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US-12623255-B2 - Substrate cleaning device and substrate cleaning method

US12623255B2US 12623255 B2US12623255 B2US 12623255B2US-12623255-B2

Abstract

A substrate cleaning apparatus may include a first roll member and a second roll member including a copolymer of a first water-soluble polymer and a second water-soluble polymer. The first roll member may include a first roll body extending in a first direction and first protrusions on a surface of the first roll body. The second roll member may include a second roll body extending in the first direction and second protrusions on a surface of the second roll body.

Inventors

  • Donghoon KWON
  • Juhyun Lee
  • Chungki MIN

Assignees

  • SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date
20260512
Application Date
20230426
Priority Date
20220817

Claims (13)

  1. 1 . A substrate cleaning apparatus, comprising: a first roll member including a first roll body extending in a first direction and first protrusions on a surface of the first roll body; and a second roll member including a second roll body extending in the first direction and second protrusions on a surface of the second roll body, wherein the first roll member and the second roll member each include a copolymer of a first water-soluble polymer and a second water-soluble polymer, wherein the second water-soluble polymer comprises a cationic polymer, and the cationic polymer comprises at least one of polyvinylamine, polyethyleneimine, polyvinylimidazole, and polyallylamine.
  2. 2 . The substrate cleaning apparatus of claim 1 , wherein the first water-soluble polymer comprises a non-ionic polymer.
  3. 3 . The substrate cleaning apparatus of claim 2 , wherein the non-ionic polymer comprises at least one of polyvinyl alcohol, polyvinylpyrrolidone, polyethylene glycol, polypropylene glycol, polybutylene glycol, and polyethylene oxide.
  4. 4 . The substrate cleaning apparatus of claim 1 , wherein the copolymer comprises at least one of a random copolymer, an alternating copolymer, a block copolymer, and a graft copolymer.
  5. 5 . The substrate cleaning apparatus of claim 1 , further comprising: a cleaning solution supply nozzle, wherein the cleaning solution supply nozzle is configured to supply a cleaning solution to a lower surface of a substrate or an upper surface of the substrate when the substrate is positioned between the first roll member and the second roll member.
  6. 6 . The substrate cleaning apparatus of claim 5 , wherein the cleaning solution comprises at least one of pure water (DI water), ultrapure water, hydrofluoric acid (HF), sulfuric acid (H 3 SO 4 ), nitric acid (HNO 3 ), phosphoric acid (H 3 PO 4 ), a standard clean-1 (SC-1) solution, an EKC solution, a LAL solution, and a diluted sulfate peroxide (DSP) solution.
  7. 7 . The substrate cleaning apparatus of claim 1 , wherein the copolymer has a zeta potential of a same polarity as a slurry residue used in a polishing process at a pH of 5 or less.
  8. 8 . The substrate cleaning apparatus of claim 7 , wherein the slurry residue comprises ceria.
  9. 9 . A substrate cleaning apparatus, comprising: a first roll member including a first roll body extending in a first direction and first protrusions on a surface of the first roll body; a second roll member including a second roll body extending in the first direction and second protrusions on a surface of the second roll body; and a cleaning solution supply nozzle, wherein the cleaning solution supply nozzle is configured to supply a cleaning solution to a lower surface of a substrate or an upper surface of the substrate when the substrate is positioned between the first roll member and the second roll member, and the first roll member and the second roll member each include a copolymer of polyvinyl alcohol and polyvinylamine.
  10. 10 . The substrate cleaning apparatus of claim 9 , wherein the cleaning solution has a pH in a range of 3 to 4.
  11. 11 . The substrate cleaning apparatus of claim 9 , wherein the copolymer has a zeta potential of 0 or more in a pH range of the cleaning solution.
  12. 12 . The substrate cleaning apparatus of claim 9 , wherein a slurry residue used in a polishing process of the substrate has a zeta potential of 0 or more in a pH range of the cleaning solution.
  13. 13 . The substrate cleaning apparatus of claim 12 , wherein the slurry residue comprises ceria.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority and benefit of Korean Patent Application No. 10-2022-0102781, filed on Aug. 17, 2022 with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. BACKGROUND 1. Field Inventive concepts relate to a substrate cleaning apparatus and a substrate cleaning method. 2. Description of Related Art In order to form microstructures (e.g., a metal film, a barrier film, an insulating film, or the like) on a substrate (e.g., a semiconductor wafer), a planarization process of polishing and cleaning a surface of the substrate using a substrate processing apparatus may be used. Abrasive residues (e.g., slurry residues, abrasive debris, or the like) may be present in a roll member for scrub cleaning a surface of the polished substrate, which may cause deterioration of a cleaning effect. SUMMARY An aspect of inventive concepts is to provide a substrate cleaning apparatus having improved cleaning ability and a substrate cleaning method using the same. According to an embodiment of inventive concepts, a substrate cleaning apparatus may include a first roll member and a second roll member including a copolymer of a first water-soluble polymer and a second water-soluble polymer. The first roll member may include a first roll body extending in a first direction and first protrusions on a surface of the first roll body. The second roll member may include a second roll body extending in the first direction and second protrusions on a surface of the second roll body. According to an embodiment of inventive concepts, a substrate cleaning apparatus may include a first roll member including a first roll body extending in a first direction and first protrusions on a surface of the first roll body; a second roll member including a second roll body extending in the first direction and second protrusions on a surface of the second roll body; and a cleaning solution supply nozzle. The cleaning solution supply nozzle may be configured to supply a cleaning solution to a lower surface of a substrate or an upper surface of the substrate when the substrate is positioned between the first roll member and the second roll member. The first roll member and the second roll member each may include a copolymer of polyvinyl alcohol and polyvinylamine. According to an embodiment of inventive concepts, a substrate cleaning method may include preparing a substrate having an upper surface opposite a lower surface; contacting a first roll member and a second roll member to the lower surface and the upper surface of the substrate, respectively, the first roll member and the second roll member each including a copolymer of a first water-soluble polymer and a second water-soluble polymer; and scrub cleaning the lower surface of the substrate and the upper surface of the substrate by rotating the first roll member and the second roll member. The scrub cleaning may include supplying a cleaning solution to the upper surface of the substrate and the lower surface of the substrate. BRIEF DESCRIPTION OF DRAWINGS The above and other aspects, features, and advantages of inventive concepts will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. 1 is a view illustrating an example of a substrate processing apparatus to which a substrate cleaning apparatus according to inventive concepts is introduced; FIG. 2A is a perspective view schematically illustrating a substrate cleaning apparatus according to an example embodiment of inventive concepts, and FIG. 2B is a front view illustrating the first and second roll members of FIG. 2A; FIG. 3 is a side view schematically illustrating a substrate cleaning apparatus according to an example embodiment of inventive concepts; and FIG. 4 is a graph illustrating a difference in zeta potential of a slurry residue, a polymer of Comparative Example, and a copolymer of Example. DETAILED DESCRIPTION Hereinafter, example embodiments of inventive concepts will be described with reference to the accompanying drawings as follows. FIG. 1 is a diagram illustrating an example of a substrate processing apparatus 1000 to which a substrate cleaning apparatus according to inventive concepts is introduced. Referring to FIG. 1, the substrate processing apparatus 1000 may include a housing 1001 and a load port 1002 in which a substrate cassette for stocking a substrate such as a plurality of semiconductor wafers, or the like is loaded. The load port 1002 is disposed adjacent the housing 1001. The load port 1002 may be provided with an open cassette, a Standard Manufacturing Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP). The SMIF pod and the FOUP may accommodate the substrate cassette therein, and cover an inside with a partition wall, thereby sealing the inside from an external environment. A plurality of polishing modules 1010 (fou