US-12624176-B2 - Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Abstract

An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R 4 represents a hydrogen atom or an alkyl group.

Inventors

• Hirosuke Saito
• Yiqun Wang
• Hiroharu Inoue

Assignees

• PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Dates

Publication Date

20260512

Application Date

20200716

Priority Date

20190717

Claims (17)

1. 1 . A resin composition comprising: a first styrene-based block copolymer having a durometer hardness measured using a type A durometer of 20 to 42; a second styrene-based block copolymer having a durometer hardness measured using a type A durometer of 78 or more; a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule: wherein in Formula (1), p represents 0 to 10, Z represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group, wherein in Formula (2), R 4 represents a hydrogen atom or an alkyl group; and a curing agent containing an allyl compound.
2. 2 . The resin composition according to claim 1 , wherein a content of a structural unit derived from at least one of styrene and a styrene derivative is 1% to 20% by mass in the first styrene-based block copolymer.
3. 3 . The resin composition according to claim 1 , wherein the first styrene-based block copolymer has a weight average molecular weight of 10,000 to 200,000.
4. 4 . The resin composition according to claim 1 , wherein the first styrene-based block copolymer includes at least one selected from the group consisting of a methylstyrene (ethylene/butylene) methylstyrene copolymer, a methylstyrene (ethylene-ethylene/propylene) methylstyrene copolymer, a styrene isoprene copolymer, a styrene isoprene styrene copolymer, a styrene (ethylene/butylene) styrene copolymer, a styrene (ethylene-ethylene/propylene) styrene copolymer, a styrene butadiene styrene copolymer, a styrene (butadiene/butylene) styrene copolymer, a styrene isobutylene styrene copolymer, and any hydrogenated product of these copolymers.
5. 5 . The resin composition according to claim 1 , wherein the allyl compound includes an allyl isocyanurate compound having two or more allyl groups in a molecule.
6. 6 . The resin composition according to claim 1 , wherein a content of the first styrene-based block copolymer is 20 to 60 parts by mass with respect to 100 parts by mass of a sum of the first styrene-based block copolymer, the polyphenylene ether compound, and the curing agent.
7. 7 . The resin composition according to claim 1 , wherein a total content of the first styrene-based block copolymer and the second styrene-based block copolymer is 20 to 60 parts by mass with respect to 100 parts by mass of a sum of the first styrene-based block copolymer, the polyphenylene ether compound, the curing agent, and the second styrene-based block copolymer.
8. 8 . The resin composition according to claim 1 , wherein a content of the second styrene-based block copolymer is 1 to 50 parts by mass with respect to 100 parts by mass of a sum of the first styrene-based block copolymer and the second styrene-based block copolymer.
9. 9 . The resin composition according to claim 1 , wherein the second styrene-based block copolymer includes at least one selected from the group consisting of a methylstyrene (ethylene/butylene) methylstyrene copolymer, a methylstyrene (ethylene-ethylene/propylene) methylstyrene copolymer, a styrene isoprene copolymer, a styrene isoprene styrene copolymer, a styrene (ethylene/butylene) styrene copolymer, a styrene (ethylene-ethylene/propylene) styrene copolymer, a styrene butadiene styrene copolymer, a styrene (butadiene/butylene) styrene copolymer, a styrene isobutylene styrene copolymer, and any hydrogenated product of these copolymers.
10. 10 . The resin composition according to claim 1 , wherein the polyphenylene ether compound includes a polyphenylene ether compound having the group represented by Formula (2) in a molecule.
11. 11 . A prepreg comprising: the resin composition according to claim 1 or a semi-cured product of the resin composition; and a fibrous base material.
12. 12 . A film with resin comprising: a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and a support film.
13. 13 . A metal foil with resin comprising: a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and a metal foil.
14. 14 . A metal-clad laminate comprising: an insulating layer containing a cured product of the resin composition according to claim 1 ; and a metal foil.
15. 15 . A wiring board comprising: an insulating layer containing a cured product of the resin composition according to claim 1 ; and wiring.
16. 16 . A metal-clad laminate comprising: an insulating layer containing a cured product of the prepreg according to claim 11 ; and a metal foil.
17. 17 . A wiring board comprising: an insulating layer containing a cured product of the prepreg according to claim 11 ; and wiring.

Description

TECHNICAL FIELD The present invention relates to a resin composition, a prepreg, a film with resin, a metal foil with resin, a metal-clad laminate, and a wiring board. BACKGROUND ART As the information processing quantity by various kinds of electronic equipment increases, mounting technologies such as high integration of semiconductor devices to be mounted, densification of wiring, and multi-layering are progressing. In addition, wiring boards to be used in various kinds of electronic equipment are required to be, for example, high-frequency compatible wiring boards such as a millimeter-wave radar board for in-vehicle use. Substrate materials for forming insulating layers of wiring boards to be used in various kinds of electronic equipment are required to have a low dielectric constant and a low dielectric loss tangent in order to increase the signal transmission speed and to decrease the signal transmission loss. It is known that polyphenylene ether exhibits excellent low dielectric properties such as a low dielectric constant and a low dielectric loss tangent and exhibits excellent low dielectric properties such as a low dielectric constant and a low dielectric loss tangent even in a high frequency band (high frequency region) from the MHz band to the GHz band. For this reason, it has been investigated that polyphenylene ether is used, for example, as a high frequency molding material. More specifically, polyphenylene ether is preferably used as a substrate material for forming an insulating layer of a wiring board to be equipped in electronic equipment utilizing a high frequency band. As substrate materials for forming insulating layers of wiring boards, resin compositions containing elastomers such as hydrogenated styrene butadiene styrene copolymer are used in order to improve the impact resistance of the insulating layers. Examples of such resin compositions containing elastomers include the resin composition described in Patent Literature 1. Patent Literature 1 describes a curable resin composition containing a predetermined vinyl compound having a polyphenylene ether skeleton and a high molecular weight substance having a weight average molecular weight of 10,000 or more such as a styrene-based thermoplastic elastomer as essential components. The metal-clad laminate and the metal foil with resin used when a wiring board or the like is manufactured include not only an insulating layer but also a metal foil on the insulating layer. The wiring board also includes not only an insulating layer but also wiring on the insulating layer. Examples of the wiring include wiring derived from a metal foil included in the metal-clad laminate or the like. In recent years, particularly small portable devices such as mobile communication terminals and notebook PCs have rapidly become multifunctional, high-performance, thin and compact. To accompany this, the wiring boards used in these products are also required to have finer conductor wiring, multiple and thinner conductor wiring layers, and higher performance of mechanical properties. In particular, as wiring boards become thinner, there is a problem that warpage of semiconductor packages in which semiconductor chips are mounted on wiring boards is likely to occur and poor mounting is likely to occur. In order to suppress the warpage of semiconductor packages in which semiconductor chips are mounted on wiring boards, the insulating layers are required to have a low coefficient of thermal expansion. Hence, substrate materials for forming insulating layers of wiring boards are required to provide a cured product having a low coefficient of thermal expansion. CITATION LIST Patent Literature Patent Literature 1: JP 2006-83364 A SUMMARY OF INVENTION The present invention has been made in view of such circumstances, and an object thereof is to provide a resin composition, which provides a cured product exhibiting low dielectric properties and a low coefficient of thermal expansion. Another object of the present invention is to provide a prepreg, a film with resin, a metal foil with resin, a metal-clad laminate, and a wiring board which are obtained using the resin composition. An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic sectional view illustrating an example of a prepreg according to an embodiment of the present invention. FIG. 2 is a schematic sectional view illustrating an example of a metal-clad laminate according to an embodimen