises an integrated circuit for controlling the first, second, third, and fourth transistors.
4 . The semiconductor package according to claim 1 , wherein the semiconductor package comprises first and second power semiconductor chips, wherein both the first and second power semiconductor chips comprise the drain contact region and the source contact region, and wherein only the first power semiconductor chip comprises the first inner contact region and only the second power semiconductor chip comprises the second inner contact region.
5 . The semiconductor package according to claim 4 , wherein the first power semiconductor chip comprises first and second transistors and the second power semiconductor chip comprises third and fourth transistors, wherein the first transistor is connected to the drain contact region and the first inner contact region, wherein the second transistor is connected to the source contact region and the first inner contact region, wherein the third transistor is connected to the drain contact region and the second inner contact region, and wherein the fourth transistor is connected to the source contact region and the second inner contact region.
6 . The semiconductor package according to claim 4 , wherein the first power semiconductor chip further comprises a first integrated circuit and the second power semiconductor chip further comprises a second integrated circuit.
7 . The semiconductor package according to claim 1 , wherein various contact regions and external terminals are connected by bonding wires or by clips.
8 . The semiconductor Semiconductor package according to claim 1 , further comprising: at least one chip carrier, wherein the at least one power semiconductor chip is arranged on the at least one chip carrier, and wherein the at least one chip carrier and the external terminals are parts of one or more leadframes.
9 . The semiconductor package according to claim 1 , further comprising: a plurality of external control terminals which are arranged along the first lateral side and along the second lateral side and are configured to apply control signals for the at least one power semiconductor chip.
10 . The semiconductor package according to claim 1 , wherein the encapsulation further comprises third and fourth lateral sides, wherein the drain and source contact regions taper toward the third and fourth lateral sides, and wherein the first and second inner contact regions widen toward the third and fourth lateral sides.
11 . The semiconductor package according to claim 1 , wherein all of the contact regions are arranged on an upper main side of the at least one power semiconductor chip.
12 . The semiconductor package according to claim 1 , wherein the encapsulation comprises a molded body.
13 . A method for producing a semiconductor package, wherein the method comprises: providing a power semiconductor chip having a first lateral side and an opposite second lateral side, wherein the power semiconductor chip comprises a drain contact region running along the first lateral side, a source contact region running along the second lateral side, and first and second inner contact regions arranged between the drain and source contact regions, connecting the drain contact region to a first external terminal which is arranged on the first lateral side and is configured to apply a supply voltage for the power semiconductor chip, connecting the source contact region to a second external terminal which is arranged on the second lateral side and is configured to apply a reference voltage for the power semiconductor chip, connecting the first inner contact region to third and fourth external terminals which are arranged opposite each other on the first and second lateral sides, respectively, and are configured as a first output of the semiconductor package, connecting the second inner contact region to fifth and sixth external terminals which are arranged opposite each other on the first and second lateral sides, respectively, and are configured as a second output of the semiconductor package, and encapsulating the power semiconductor chip in an encapsulation such that the external connections to the encapsulation are exposed.
14 . The method according to claim 13 , wherein connecting the drain contact region, connecting the source contact region, connecting the first inner contact region, and connecting the second inner contact region each comprises wire bonding or attaching a clip.
15 . The method according to claim 13 , wherein providing the power semiconductor chip comprises arranging the power semiconductor chip on a chip carrier such that all of the contact regions face away from the chip carrier.

Description

TECHNICAL FIELD The present disclosure relates to a semiconductor package and to a method for producing a semiconductor package. BACKGROUND Semiconductor packages can comprise at least one power semiconductor chip having a plurality of contacts or contact regions, for example, drain and source contact regions, and external terminals connected to the contact regions. The relative arrangement of the contact regions on the power semiconductor chip and the external terminals in relation to each other may affect, for example, the length of the electrical connections between the various contact regions and external terminals. This, in turn, may help determine what parasitic resistances and/or parasitic inductances are caused by the electrical connections in the semiconductor package, with longer electrical connections having greater parasitic effects. However, for many applications for which semiconductor packages may be intended, such as drivers for electric motors, such parasitic effects can be problematic, and thus there is a desire to reduce such parasitic effects. Improved semiconductor packages and improved methods for producing semiconductor package can help solve this and other problems. The problem forming the basis of the invention is solved by the features of the independent claims. Advantageous embodiments and developments of the invention are described in the dependent claims. OVERVIEW Individual examples relate to a semiconductor package comprising: an encapsulation having a first lateral side and an opposite second lateral side, at least one power semiconductor chip having a drain contact region running along the first lateral side, a source contact region running along the second lateral side, and first and second inner contact regions arranged between the drain and source contact regions, a first external terminal which is connected to the drain contact region, is arranged centrally on the first lateral side, and is configured to apply a supply voltage for the at least one power semiconductor chip, a second external terminal which is connected to the source contact region, is arranged centrally on the second lateral side, and is configured to apply a reference voltage for the at least one power semiconductor chip, third and fourth external terminals which are connected to the first inner contact region, are arranged opposite each other at a first end of the first and second lateral sides, respectively, and are configured as a first output of the semiconductor package, and fifth and sixth external terminals which are connected to the second inner contact region, are arranged opposite each other at a second end of the first and second lateral sides, respectively, and are configured as a second output of the semiconductor package. Individual examples relate to a semiconductor package comprising: an encapsulation having a first lateral side, a second lateral side opposite the first lateral side, a third lateral side, and a fourth lateral side opposite the third lateral side, a power semiconductor chip having a drain contact region running along the first lateral side, a source contact region running along the second lateral side, and first and second inner contact regions arranged between the drain and source contact regions, a first external terminal which is connected to the drain contact region, is arranged centrally on the first lateral side, and is configured to apply a supply voltage to the power semiconductor chip, and a second external terminal which is connected to the source contact region, is arranged centrally on the second lateral side, and is configured to apply a reference voltage for the power semiconductor chip, a third external terminal which is connected to the first inner contact region, is arranged centrally on the third lateral side, and is configured to be a first output of the semiconductor package, and a fifth external terminal which is connected to the second inner contact region, is arranged centrally on the fourth lateral side, and is configured to be a second output of the semiconductor package. Individual examples relate to a method for producing a semiconductor package, wherein the method comprises: providing a power semiconductor chip having a first lateral side and an opposite second lateral side, wherein the power semiconductor chip comprises a drain contact region running along the first lateral side, a source contact region running along the second lateral side, and first and second inner contact regions arranged between the drain and source contact regions, connecting the drain contact region to a first external terminal which is arranged on the first lateral side and is configured to apply a supply voltage for the power semiconductor chip, connecting the source contact region to a second external terminal which is arranged on the second lateral side and is configured to apply a reference voltage for the power semiconductor chip, connecting the first inner contact