US-12624206-B2 - Resin composition and article made therefrom

Abstract

A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein the polyolefin includes a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer, the first phosphorus-containing compound includes a compound of Formula (I), and the second phosphorus-containing compound includes a compound of Formula (II), a compound of Formula (III) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor before and after 24 hours of water absorption, Z-axis coefficient of thermal expansion and dissipation factor after 24 hours of water absorption.

Inventors

• Ching-Hsien Hsu
• Jun-Yan Yu
• Yu-Chiao Shih

Assignees

• Elite Material Co., Ltd.

Dates

Publication Date

20260512

Application Date

20220831

Claims (9)

1. 1 . A resin composition, comprising 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein: the polyolefin comprises a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer; the first phosphorus-containing compound comprises a compound of Formula (I): wherein any one, two or three of R 1 to R 6 are a p-vinylphenoxy group, and the remaining are a phenoxy group; and the second phosphorus-containing compound comprises a compound of Formula (II), a compound of Formula (III), or a combination thereof:
2. 2 . The resin composition of claim 1 , wherein the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing biphenyl polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin or a combination thereof.
3. 3 . The resin composition of claim 1 , wherein the first phosphorus-containing compound comprises a compound of Formula (IV), a compound of Formula (V), a compound of Formula (VI) or a combination thereof:
4. 4 . The resin composition of claim 1 , further comprising maleimide resin, acenaphthylene or a combination thereof.
5. 5 . The resin composition of claim 1 , further comprising inorganic filler, flame retardant, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, coloring agent, toughening agent or a combination thereof.
6. 6 . An article made from the resin composition of claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board.
7. 7 . The article of claim 6 , having a difference rate of dissipation factor of less than or equal to 83% calculated according to a dissipation factor as measured by reference to JIS C2565 at 10 GHz before and after 24 hours of water absorption performed at a constant temperature by reference to JIS C6481.
8. 8 . The article of claim 6 , having a Z-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 32 ppm/° C.
9. 9 . The article of claim 6 , having a dissipation factor of less than or equal to 0.0049 as measured by reference to JIS C2565 at 10 GHz after 24 hours of water absorption performed at a constant temperature by reference to JIS C6481.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefits of U.S. provisional application Ser. No. 63/345,247, filed on May 24, 2022. The entirety the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification. BACKGROUND 1. Field of the Disclosure The present disclosure relates to a resin composition and more particularly to a resin composition useful for preparing a prepreg, a resin film, a laminate or a printed circuit board. 2. Description of Related Art In recent years, due to the development of electronic signal transmission toward the fifth generation mobile communication technology (5G) and the trend of high performance and miniaturization of electronic equipment, communication devices and personal computers, circuit boards were also developed toward multi-layer configuration, high density trace interconnection, and high speed signal transmission, thereby presenting higher challenges to the overall performance of circuit laminates such as copper-clad laminates. In addition, in order to comply with the trend of environmental protection, halogen-containing flame retardants that are likely to cause environmental pollution have been gradually replaced, and halogen-free flame retardants are thereby used, such as nitrogen-containing or phosphorus-containing compounds. However, the use of halogen-free flame retardants may deteriorate the dielectric properties or other physical properties of the electronic materials. Therefore, there is a need for solving one or more of the above-mentioned problems. SUMMARY To overcome the problems facing prior arts, particularly one or more of the above-mentioned technical problems of conventional materials, it is a primary object of the present disclosure to provide a resin composition and an article made therefrom which may overcome at least one of the above-mentioned technical problems. To achieve the above-mentioned object, the present disclosure provides a resin composition, comprising 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein: the polyolefin comprises a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer;the first phosphorus-containing compound comprises a compound of Formula (I): wherein any one, two or three of R1 to R6 are a p-vinylphenoxy group, and the remaining are a phenoxy group;the second phosphorus-containing compound comprises a compound of Formula (II), a compound of Formula (III), or a combination thereof: For example, in one embodiment, the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing biphenyl polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin or a combination thereof. For example, in one embodiment, the first phosphorus-containing compound comprises a compound of Formula (IV), a compound of Formula (V), a compound of Formula (VI) or a combination thereof: For example, in one embodiment, the resin composition may further optionally comprise a maleimide resin, an acenaphthylene or a combination thereof. For example, in one embodiment, the resin composition further optionally comprises inorganic filler, flame retardant, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, coloring agent, toughening agent, or a combination thereof. To achieve the above-mentioned objects, the present disclosure further provides an article made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board. For example, in one embodiment, articles made from the resin composition disclosed herein at least have one, more or all of the following properties: a difference rate of dissipation factor of less than or equal to 83% calculated according to a dissipation factor as measured by reference to JIS C2565 at 10 GHz before and after 24 hours of water absorption performed at constant temperature by reference to JIS C6481;a Z-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 32 ppm/° C.; anda dissipation factor of less than or equal to 0.0049 as measured by reference to JIS C2565 at 10 GHz after 24 hours of water absorption performed at constant temperature by reference to JIS C6481. DESCRIPTION OF THE EMBODIMENTS To enable those skilled in the art to further appreciate the features and effects of the present disclosure, words and terms contained in the specification and appended claims are described and defined. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure pertain