US-12623359-B2 - End effector and substrate processing apparatus including end effector

US12623359B2US 12623359 B2US12623359 B2US 12623359B2US-12623359-B2

Abstract

An End effector is disclosed. The exemplary end effector includes a substrate-supporting body for placing the substrate thereon; and a first array of wave generators disposed in the substrate-supporting body and configured to generate a surface wave to a backside of the substrate.

Inventors

Taira Okabe

Assignees

ASM IP HOLDING B.V.

Dates

Publication Date: 20260512
Application Date: 20231218

Claims (10)

1 . An end effector for transferring a substrate, comprising: a substrate-supporting body for placing the substrate thereon; and a first array of wave generators disposed in the substrate-supporting body and configured to generate a surface wave to a backside of the substrate, the first array of wave generators comprising a plurality of piezoelectric elements for generating surface waves; and a slider disposed on the piezoelectric elements and configured to move the substrate.
2 . The end effector according to claim 1 , wherein the substrate-supporting body comprises a mounting end and a distal end, wherein the mounting end is attached to a robotic arm, and wherein a first finger and a second finger are disposed at the distal end.
3 . The end effector according to claim 2 , wherein the robotic arm is configured to move vertically, front and rear, and laterally.
4 . The end effector according to claim 3 , further comprising a third array of wave generators disposed on the mounting end.
5 . The end effector according to claim 2 , wherein the first array of wave generators is disposed on the first finger.
6 . The end effector according to claim 2 , further comprising a second array of wave generators disposed on the second finger.
7 . The end effector according to claim 1 , further comprising an AC power source, being configured to apply AC power to each piezoelectric element.
8 . The end effector according to claim 1 , wherein a number of the piezoelectric elements is 9 to 100.
9 . The end effector according to claim 1 , wherein the substrate-supporting body comprises Al203.
10 . A substrate processing apparatus comprising: a reaction chamber for processing a substrate; a substrate handling chamber attached to the reaction chamber; a backend robot disposed in the substrate handling chamber; and a load lock chamber for loading or unloading the substrate, the load lock chamber being attached to the substrate handling chamber, wherein the backend robot includes an end effector for transferring the substrate, the end effector comprising a substrate-supporting body for placing the substrate thereon; and a first array of wave generators disposed in the substrate-supporting body and configured to generate a surface wave to a backside of the substrate, the first array of wave generators comprising a plurality of piezoelectric elements for generating surface waves; and a slider disposed on the piezoelectric elements and configured to move the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application claims the benefit of U.S. Provisional Application 63/476,329 filed on Dec. 20, 2022, the entire contents of which are incorporated herein by reference. FIELD OF INVENTION The present disclosure relates generally to an end effector. More particularly, exemplary embodiments of the present disclosure relate to an end effector for transporting a substrate and a substrate processing apparatus including an end effector. BACKGROUND OF THE DISCLOSURE A process of substrate processing apparatus may include a step of transporting a substrate from a Front Opening Unified Pod (FOUP) to a reaction chamber via a substrate handling chamber and a load lock chamber using a robotic arm or a step of transporting a substrate from a reaction chambers to another reaction chamber using a robotic arm. The robotic arm may be provided with an end effector for loading a substrate thereon and carrying the substrate from one chamber to another. Typically, the end effector does not have a mechanical clamping mechanism for clamping a substrate, and by a substrate positioning or alignment mechanism (e.g., those disclosed in U.S. Patent Application Publication No. 2012/0325148, U.S. Pat. Nos. 7,963,736, and 8,041,450, each disclosure of which is herein incorporated by reference in its entirety), a substrate is placed on the end effector for transfer. The substrate stays on the end effector while being carried by friction against a surface of the end effector, which is caused by gravity. An anti-slip end effector having several pads are used to hold the substrate. A need exists for properly positioning substrates. Any discussion, including discussion of problems and solutions, set forth in this section, has been included in this disclosure solely for the purpose of providing a context for the present disclosure, and should not be taken as an admission that any or all of the discussion was known at the time the invention was made or otherwise constitutes prior art. This summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in further detail in the detailed description of example embodiments of the disclosure below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. In accordance with exemplary embodiments of the disclosure, an end effector is provided. The end effector for transferring a substrate may comprise a substrate-supporting body for placing the substrate thereon; and a first array of wave generators disposed in the substrate-supporting body and configured to generate a surface wave to a backside of the substrate. In various embodiments, the substrate-supporting body may comprise a mounting end and a distal end; wherein the mounting end may be attached to a robotic arm; wherein a first finger and a second finger are disposed at the distal end. In various embodiments, the robotic arm may be configured to move vertically, front and rear, and laterally. In various embodiments, the first array of wave generators may be disposed on the first finger. In various embodiments, the end effector may further comprise a second array of wave generators on the second finger. In various embodiments, the end effector may further comprise a third array of wave generators on the mounting end. In various embodiments, the array of wave generators may comprise: a plurality of piezoelectric elements for generating surface waves; and a slider disposed on the piezoelectric devices and configured to move the substrate. In various embodiments, the end effector may further comprise an AC power source, being configured to apply an AC power to the piezoelectric element. In various embodiments, the number of the piezoelectric elements may be 9 to 100. In various embodiments, the substrate-supporting body may comprise Al203. In various embodiments, a substrate processing apparatus may comprise: a reaction chamber for processing a substrate; a substrate handling chamber attached to the reaction chamber; a backend robot disposed in the substrate handling chamber; and a load lock chamber for loading or unloading the substrate, the load lock chamber being attached to the substrate handling chamber; wherein the backend robot may include the end effector. In various embodiments, a method for positioning a substrate may comprise: placing the substrate on an array of wave generators array of an end effector; applying waves to the substrate by the array of wave generators, thereby correcting the position of substrate. BRIEF DESCRIPTION OF THE DRAWING FIGURES A more complete understanding of exemplary embodiments of the present disclosure can be derived by referring to the detailed description and claims when considered in connection with the following illustrative figures. FIG. 1 is a schematic plan view of a semiconductor proce