US-12622333-B2 - Semiconductor device

US12622333B2US 12622333 B2US12622333 B2US 12622333B2US-12622333-B2

Abstract

A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.

Inventors

Hiroaki Matsubara
Yoshizo OSUMI
Tomohira Kikuchi
Shingo Matsumaru

Assignees

ROHM CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20211001
Priority Date: 20201020

Claims (17)

1 . A semiconductor device comprising: a conductive support member including a first die pad and a second die pad spaced apart from the first die pad in a first sense of a first direction perpendicular to a thickness direction and held at a potential different from a potential of the first die pad; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad and forming an output-side circuit together with the second die pad; a third semiconductor element; and a sealing resin covering at least a portion of the conductive support member, the first semiconductor element and the second semiconductor element, wherein the first semiconductor element includes: a circuit part forming an input-side circuit together with the first die pad; and an insulating part that transmits a signal between the input-side circuit and the output-side circuit and provides electrical insulation between the input-side circuit and the output-side circuit, the conductive support member includes: a plurality of input-side terminals spaced apart from each other in the first direction, at least one of the plurality of input-side terminals being electrically connected to the input-side circuit; and a plurality of output-side terminals spaced apart from each other in the first direction, at least one of the plurality of output-side terminals being electrically connected to the output-side circuit, and the sealing resin includes: a first side face offset in a first sense of a second direction perpendicular to the thickness direction and the first direction, the plurality of input-side terminals protruding from the first side face; a second side face offset in a second sense of the second direction, the plurality of output-side terminals protruding from the second side face; a third side face offset in the first sense of the first direction and connected to the first side face and the second side face; and a fourth side face offset in a second sense of the first direction and connected to the first side face and the second side face, the conductive support member is not exposed on the third side face, the conductive support member includes: a third die pad spaced apart from the first die pad in the second sense of the first direction and held at a potential different from the first die pad; and a plurality of second output-side terminals spaced apart from each other in the first direction and protruding from the second side face, the third semiconductor element is mounted on the third die pad and forms a second output-side circuit together with the third die pad, the insulating part transmits a signal between the input-side circuit and the second output-side circuit and provides electrical insulation between the input-side circuit and the second output-side circuit, at least one of the plurality of second output-side terminals is electrically connected to the second output-side circuit, and the conductive support member is not exposed on the fourth side face.
2 . The semiconductor device according to claim 1 , wherein the sealing resin further includes: a first groove recessed from the third side face in the first direction and extending in the thickness direction, and a second groove recessed from the fourth side face in the first direction and extending in the thickness direction.
3 . The semiconductor device according to claim 1 , further comprising a supporting-terminal wire, wherein the plurality of input-side terminals include a supporting terminal connected to the first die pad, and the supporting-terminal wire is connected to the supporting terminal and to the first semiconductor element, the supporting-terminal wire including a second bond that is a portion bonded to the supporting terminal and a security bond formed on the second bond.
4 . The semiconductor device according to claim 3 , wherein the plurality of input-side terminals include a second supporting terminal connected to the first die pad, the supporting terminal is connected to an end of the first die pad offset in the second sense of the first direction, and the second supporting terminal is connected to an end of the first die pad offset in the first sense of the first direction.
5 . The semiconductor device according to claim 3 , wherein the supporting-terminal wire further includes a wire segment connected to the second bond, the supporting terminal includes a bonding surface to which the supporting-terminal wire is bonded, and as viewed in the thickness direction, the security bond has a center located within a region of the bonding surface extending away from the wire segment beyond the second bond.
6 . The semiconductor device according to claim 5 , wherein the second bond and the wire segment defines a boundary, as viewed in the thickness direction, that is contained within the security bond.
7 . The semiconductor device according to claim 5 , wherein the supporting terminal includes a dent in the bonding surface, and the security bond overlaps with the dent as viewed in the thickness direction.
8 . The semiconductor device according to claim 3 , further comprising a discrete-terminal wire connected to a discrete terminal, the discrete terminal being one of the terminals of the conductive support member and not connected to any of the first die pad, the second die pad and the third die pad, wherein the discrete-terminal wire includes a discrete-terminal wire second bond that is a portion bonded to the discrete terminal, and no security bond is formed on the discrete-terminal wire second bond.
9 . The semiconductor device according to claim 1 , further comprising a supporting-terminal wire, wherein the plurality of output-side terminals include a supporting terminal connected to the second die pad, and the supporting-terminal wire is connected to the supporting terminal and to the second semiconductor element, the supporting-terminal wire including a second bond that is a portion bonded to the supporting terminal and a security bond formed on the second bond.
10 . The semiconductor device according to claim 1 , further comprising a supporting-terminal wire, wherein the plurality of second output-side terminals include a supporting terminal connected to the third die pad, and the supporting-terminal wire is connected to the supporting terminal and to the third semiconductor element, the supporting-terminal wire including a second bond that is a portion bonded to the supporting terminal and a security bond formed on the second bond.
11 . The semiconductor device according to claim 1 , wherein the third side face includes a first gate mark having a greater surface roughness than another region of the third side face, and the fourth side face includes a second gate mark having a greater surface roughness than another region of the fourth side face.
12 . The semiconductor device according to claim 11 , further comprising a first wire, wherein the plurality of input-side terminals include an input-side first terminal that is an outermost one of the plurality of input-side terminals in the first sense of the first direction, the first wire is connected to the input-side first terminal and to the first semiconductor element, and the first gate mark is located on an extension line of the first wire as viewed in the thickness direction.
13 . The semiconductor device according to claim 12 , further comprising a second wire, wherein the plurality of input-side terminals include an input-side second terminal adjacent to the input-side first terminal, the second wire is connected to the input-side second terminal and to the first semiconductor element, and the first wire is located between the second semiconductor element and the second wire as viewed in the thickness direction.
14 . The semiconductor device according to claim 12 , wherein the second gate mark is located on the extension line as viewed in the thickness direction.
15 . The semiconductor device according to claim 1 , wherein the insulating part is of an inductive type.
16 . The semiconductor device according to claim 1 , wherein the conductive support member is made of an alloy containing Cu.
17 . The semiconductor device according to claim 1 , wherein the sealing resin is made of an electrically insulating epoxy resin.

Description

TECHNICAL FIELD The present disclosure relates to a semiconductor device provided in a single package in which signals are transmitted between a plurality of semiconductor elements via an insulating or isolating part. BACKGROUND ART Inverter devices have been conventionally used in home appliances and electronic vehicles (including hybrid vehicles, and the same applies hereinafter). For example, an inverter device incorporated in an electronic vehicle includes a plurality of power semiconductors, such as insulated gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs), and another semiconductor device (including a control element and a drive element). For operation of the inverter device, a control signal from an engine control unit (ECU) is inputted to the control element of the semiconductor device. The control element converts the control signal to a pulse width modulation (PWM) signal and passes the resulting signal to the drive element. Based on the PWM control signal, the drive element controls the switching of the plurality of (e.g., six) power semiconductors at appropriate timing. With the six power semiconductors switched on and off at appropriate timing, DC power supplied from a vehicle-mounted battery is converted into a three-phase AC power suitable for driving the motor. Patent document 1 discloses a semiconductor device (a drive circuit) for use in a motor drive device. In one example, the control element and the drive element described above are included in a single package. In some cases, the source voltages required for the control element and the drive element are different. In this regard, it is desirable to have increased voltage insulation between the conduction path to the control element and the conduction path to the drive element. PRIOR ART DOCUMENT Patent Document Patent Document 1: JP-A-2014-155412 SUMMARY OF INVENTION Problem to be Solved by the Invention In view of the circumstances described above, the present disclosure may aim to provide a semiconductor device suitable for increasing voltage insulation. Means to Solve the Problem In accordance with the present disclosure, there is provided a semiconductor device including a conductive support member, a first semiconductor element, a second semiconductor element and a sealing resin. The conductive support member includes a first die pad and a second die pad spaced apart from the first die pad in a first sense of a first direction perpendicular to a thickness direction and held at a potential different from that of the first die pad. The first semiconductor element is mounted on the first die pad. The second semiconductor element is mounted on the second die pad to form an output-side circuit together with the second die pad. The sealing resin covers at least a portion of the conductive support member, the first semiconductor element and the second semiconductor element. The first semiconductor element includes: a circuit part forming an input-side circuit together with the first die pad; and an insulating part that transmits a signal between the input-side circuit and the output-side circuit, while providing electrical insulation between the input-side circuit and the output-side circuit. The conductive support member includes: a plurality of input-side terminals spaced apart from each other in the first direction, where at least one of the plurality of input-side terminals is electrically connected to the input-side circuit; and a plurality of output-side terminals spaced apart from each other in the first direction, where at least one of the plurality of output-side terminals is electrically connected to the output-side circuit. The sealing resin includes: a first side face offset in a first sense of a second direction perpendicular to the thickness direction and the first direction, where the plurality of input-side terminals protrude from the first side face; a second side face offset in a second sense of the second direction, where the plurality of output-side terminals protrude from the second side face; a third side face offset in the first sense of the first direction and connected to the first side face and the second side face; and a fourth side face offset in a second sense of the first direction and connected to the first side face and the second side face. The conductive support member is not exposed on the third side face. Advantages of Invention According to the configuration described above, the first semiconductor element includes the insulating part that transmits a signal between the input-side circuit and the output-side circuit and that provides electrical insulation between the input-side circuit and the output-side circuit. This serves to increase the voltage insulation between the input-side circuit and the output-side circuit. According to the configuration described above, in addition, the conductive support member is not exposed on the third side face of the