US-12624440-B2 - Surface treatment method
Abstract
A surface treatment method is provided, applicable to a housing. The housing includes a surface. The surface treatment method includes: performing anodic treatment on the surface, to form a microporous structure on the surface; depositing a silicon material on the surface, to form a silicon polymer material layer to fill the microporous structure; and depositing a fluorine-containing monomer material on the surface, where the silicon polymer material layer reacts with the fluorine-containing monomer material to generate a silicon-fluorine polymer mixture structure film to perform pore sealing on the microporous structure.
Inventors
- Er-Bao NIU
- Po-Wen Huang
- Yu-Chun Yang
- Guo-Lin Yang
- Tao Chen
Assignees
- ASUSTEK COMPUTER INC.
Dates
- Publication Date
- 20260512
- Application Date
- 20240930
- Priority Date
- 20240605
Claims (10)
- 1 . A surface treatment method, applicable to a housing, wherein the housing comprises a surface, and the surface treatment method comprises: performing anodic treatment on the surface, to form a microporous structure on the surface; depositing a silicon material on the surface, to form a silicon polymer material layer to fill the microporous structure; and depositing a fluorine-containing monomer material on the surface, wherein the silicon polymer material layer reacts with the fluorine-containing monomer material to generate a silicon-fluorine polymer mixture structure film to perform pore sealing on the microporous structure, wherein the step of depositing the silicon material on the surface comprises depositing the silicon material on the surface in a vacuum environment by using a magnetron sputtering process, wherein the silicon polymer material is an organosilicon compound with an alternate silicon and oxygen structure, and wherein the fluorine-containing monomer material comprises a cyano-fluorine monomer material.
- 2 . The surface treatment method according to claim 1 , wherein the housing is made of aluminum alloy.
- 3 . The surface treatment method according to claim 1 , wherein the step of depositing the fluorine-containing monomer material on the surface comprises depositing the fluorine-containing monomer material on the surface in a vacuum environment by using a vapor deposition process.
- 4 . The surface treatment method according to claim 3 , wherein an operating temperature of the vapor deposition process ranges from 60° C. to 85° C.
- 5 . The surface treatment method according to claim 1 , wherein a thickness of the silicon polymer material layer ranges from 5 nm to 10 nm.
- 6 . The surface treatment method according to claim 1 , wherein a thickness of the silicon-fluorine polymer mixture structure film ranges from 6 nm to 10 nm.
- 7 . The surface treatment method according to claim 1 , wherein the step of depositing the silicon material on the surface comprises: coating the silicon material on the surface by using a spray coating process.
- 8 . The surface treatment method according to claim 1 , wherein the step of depositing the fluorine-containing monomer material on the surface comprises coating the fluorine-containing monomer material on the surface by using a spray coating process.
- 9 . The surface treatment method according to claim 1 , wherein before the step of depositing the silicon material on the surface, the surface treatment method further comprises absorbing a pigment into the microporous structure.
- 10 . The surface treatment method according to claim 1 , wherein the silicon-fluorine polymer mixture structure film is made of a silicon-fluorine modified polymer material.
Description
CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefit of Taiwan Application Serial No. 113120829, filed on Jun. 5, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of the specification. BACKGROUND OF THE INVENTION Field of the Invention The disclosure relates to a surface treatment method, and in particular, to pore sealing treatment of the surface treatment method. Description of the Related Art Conventional pore sealing technologies include manners such as low-temperature fluoride pore sealing, medium-temperature nickel salt pore sealing, high-temperature nickel salt pore sealing, and vapor pore sealing. Pore sealing agents used in the pore sealing technologies all generate a chemical reaction with a color layer. As a result, a color value of the color layer is changed, in an embodiment, resulting in a significant decrease in blackness of a black color, affecting appearance presentation of a product. In addition, a main component of the pore sealing agent used in the conventional pore sealing technology is nickel salt, which does not have a lotus effect. As a result, a fingerprint cannot be effectively prevented from generating. BRIEF SUMMARY OF THE INVENTION The disclosure provides a surface treatment method, applicable to a housing, where the housing includes a surface, and the surface treatment method includes: performing anodic treatment on the surface, to form a microporous structure on the surface; depositing a silicon material on the surface, to form a silicon polymer material layer to fill the microporous structure; and depositing a fluorine-containing monomer material on the surface, where the silicon polymer material layer reacts with the fluorine-containing monomer material to generate a silicon-fluorine polymer mixture structure film to perform pore sealing on the microporous structure. According to a surface treatment method provided in the disclosure, a user only needs to input a first gesture signal and at least one track signal in a touch manner, so that operation steps of image generation can be completed, thereby facilitating simplifying an operation procedure and integrating the whole operation procedure into a touch module, to improve operation efficiency of the user. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart of a surface treatment method according to an embodiment of the disclosure; and FIG. 2 is a flowchart of a surface treatment method according to another embodiment of the disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS Specific embodiments of the disclosure are described in detail below with reference to schematic diagrams. Advantages and features of the disclosure are more apparent from the following descriptions and application patent scope. It is to be noted that, the drawings are drawn by using an extremely simplified form and imprecise proportion, which are only used for conveniently and clearly assisting in explaining the objective of the embodiments of the disclosure. FIG. 1 is a flowchart of a surface treatment method according to an embodiment of the disclosure. The surface treatment method is applicable to a housing, where the housing is made of aluminum alloy, and includes a surface. The surface treatment method includes the following steps. First, as described in step S120, anodic treatment is performed on the surface, to form a microporous structure on the surface. In addition, in the step, a protective oxide layer is formed on the surface of the housing. In an anodic treatment technology, a microporous shape is formed on a molecular structure of the surface of the housing by using an electrochemical reaction, and a surface protective oxide layer is generated. The anodic treatment technology used in this embodiment is a conventional anodic treatment technology, and is not a technical focus of the disclosure. Details are not described herein. Then, as described in step S140, a silicon material is deposited on the surface, to form a silicon polymer material layer to fill the microporous structure. Specifically, the silicon polymer material layer generated in the disclosure is formed by an alternate combination of silicon and oxygen, or is understood as an organosilicon compound. In an embodiment, step S140 includes: depositing the silicon material on the surface in a vacuum environment or in an inert gas environment by using a magnetron sputtering process. The magnetron sputtering process enables a silicon molecule to be adsorbed in a pore of an object, to forms a silicon polymer material layer on the surface (including a side wall and a bottom surface of the microporous structure). In an embodiment, a target material used in the magnetron sputtering process is a liquid or solid silicon polymer material. The inert gas prevents a silicon polymer material from generating a reaction during the sputtering process, so that chemical activity of the silicon po