US-12624141-B2 - Composition set containing compound having polyoxyalkylene chain

Abstract

A composition set containing: a first liquid containing an oxidizing agent; and a second liquid containing a reducing agent, wherein at least one of the first liquid and the second liquid contains a compound represented by the following formula (1): wherein R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain, and wherein the polyoxyalkylene chain has 100 or more of oxyalkylene groups.

Inventors

• Nozomi MATSUBARA
• Naoki Furukawa
• Yuki Nakamura
• Hiroshi Yokota
• Tsuyoshi Morimoto

Assignees

• RESONAC CORPORATION

Dates

Publication Date

20260512

Application Date

20201126

Priority Date

20191129

Claims (7)

1. 1 . A composition set comprising: a first liquid containing an oxidizing agent; and a second liquid comprising a reducing agent, wherein at least one of the first liquid and the second liquid comprises a compound represented by the following formula (1) wherein R 11 and R 12 each represent a hydrogen atom, and R 13 represents a divalent group having a polyoxyalkylene chain, wherein the polyoxyalkylene chain has from 300 to 361 of oxyalkylene groups and is a random copolymer chain consisting of an oxyethylene group and an oxypropylene group; and wherein at least one of the first liquid and the second liquid comprises at least one additional polymerizable compound selected from the group consisting of 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, and isodecyl acrylate, and the content of the additional polymerizable compound is from 50 parts by mass to 70 parts by mass based on 100 parts by mass of the sum of the compound represented by the formula (1) and the additional polymerizable compound.
2. 2 . The composition set according to claim 1 , wherein the compound represented by the formula (1) has a weight average molecular weight of 5000 or more.
3. 3 . The composition set according to claim 1 , wherein the compound represented by the formula (1) has a viscosity at 25° C. of 200 Pa·s or less.
4. 4 . The composition set according to claim 1 , wherein both the first liquid and the second liquid comprise the compound represented by the formula (I).
5. 5 . The composition set according to claim 4 , wherein both the first liquid and the second liquid comprise the at least one additional polymerizable compound selected from the group consisting of 2-ethylhexyl acrylate and isodecyl acrylate.
6. 6 . The composition set according to claim 4 , wherein both the first liquid and the second liquid comprise 4-hydroxybutyl acrylate.
7. 7 . The composition set according to claim 1 , wherein the polyoxyalkylene chain has from 320 to 361 of oxyalkylene groups.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a 35 U.S.C. § 371 national phase application of PCT/JP2020/043980, filed on Nov. 26, 2020, which claims priority to Japanese Patent Application No. 2019-216615, filed on Nov. 29, 2019, and to Japanese Patent Application No. 2020-019064, filed on Feb. 6, 2020. TECHNICAL FIELD The present invention relates to a composition set containing a compound having a polyoxyalkylene chain. BACKGROUND ART In an electronic component or the like that generates heat during use, a thermally conductive material (sometimes referred to as a thermal dissipation material) called a thermal interface material (TIM) is used to efficiently dissipate heat. The TIM contains, for example, a polymer and a thermally conductive filler. As the polymer as described above, a suitable polymer is selected according to the use (application target) of the TIM or the like. Specifically, for example, a composition containing a polymer may be required to have low viscosity and excellent handling properties, and a cured product of the composition set may be required to have low elasticity. On the other hand, for example, Patent Literature 1 discloses a curable silicone composition which has good handling workability and forms a cured product having a low elastic modulus. CITATION LIST Patent Literature Patent Literature 1: Japanese Unexamined Patent Publication No. 2008-081676 SUMMARY OF INVENTION Technical Problem According to studies conducted by the present inventors, in a multi-liquid type (for example, two liquid type) composition set, a cured product of the composition set having improved handling properties using a low-viscosity polymer may be required to have a high elongation at break. However, it is not necessarily easy to realize these at the same time. Therefore, an object of the present invention is to improve the elongation at break of a cured product of a composition set while improving the handleability of the composition set. Solution to Problem The inventors of the present invention conducted a thorough study, and as a result, the inventors found that a cured product of a composition set containing a specific compound having a polyoxyalkylene chain and having two (meth)acryloyl groups can form a cured product having a high elongation at break while having a low viscosity and excellent handleability. According to some aspects, the present invention provides the following [1] to [7]. [1] A composition set containing: a first liquid containing an oxidizing agent; and a second liquid containing a reducing agent, wherein at least one of the first liquid and the second liquid contains a compound represented by the following formula (1): wherein R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain, and wherein the polyoxyalkylene chain has 100 or more of oxyalkylene groups. [2] The composition set according to [1], wherein the polyoxyalkylene chain contains an oxyethylene group. [3] The composition set according to [1], wherein the polyoxyalkylene chain contains an oxypropylene group. [4] The composition set according to [1], wherein the polyoxyalkylene chain is a copolymer chain containing an oxyethylene group and an oxypropylene group. [5] The composition set according to [4], wherein the copolymer chain is a random copolymer chain. [6] The composition set according to any one of [1] to [5], wherein the compound represented by the formula (1) has a weight average molecular weight of 5000 or more. [7] The composition set according to any one of [1] to [6], wherein the compound represented by the formula (1) has a viscosity at 25° C. of 200 Pa·s or less. Advantageous Effects of Invention According to the present invention, it is possible to improve the elongation at break of a cured product of a composition set while improving the handleability of the composition set. DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail. Incidentally, the present invention is not intended to be limited to the following embodiments. The term “(meth)acryloyl” according to the present specification means “acryloyl” and “methacryloyl” corresponding thereto, and the same also applies to similar expressions such as “(meth)acrylate” and “(meth)acryl”. The weight average molecular weight (Mw) according to the present specification means a value measured using gel permeation chromatography (GPC) under the following conditions and determined by using polystyrene as a standard substance. Measuring equipment: HLC-8320GPC (product name, manufactured by Tosoh Corp.)Analysis column: TSKgel SuperMultipore HZ-H (three columns connected) (product name, manufactured by Tosoh Corp.)Guide column: TSKguardcolumn SuperMP (HZ)-H (product name, manufactured by Tosoh Corp.)Eluent: THFMeasurement temperature: 25° C. A composition set according to an embodiment contains: a first liqui