US-12623445-B2 - Affixing device

Abstract

Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

Inventors

• Masao NOGAMI
• Akimitsu Morimoto

Assignees

• MITSUI CHEMICALS ICT MATERIA, INC.

Dates

Publication Date

20260512

Application Date

20240726

Priority Date

20190327

Claims (6)

1. 1 . An affixing apparatus for affixing a film to a plate-shaped body, the affixing apparatus comprising: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member, wherein the pressing member has a function of pressing the film against a main surface of the plate-shaped body, and wherein the support member is configured to block a bulging of a thick portion from an edge part of the film with its inner peripheral surface.
2. 2 . The affixing apparatus according to claim 1 , further comprising an arrangement device that arranges the film on a main surface of the plate-shaped body.
3. 3 . The affixing apparatus according to claim 1 , further comprising a heating device that heats the film.
4. 4 . The affixing apparatus according to claim 1 , wherein the plate-shaped body comprises a notch-shaped step portion at a peripheral edge part of a main surface to which the film is affixed, and wherein the support member is installed at an outer edge of the mounting portion such that the support member corresponds to the step portion.
5. 5 . The affixing apparatus according to claim 1 , wherein the plate-shaped body is a semiconductor wafer, and wherein the film is a protective film for a semiconductor wafer.
6. 6 . The affixing apparatus according to claim 5 , wherein the semiconductor wafer has, on the main surface, a first region in which bumps are arranged, and a second region which includes at least a part of a peripheral edge of a main surface and in which no bumps are arranged, and wherein a notch-shaped step portion is formed by the second region.

Description

CROSS REFERENCE OF RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser. No. 17/439,188, filed on Sep. 14, 2021, now U.S. Pat. No. 12,103,288, entitled “AFFIXING DEVICE,” which in turn is a national stage application of PCT/JP2020/013847, filed on Mar. 26, 2020, which in turn claims priority to Japanese Patent Application No. 2019-061828, filed on Mar. 27, 2019. The entire content of each of the prior applications is hereby incorporated by reference. TECHNICAL FIELD The present invention relates to an affixing apparatus for affixing a film to a plate-shaped body such as a semiconductor wafer. BACKGROUND ART Examples of plate-shaped bodies to which a film is affixed include semiconductor wafers for semiconductor components. After a circuit or the like is formed on a main surface of a semiconductor wafer, the back surface opposite to the main surface is ground to a desired thickness. In order to protect the circuit or the like on the main surface at the time of grinding the back surface, a film such as a protective film is affixed to the main surface of the semiconductor wafer. A general affixing apparatus includes a mounting member on which a semiconductor wafer is mounted, and a pressing member such as a pasting roller installed at a position facing the mounting member. This affixing apparatus is configured to affix a film to a main surface by pressing the film against the main surface with a pressing member such as an affixing roller. Here, some semiconductor wafers have, for example, a plurality of bumps on its main surface, so that the main surface is uneven due to the tops of the bumps. When a film is affixed to such a main surface using the above-described affixing apparatus, the surface of the film pressed against the main surface becomes uneven following the unevenness due to the tops of the bumps. When the surface of the film becomes uneven, defects such as vacuum leakage may occur when the semiconductor wafer is fixed to the mounting member of the affixing apparatus via the film. Patent Literature 1 is known as a technique for eliminating such defects. Specifically, Patent Literature 1 discloses a film provided with an unevenness absorbent resin layer and the like as a film used for a semiconductor wafer. The film is devised such that unevenness is less likely to occur on the surface of the film affixed to the main surface by an unevenness absorbent resin layer, a step absorption layer, or the like. CITATIONS LIST Patent Literature Patent Literature 1: JP 2000-17239 A SUMMARY OF THE INVENTION Technical Problems The above-described technique is intended to suppress the formation of unevenness on a surface of a film by devising the configuration of the film. However, even when the above-described technique is used, there is a case where a defect such as vacuum leakage occurs due to the shape or the like of the affixing surface (main surface) of a plate-shaped body. This defect is particularly likely to occur when the plate-shaped body has a step portion at a peripheral edge part of the affixing surface (main surface). The present invention has been made in view of the above problems, and an object of the present invention is to provide an affixing apparatus capable of suppressing the formation of unevenness on a surface of a film affixed to a main surface of a plate-shaped body without being affected by the shape of the main surface and flattening the surface of the film. Solutions to Problems As a means for solving the above problems, the present invention is as follows. [1] An affixing apparatus for affixing a film to a plate-shaped body, comprising: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted;a plate-shaped pressing member installed at a position facing the mounting member; anda support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member. [2] The affixing apparatus according to [1], wherein the pressing member has a function of pressing the film against a main surface of the plate-shaped body, andwherein the support member has a function of supporting an edge part of the film when the film is pressed by the pressing member. [3] The affixing apparatus according to [1] or [2], further comprising an arrangement device that arranges the film on the main surface of the plate-shaped body. [4] The affixing apparatus according to any one of claims [1] to [3], further comprising a heating device that heats the film. [5] The affixing apparatus according to any one of [1 ] to [4], wherein the affixing apparatus has a function of sandwiching the edge part of the film between the support member and the pressing member and compressing the edge part in a thickness direction of the film. [6] The affixing apparatus according to any one of [1 ] to [5], wherein the plate-shaped body comprises a notch-shaped step portion at a peripheral edge p