US-12624970-B2 - Methods and apparatus for detecting carrier tape height level and thickness using fiber optic sensors

US12624970B2US 12624970 B2US12624970 B2US 12624970B2US-12624970-B2

Abstract

The disclosure is directed to apparatus and methods for detection of out of position (OOP) components in a carrier tape forming machine. An apparatus includes cross track sensors coupled to the bus interface circuitry, the cross track sensors configured to detect OOP components prior to overlaying the components on the carrier tape with cover tape, optical sensors to detect the OOP components on the carrier tape after overlaying with cover tape and prior to sealing and to detect reflections from OOP components seated on the carrier tape, an amplifier coupled to the optical sensors to amplify signals generated by the optical sensors and set a range for determining whether the components are OOP, and relays to receive indications of detected OOP components, and a controller coupled to the relays to stop the carrier tape forming machine as a function of signals received by the relays.

Inventors

Ngoc Duy VU
Nguyen Hoang Tan LE
Minh Anh Khoa NGUYEN

Assignees

INTEL CORPORATION

Dates

Publication Date: 20260512
Application Date: 20221020

Claims (20)

1 . An apparatus for detection of out of position (OOP) components in a carrier tape forming machine, the apparatus comprising: cross track sensors coupled to the bus interface circuitry, the cross track sensors configured to detect OOP components prior to overlaying the components on the carrier tape with cover tape; optical sensors to detect the OOP components on the carrier tape after overlaying with cover tape and prior to sealing, the optical sensors configured to detect reflections from OOP components seated on the carrier tape; an amplifier coupled to the optical sensors, the amplifier coupled to amplify signals generated by the optical sensors and set a range for determining whether the components are OOP; one or more relays coupled to the cross track sensors and the optical sensors, the relays configured to receive indications of detected OOP components in the carrier tape forming machine prior to sealing or prior to receipt by the cover plate; and a controller coupled to the one or more relays to stop the carrier tape forming machine as a function of signals received by the relays.
2 . The apparatus of claim 1 , further comprising bus interface circuitry coupled to the optical sensors and the amplifier, the bus interface circuitry connectable within the carrier tape forming machine to the controller.
3 . The apparatus of claim 1 , wherein the optical sensors are a pair of fiber optic sensors.
4 . The apparatus of claim 1 , wherein the sealing includes applying heat to seal a cover tape onto carrier tape to cover components.
5 . The apparatus of claim 1 , wherein out of position (OOP) components are outside a pocket in the carrier tape or components are offset in an x direction or in a y direction on the carrier tape.
6 . The apparatus of claim 1 , wherein the cross track sensors comprise at least two photoelectric sensors.
7 . The apparatus of claim 1 , wherein the optical sensors receive the range for OOP from the amplifier as a function of a size of the carrier tape.
8 . The apparatus of claim 7 , wherein size of the carrier tape is 44 mm with an OOP limit of 400 on each side of the carrier tape for 44 mm tape.
9 . The apparatus of claim 7 , wherein size of the carrier tape is 24 mm, with an OOP limit of between 600 and 650 for a left side and 300 for a right side.
10 . The apparatus of claim 1 , wherein the components are large scale integration (LSI) type components including integrated circuits (ICs), computer components, server components and computer components sized to fit into a carrier tape pocket.
11 . A method for a carrier tape forming machine comprising: detecting out of position (OOP) components on a carrier tape in two locations within the carrier forming machine including a first detecting prior to overlaying components with a cover tape, and a second detecting prior to sealing the cover tape to the carrier tape; performing the first detecting using cross track sensors prior to overlaying components with cover tape; performing the second detecting with fiber optic sensors by detecting reflections from OOP components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape; amplifying the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are OOP; and interrupting the carrier tape forming machine as a function of the detecting OOP components via received signals from one or more relays coupled to the cross track sensors and the fiber optic sensors, the relays configured to receive signal indicative of detected OOP components on the carrier tape forming machine prior to sealing and prior to receipt by the cover plate.
12 . The method of claim 11 , wherein the sealing includes applying heat to seal a cover tape onto carrier tape to cover components.
13 . The method of claim 11 , wherein out of position (OOP) components are outside a pocket in the carrier tape or components are offset in an x direction or in a y direction on the carrier tape.
14 . The method of claim 11 , wherein the cross track sensors comprise at least two photoelectric sensors.
15 . The method of claim 11 , wherein the optical sensors receive the range for OOP from the amplifier as a function of a size of the carrier tape.
16 . The method of claim 11 , wherein size of the carrier tape is 44 mm with an OOP limit of 400 on each side of the carrier tape for 44 mm tape.
17 . The method of claim 11 , wherein size of the carrier tape is 24 mm, with an OOP limit of between 600 and 650 for a left side and 300 for a right side.
18 . The method of claim 11 , wherein the components are large scale integration (LSI) type components including integrated circuits (ICs), computer components, server components and computer components sized to fit into a carrier tape pocket.
19 . A system for a carrier tape forming machine comprising: a memory; processing circuitry coupled to the memory, the processing circuitry configured to: detect out of position (OOP) components on a carrier tape in two locations within the carrier forming machine by performing a first detection prior to overlaying components with a cover tape, and a second detection prior to sealing the cover tape to the carrier tape; perform the first detection using cross track sensors prior to overlaying components with cover tape; perform the second detection with fiber optic sensors by detecting reflections from OOP components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape; amplify the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are OOP; and interrupt the carrier tape forming machine as a function of the detection of OOP components via received signals from one or more relays coupled to the cross track sensors and the fiber optic sensors, the relays configured to receive signal indicative of detected OOP components on the carrier tape forming machine prior to sealing and prior to receipt by the cover tape.
20 . The system of claim 19 , wherein the amplifier enables the carrier tape forming machine to detect OOP components and form carrier tapes with a plurality of large scale integration (LSI) type components independent of requiring a conversion.

Description

FIELD OF THE DISCLOSURE This disclosure generally relates to field of carrier tape manufacturing, and more particularly relates to methods and apparatus for detecting out of place components prior to sealing carrier tapes. BACKGROUND Carrier tape forming machines package electronic components such as integrated circuits, resistors, capacitors, transistors, by packing in a cavity. Upper cover tapes close over the components on a carrier tape and then the carrier tape is stored in a reel. The reel protects the electronics from contamination during transportation and storage. Unfortunately, during the manufacturing process out of position (OOP) components on a carrier tape may damage components or result in unusable reels and the like. For example, the components may be off-center or not aligned correctly which may result in stopping the carrier tape forming process altogether. What is needed are techniques that detect OOP components efficiently on carrier tape as the carrier tape is formed with components. BRIEF DESCRIPTION OF THE DRAWINGS A detailed description is set forth below with reference to the accompanying drawings. The use of the same reference numerals may indicate similar or identical items. Various embodiments may utilize elements and/or components other than those illustrated in the drawings, and some elements and/or components may not be present in various embodiments. Elements and/or components in the figures are not necessarily drawn to scale. Throughout this disclosure, depending on the context, singular and plural terminology may be used interchangeably. FIG. 1 illustrates an example carrier tape forming machine in accordance with an embodiment of the disclosure. FIG. 2 illustrates another view of a carrier tape forming machine including a pick and place (PNP) releasing a component onto a pocket within a carrier tape in accordance with an embodiment of the disclosure. FIG. 3 illustrates a carrier tape with offset component views in accordance with an embodiment of the disclosure. FIG. 4 illustrates an overhead view of a carrier tape forming machine including a cross track sensor portion, a cover plate portion, a fiber optic sensor portion and a seal head in accordance with an embodiment of the disclosure. FIG. 5 illustrates a side view of a carrier tape with a pocket for components in accordance with various embodiments of the disclosure. FIG. 6 illustrates a carrier tape forming machine with a fiber optic sensor focused on a component in a pocket in accordance with various embodiments of the disclosure. FIG. 7 illustrates an electrical schematic diagram of a carrier tape forming machine with sensors in accordance with various embodiments of the disclosure. FIG. 8 illustrates a flow diagram of a method in accordance with an embodiment of the disclosure. FIG. 9 illustrates a system diagram for implementing a carrier tape forming machine in accordance with an embodiment of the disclosure. DETAILED DESCRIPTION In terms of a general overview, this disclosure is generally directed to apparatus and methods for detecting out of position (OOP) or out of pocket components to be stored in a carrier tape using a carrier tape forming machine. The following detailed description refers to the accompanying drawings. The same reference numbers may be used in different drawings to identify the same or similar elements. In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular structures, architectures, interfaces, techniques, etc. in order to provide a thorough understanding of the various aspects of various embodiments. However, it will be apparent to those skilled in the art having the benefit of the present disclosure that the various aspects of the various embodiments may be practiced in other examples that depart from these specific details. In certain instances, descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the various embodiments with unnecessary detail. For the purposes of the present document, the phrases “A or B” and “A/B” mean (A), (B), or (A and B). Embodiments are directed to an apparatus for detection of out of position (OOP) components in a carrier tape forming machine. In one or more embodiments, the apparatus includes cross track sensors coupled to the bus interface circuitry, the cross track sensors configured to detect OOP components prior to overlaying the components on the carrier tape with cover tape; optical sensors to detect the OOP components on the carrier tape after overlaying with cover tape and prior to sealing, the optical sensors configured to detect reflections from OOP components seated on the carrier tape; an amplifier coupled to the optical sensors, the amplifier coupled to amplify signals generated by the optical sensors and set a range for determining whether the components are OOP; one or more relays coupled to the cross track sensors and