US-12625019-B2 - Pressure sensor, manufacturing method thereof and pressure detection device

US12625019B2US 12625019 B2US12625019 B2US 12625019B2US-12625019-B2

Abstract

An MEMS pressure sensor, a method for manufacturing an MEMS pressure sensor, and a pressure detection device are provided. The MEMS pressure sensor includes: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip. The sensor chip includes a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode includes a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity. The first and second electrodes of the sensor chip are electrically connected to the integrated circuit chip through the adapter board.

Inventors

Qiuxu WEI
Shaohua Wu
Guochen DU
Ding Ding
Feng Qu
Yue Li
Lihui Wang
Weilong GUO
Yanfei REN
TAONAN ZHANG
Wenbo CHANG
Jie Sun
Nana He

Assignees

BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
BOE TECHNOLOGY GROUP CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20230103

Claims (20)

1 . An MEMS pressure sensor, comprising: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip; wherein the sensor chip comprises a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode comprises: a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity; wherein the first electrode and the second electrode of the sensor chip are electrically connected to the integrated circuit chip through the adapter board.
2 . A pressure detection device, comprising: the MEMS pressure sensor of claim 1 ; and a printed circuit board electrically connected to the integrated circuit chip and configured to provide an operating signal to the integrated circuit chip.
3 . The MEMS pressure sensor of claim 1 , wherein the integrated circuit chip comprises a first detection terminal and a second detection terminal; and the adapter board comprises: a substrate body, a first connection component and a second connection component, the first connection component passes through the first via in the substrate body and is electrically connected to the first electrode and the first detection terminal, and the second connection component passes through the second via in the substrate body and is electrically connected to the bonding layer and the second detection terminal.
4 . The MEMS pressure sensor of claim 3 , wherein the MEMS pressure sensor further comprises: a dielectric layer on a side of the adapter board away from the sensor chip; a first conductive component, wherein at least one portion of the first conductive component is in a third via in the dielectric layer, and the first conductive component electrically connects the first connection component to the first detection terminal; and a second conductive component, wherein at least one portion of the second conductive component is in a fourth via in the dielectric layer, and the second conductive component electrically connects the second connection component to the second detection terminal.
5 . The MEMS pressure sensor of claim 4 , wherein the MEMS pressure sensor further comprises: a transmission line between the dielectric layer and the adapter board; a third conductive component, wherein at least one portion of the third conductive component is in a fifth via in the dielectric layer, and the third conductive component electrically connects a signal terminal of the integrated circuit chip to the transmission line; and a fourth conductive component, wherein a portion of the fourth conductive component is in a sixth via in the dielectric layer and electrically connected to the transmission line.
6 . The MEMS pressure sensor of claim 5 , wherein the sensor chip further comprises a base substrate, and the second electrode is on a side of the base substrate close to the adapter board.
7 . The MEMS pressure sensor of claim 6 , wherein the MEMS pressure sensor further comprises a second groove on a surface of the second electrode close to the first electrode, an orthographic projection of the second groove on the adapter board covers an orthographic projection of the first electrode on the adapter board, and an orthographic projection of the bonding layer on the adapter board surrounds an orthographic projection of the second groove on the adapter board.
8 . The MEMS pressure sensor of claim 1 , wherein the sensor chip further comprises a base substrate, and the second electrode is on a side of the base substrate close to the adapter board.
9 . The MEMS pressure sensor of claim 8 , wherein the second electrode and the base substrate have a one-piece structure.
10 . The MEMS pressure sensor of claim 8 , wherein the MEMS pressure sensor further comprises a first groove on a side of the base substrate away from the adapter board to expose the pressure-sensitive portion of the second electrode.
11 . The MEMS pressure sensor of claim 8 , wherein the adapter board comprises a substrate body, and the base substrate and the substrate body are made of different materials.
12 . The MEMS pressure sensor of claim 1 , wherein the MEMS pressure sensor further comprises a second groove on a surface of the second electrode close to the first electrode, an orthographic projection of the second groove on the adapter board covers an orthographic projection of the first electrode on the adapter board, and an orthographic projection of the bonding layer on the adapter board surrounds an orthographic projection of the second groove on the adapter board.
13 . The MEMS pressure sensor of claim 1 , wherein the MEMS pressure sensor further comprises a receiving groove on a surface of the adapter board away from the sensor chip, and the integrated circuit chip is located in the receiving groove.
14 . A method for manufacturing an MEMS pressure sensor, comprising: forming a sensor chip on one side of an adapter board, wherein the sensor chip comprises a first electrode and a second electrode, the first electrode is provided between the adapter board and the second electrode, the second electrode comprises a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity; and forming an integrated circuit chip on a side of the adapter board away from the sensor chip, and electrically connecting the first electrode and the second electrode of the sensor chip to the integrated circuit chip through the adapter board.
15 . The method of claim 14 , wherein the integrated circuit chip comprises a first detection terminal and a second detection terminal, and the adapter board comprises a substrate body; the electrically connecting the first electrode and the second electrode of the sensor chip to the integrated circuit chip through the adapter board comprises: forming a first via and a second via in the substrate body; forming a first connection component and a second connection component, wherein the first connection component passes through the first via and is electrically connected to the first electrode, and the second connection component passes through the second via and is electrically connected to the bonding layer; and electrically connecting the first detection terminal to the first connection component, and electrically connecting the second detection terminal to the second connection component.
16 . The method of claim 15 , wherein after the forming the first connection component and the second connection component, the method further comprises: forming a dielectric layer, forming a third via in the dielectric layer at a position corresponding to the first connection component, and forming a fourth via in the dielectric layer at a position corresponding to the second connection component; and forming a first conductive component and a second conductive component, wherein at least a portion of the first conductive component is located in the third via, and at least a portion of the second conductive component is located in the fourth via; wherein the electrically connecting the first detection terminal to the first connection component, and the electrically connecting the second detection terminal to the second connection component comprises: electrically connecting the first connection component to the first detection terminal through the first conductive component, and electrically connecting the second connection component to the second detection terminal through the second conductive component.
17 . The method of claim 16 , wherein prior to the forming the dielectric layer, the method further comprises: forming a transmission line on the adapter board; after the forming the dielectric layer, the method further comprises: forming a fifth via and a sixth via in the dielectric layer; forming a third conductive component and a fourth conductive component, wherein the third conductive component is connected to one end of the transmission line through the fifth via, and the fourth conductive component is connected to the other end of the transmission line through the sixth via; and connecting a signal terminal of the integrated circuit chip to the third conductive component.
18 . The method of claim 17 , wherein the forming the transmission line is simultaneous with the forming the first connection component and the second connection component.
19 . The method of claim 14 , wherein the forming the sensor chip on one side of the adapter board comprises: performing a doping process on a first portion of an insulating substrate to conductorize the first portion of the insulating substrate to form the second electrode, wherein a remaining portion of the insulating substrate is used as a base substrate; etching the second electrode to form a second groove in the second electrode; forming the first electrode and the bonding layer on the adapter board; and placing the pressure-sensitive portion of the second electrode opposite to the first electrode, and bonding the edge portion of the second electrode to the bonding layer.
20 . The method of claim 19 , wherein the etching the second electrode comprises: simultaneously etching the second electrode and the base substrate by using etching liquid, to form a first groove in the base substrate to expose a portion of the second electrode, and form the second groove on a side of the second electrode away from the first groove.

Description

TECHNICAL FIELD The present disclosure relates to the field of sensing technology, and in particular to a pressure sensor, a method for manufacturing a pressure sensor and a pressure detection device. BACKGROUND A micro-electro mechanical system (MEMS) belongs to an emerging interdisciplinary high and new technology research field. A pressure sensor manufactured by the MEMS technology has the advantages of small volume, easy integration, reliable performance, capability of realizing a conversion from a non-electric signal to an electric signal and the like, and thus is commonly used for pressure measurement in the fields of consumption, automobiles, aerospace, petrifaction, biomedical treatment and the like. SUMMARY The present disclosure provides a pressure sensor, a method for manufacturing a pressure sensor and a pressure detection device. In a first aspect, the present disclosure provides an MEMS pressure sensor, including: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip; the sensor chip includes a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode includes: a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed on the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity; and the first electrode and the second electrode of the sensor chip are electrically connected to the integrated circuit chip through the adapter board. In some embodiments, the integrated circuit chip includes a first detection terminal and a second detection terminal; and the adapter board includes: a substrate body, a first connection component and a second connection component, the first connection component passes through the first via in the substrate body and is electrically connected to the first electrode and the first detection terminal, and the second connection component passes through the second via in the substrate body and is electrically connected to the bonding layer and the second detection terminal. In some embodiments, the MEMS pressure sensor further includes: a dielectric layer on a side of the adapter board away from the sensor chip; a first conductive component, at least one portion of the first conductive component being in a third via in the dielectric layer, and the first conductive component electrically connecting the first connection component to the first detection terminal; and a second conductive component, at least one portion of the second conductive component being in a fourth via in the dielectric layer, and the second conductive component electrically connecting the second connection component to the second detection terminal. In some embodiments, the MEMS pressure sensor further includes: a transmission line between the dielectric layer and the adapter board; a third conductive component, at least one portion of the third conductive component being in a fifth via in the dielectric layer, and the third conductive component electrically connecting a signal terminal of the integrated circuit chip to the transmission line; and a fourth conductive component, a portion of the fourth conductive component being in a sixth via in the dielectric layer and electrically connected to the transmission line. In some embodiments, the sensor chip further includes a base substrate, and the second electrode is on a side of the base substrate close to the adapter board. In some embodiments, the second electrode and the base substrate have a one-piece structure. In some embodiments, the MEMS pressure sensor further includes a first groove on a side of the base substrate away from the adapter board, and the first groove exposes the pressure-sensitive portion of the second electrode. In some embodiments, the adapter board includes a substrate body, and the base substrate and the substrate body are made of different materials. In some embodiments, the MEMS pressure sensor further includes a second groove in a surface of the second electrode close to the first electrode, an orthographic projection of the second groove on the adapter board covers an orthographic projection of the first electrode on the adapter board, and an orthographic projection of the bonding layer on the adapter board surrounds an orthographic projection of the second groove on the adapter board. In some embodiments, the MEMS pressure sensor further includes a receiving groove in a surface of the adapter board away from the sensor chip, and the integrated circuit chip is located in the receiving groove. In a second aspect, the present disclosure provides a method for manufacturing an MEMS pressure sensor, including: forming a sensor chip on one side of an adapter board, su