US-12624949-B2 - Manufacturing method for electronic device and electronic device

Abstract

A manufacturing method for an electronic device includes a housing step of housing a vibrator element in a housing space formed by a substrate and a lid member, and an adjustment step of adjusting a resonance frequency of the lid member by removing a part of the lid member. The method further includes an inspection step of determining whether to perform the adjustment step. At the inspection step, performing the adjustment step is determined when the resonance frequency of the lid member is within a vibration frequency band of the vibrator element. At the adjustment step, a part of the lid member is removed by laser cutting.

Inventors

• Takeru SAKAIDE

Assignees

• SEIKO EPSON CORPORATION

Dates

Publication Date

20260512

Application Date

20231110

Priority Date

20221111

Claims (6)

1. 1 . A manufacturing method for an electronic device comprising: a housing step of housing an angular velocity sensor in a housing space formed by a substrate and a lid member, the angular velocity sensor having a vibration frequency, the lid member having a plurality of target removal regions, the plurality of target removal regions including a first region and a second region different from the first region, the first region including a center of the lid member in a plan view; a first inspection step of inspecting whether an initial resonance frequency of the lid member is within a predetermined vibration frequency range including the vibration frequency; a first adjustment step of adjusting the initial resonance frequency of the lid member by removing a part of the first region of the lid member when the initial resonance frequency of the lid member is within the predetermined vibration frequency range; a second inspection step of inspecting whether a first post-adjusted resonance frequency of the lid member is within the predetermined vibration frequency range after the part of the first region of the lid member is removed; and a second adjustment step of adjusting the first post-adjusted resonance frequency of the lid member by removing a part of the second region of the lid member when the first post-adjusted resonance frequency of the lid member is within the predetermined vibration frequency range, wherein the angular velocity sensor has a package and a vibrator element housed in the package, the package has a recessed portion and includes a box-shaped base supporting the vibrator element housed in the recessed portion, and a lid joined to the box-shaped base to close an opening of the recessed portion, and the vibrator element includes: a base portion located in a center part of the vibrator element; a pair of detection vibration arms extending from the base portion toward first both sides of the vibrator element, respectively; a pair of supporting arms extending from the base portion toward second both sides of the vibrator element; a first pair of drive vibration arms extending from an end of one supporting arm of the pair of supporting arms toward the first both sides; and a second pair of drive vibration arms extending from an end of the other supporting arm of the pair of supporting arms toward the first both sides.
2. 2 . The manufacturing method for an electronic device according to claim 1 , wherein the part of the first region of the lid member is removed by laser cutting.
3. 3 . The manufacturing method for an electronic device according to claim 2 , wherein the first region of the lid member is located at a top part of the lid member.
4. 4 . The manufacturing method for an electronic device according to claim 1 , wherein a corresponding area in the plan view of the first region corresponding to an amount of adjustment of the initial resonance frequency of the lid member is removed.
5. 5 . The manufacturing method for an electronic device according to claim 1 , wherein a corresponding thickness corresponding to an amount of adjustment of the initial resonance frequency of the lid member is removed.
6. 6 . An electronic device comprising: a substrate; an electronic component mounted on the substrate and including an angular velocity sensor, the angular velocity sensor having a package and a vibrator element housed in the package; and a lid member mounted on the substrate and covering the electronic component, wherein the lid member has a plurality of target removal regions thereon as a frequency adjustment mark formed by removal of a part thereof and being thinner than a surrounding portion, the package has a recessed portion and includes a box-shaped base supporting the vibrator element housed in the recessed portion, and a lid joined to the box-shaped base to close an opening of the recessed portion, and the vibrator element includes: a base portion located in a center part of the vibrator element; a pair of detection vibration arms extending from the base portion toward first both sides of the vibrator element, respectively; a pair of supporting arms extending from the base portion toward second both sides of the vibrator element; a first pair of drive vibration arms extending from an end of one supporting arm of the pair of supporting arms toward the first both sides; and a second pair of drive vibration arms extending from an end of the other supporting arm of the pair of supporting arms toward the first both sides.

Description

The present application is based on, and claims priority from JP Application Serial Number 2022-180840, filed Nov. 11, 2022, the disclosure of which is hereby incorporated by reference herein in its entirety. BACKGROUND 1. Technical Field The present disclosure relates to a manufacturing method for an electronic device and an electronic device. 2. Related Art A vibrating sensor device disclosed in JP-A-2013-088337 detects an angular velocity using a Coriolis force and includes a package having a recessed portion, a control circuit element mounted on a bottom surface of the recessed portion, a vibrating sensor element mounted on an upper surface of the control circuit element, and an upper lid covering the control circuit element and the vibrating sensor element and joined to the package. In the vibrating sensor device having the above described configuration, when the resonance frequency of the upper lid and the frequency of the vibrating sensor element are close to each other, the upper lid and the vibrating sensor element resonate and detection accuracy of the vibrating sensor device is degraded. Accordingly, in JP-A-2013-088337, the resonance frequency of the upper lid is adjusted by a stepped structure in the side surface of the upper lid. However, in the vibrating sensor device in JP-A-2013-088337, the resonance frequency of the upper lid is adjusted by the shape thereof and it is difficult to adjust the resonance frequency of the upper lid after assembly of the vibrating sensor device. Accordingly, there is a problem that it is difficult to address manufacturing variations. SUMMARY A manufacturing method for an electronic device according to an aspect of the present disclosure includes a housing step of housing a vibrator element in a housing space formed by a substrate and a lid member, and an adjustment step of adjusting a resonance frequency of the lid member by removing a part of the lid member. An electronic device according to an aspect of the present disclosure includes a substrate, an electronic component mounted on the substrate and including a vibrator element, and a lid member mounted on the substrate and covering the electronic component, wherein the lid member has a frequency adjustment mark formed by removal of a part thereof and being thinner than a surrounding portion. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view showing an electronic device according to a first embodiment. FIG. 2 is a top view of the electronic device in FIG. 1 from which a lid member and a mold portion are omitted. FIG. 3 is a bottom view of the electronic device in FIG. 1. FIG. 4 is a plan view showing a vibrator element. FIG. 5 is a diagram showing a drive state of the vibrator element. FIG. 6 is a diagram showing a drive state of the vibrator element. FIG. 7 is a sectional view of an angular velocity sensor. FIG. 8 is a sectional view of the angular velocity sensor. FIG. 9 is a sectional view of the angular velocity sensor. FIG. 10 is a sectional view along line A-A in FIG. 2. FIG. 11 is a flowchart showing a manufacturing method for the electronic device. FIG. 12 is a flowchart showing the manufacturing method for the electronic device. FIG. 13 is a top view showing an example of a method of removing a part of a cap. FIG. 14 is a top view showing the example of the method of removing the part of the cap. FIG. 15 is a sectional view showing the example of the method of removing the part of the cap. FIG. 16 is a sectional view showing an electronic device according to a second embodiment. DESCRIPTION OF EMBODIMENTS As below, an electronic device of the present disclosure will be explained in detail based on embodiments shown in the accompanying drawings. Note that, for convenience of explanation, in the respective drawings except FIGS. 4 to 6, three axes orthogonal to one another are shown as an X-axis, a Y-axis, and a Z-axis. Directions parallel to the X-axis are also referred to as “X-axis directions”, directions parallel to the Y-axis are also referred to as “Y-axis directions”, and directions parallel to the Z-axis are also referred to as “Z-axis directions”. Further, the Z-axis extends along a vertical direction and the pointer side is also referred to as “upper” and the opposite side is also referred to as “lower”. Furthermore, in FIGS. 4 to 6, three axes orthogonal to one another are shown as an A-axis, a B-axis, and a C-axis. Directions parallel to the A-axis are also referred to as “A-axis directions”, directions parallel to the B-axis are also referred to as “B-axis directions”, and directions parallel to the C-axis are also referred to as “C-axis directions”. Note that the X, Y, Z coordinate system is set for an electronic device and the A, B, C coordinate system is set for an angular velocity sensor. First Embodiment FIG. 1 is a top view showing an electronic device according to a first embodiment. FIG. 2 is a top view of the electronic device in FIG. 1 from which a lid member and a mold porti