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US-12625070-B2 - Method for quality inspection of etching paste material based on spectral response difference

US12625070B2US 12625070 B2US12625070 B2US 12625070B2US-12625070-B2

Abstract

A method for quality inspection of an etching paste material based on a spectral response difference, including: identifying a position of density mutation boundary through spectral collection and density gradient analysis. Applying a specific frequency beam to obtain the resonance response parameter, generating stress field reconstruction data. Performing a reverse optical tracking to obtain a defect formation path, generating degradation prediction data. Establishing a self-organizing optical monitoring grid, to form a hierarchical spectral fingerprint library. Constructing a multi-point linked defect blocking network, to form an interconnected optical energy field. Monitoring a cooperative response to obtain network stability data, Identifying abnormal position coordinates based on a material quality grade and the network stability data, obtaining the abnormal position coordinates. Performing a phase adjustment to obtain a phase difference spectral set, conducting a phase comparison marking on the abnormal position coordinates, completing the quality inspection of the etching paste material.

Inventors

  • ZIJING XU

Assignees

  • Jiangsu Sambon Technology Co., Ltd.

Dates

Publication Date
20260512
Application Date
20250917

Claims (8)

  1. 1 . A method for a quality inspection of an etching paste material based on a spectral response difference, comprising: obtaining, using a multi-band spectral acquisition system, multi-band spectral signals and a material thickness from a surface of the etching paste material, wherein the multi-band spectral acquisition system comprises an area array camera, a multi-band light source system, a thickness measurement module, and a trigger controller synchronizing illumination and image capture; performing a spectral tomography decomposition based on the multi-band spectral signals to obtain a layered spectral map of an internal of the etching paste material; generating material density gradient distribution values by calculating an absorption intensity for each virtual layer based on spectral response characteristics in the layered spectral map, determining a layer thickness distribution based on the material thickness and layered interface position information, calculating a layer density based on the absorption intensity and the layer thickness distribution, and computing spatial gradients of the layer density; identifying a position of density mutation boundary based on the material density gradient distribution values; applying an excitation beam at the position of density mutation boundary to induce a resonance phenomenon and obtain a resonance response parameter of the etching paste material, including selecting an excitation beam frequency based on an inherent resonance frequency at the position of density mutation boundary and a frequency scanning and fine-tuning operation to obtain an optimal excitation frequency, and obtaining the resonance response parameter by monitoring at least amplitude and phase changes of the resonance phenomenon; generating stress field reconstruction data of the internal of the etching paste material based on the resonance response parameter; determining coordinate of stress concentration point based on the stress field reconstruction data, performing a reverse optical tracking from the stress concentration point outward to obtain a defect formation path, generating degradation prediction data from the defect formation path; and establishing a self-organizing optical monitoring grid in potential defect regions based on the degradation prediction data; performing an adaptive density adjustment on the self-organizing optical monitoring grid to obtain an optimized grid distribution, applying a differentiated spectral excitation to the optimized grid distribution to form a hierarchical spectral fingerprint library, generating a material state boundary recognition standard based on the hierarchical spectral fingerprint library; and detecting a phase transition critical point of the etching paste material based on the material state boundary recognition standard to obtain a phase transition boundary; applying a pulsed beam at multiple synchronous excitation points set within a boundary region surrounding the phase transition boundary to induce surface deformation of the etching paste material and obtain surface deformation response characteristics, generating material stability boundary parameters based on the surface deformation response characteristics; and constructing a multi-point linked defect blocking network based on the material stability boundary parameters, performing a defect analysis on the multi-point linked defect blocking network by determining an energy requirement of each of blocking points, establishing energy transmission channels between each of the blocking points based on the energy requirements, achieving energy balance between the blocking points through the energy transmission channels to obtain a distributed energy field, and performing a network integration processing on the distributed energy field to form an interconnected optical energy field, monitoring a cooperative response of the interconnected optical energy field to obtain network stability data; determining a material quality grade based on the network stability data; and identifying abnormal position coordinates based on the material quality grade and the network stability data, obtaining the abnormal position coordinates, performing a phase adjustment on the hierarchical spectral fingerprint library to obtain a phase difference spectral set, conducting a phase comparison marking on the abnormal position coordinates using the phase difference spectral set to complete the quality inspection of the etching paste material based on the spectral response difference.
  2. 2 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 1 , wherein performing a spectral tomography decomposition based on the multi-band spectral signals to obtain layered spectral map of an internal of the etching paste material comprises: determining penetration depths of different bands based on the multi-band spectral signals; performing a virtual layering on the etching paste material based on the penetration depths to obtain layered interface data; extracting spectral response characteristics of each of virtual layers based on the layered interface data to obtain the layered spectral map of the internal of the etching paste material material.
  3. 3 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 1 , wherein applying a specific frequency beam at the position of density mutation boundary to induce a resonance phenomenon and obtain the resonance response parameter of the etching paste material comprises: performing a material characteristic analysis based on the position of density mutation boundary to obtain an inherent resonance frequency; selecting an excitation beam frequency based on the inherent resonance frequency to obtain a frequency matching parameter; applying the excitation beam based on the frequency matching parameter to induce the resonance phenomenon; monitoring amplitude and phase changes of the resonance phenomenon to form the resonance response parameter of the etching paste material.
  4. 4 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 1 , wherein reverse optical tracking from the stress concentration point outward to obtain the defect formation path comprises: setting multiple tracking directions from the stress concentration point, including radial, tangential, and axial tracking directions; detecting changes of optical characteristics along each of the multiple tracking directions to obtain gradient changing data; determining possible paths of a defect extension based on the gradient changing data to generate the defect formation path.
  5. 5 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 1 , wherein performing an adaptive density adjustment on the self-organizing optical monitoring grid to obtain an optimized grid distribution comprises: calculating an importance weight of each region based on the self-organizing optical monitoring grid; generating a grid density adjustment factor based on the importance weight; adding a density of grid points in high-weight regions based on the grid density adjustment factor to form the optimized grid distribution.
  6. 6 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 1 , wherein applying a pulsed beam near the phase transition boundary to induce surface deformation of the etching paste material and obtain surface deformation response characteristics includes: setting multiple synchronous excitation points in a boundary region based on the phase transition boundary; applying a pulsed beam to the multiple synchronous excitation points to obtain combined excitation energy; generating material cooperative surface deformation through the combined excitation energy to obtain enhanced deformation effect; monitoring a propagation mode and a recovery characteristic of the enhanced deformation effect to form the surface deformation response characteristics.
  7. 7 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 1 , wherein performing the phase adjustment on the hierarchical spectral fingerprint library to obtain the phase difference spectral set includes: extracting a real-time phase state of each of light spectrums in different grades from the hierarchical spectral fingerprint library; establishing a dynamic phase tracking mechanism based on the real-time phase state; performing an adaptive phase modulation on the light spectrums through the dynamic phase tracking mechanism to obtain the phase difference spectral set.
  8. 8 . The method for the quality inspection of the etching paste material based on the spectral response difference according to claim 3 , wherein selecting an excitation beam frequency based on the inherent resonance frequency to obtain a frequency matching parameter includes: determining a resonance peak position based on the inherent resonance frequency; setting a frequency scanning range around the resonance peak position; performing a frequency fine-tuning operation within a frequency scanning range to find a maximum response point, to obtain an optimal excitation frequency; calculating a matching degree between the optimal excitation frequency and the inherent resonance frequency to form the frequency matching parameter.

Description

TECHNICAL FIELD The present disclosure relates to the technical field of optical detection technology, in particular to a method for a quality inspection of an etching paste material based on a spectral response difference. BACKGROUND In the production of solar cells, etching paste material, as an important auxiliary printing material, is widely used in the manufacturing process of solar cell panels. The etching paste is in a gel-like form and is primarily used for etching transparent metal conductive coatings, enabling fine etching patterns to be created through screen printing. Compared to traditional etching processes, after the etching paste is printed, it does not require treatment with strong acids or alkalis, making it more convenient and cleaner, thus meeting the requirements of modern green manufacturing. However, the etching paste material faces complex quality control challenges in actual use. Due to issues such as uneven density distribution, component segregation, and microscopic defects within the etching paste material, these internal structural abnormalities can gradually evolve into macroscopic defects during material use, affecting the consistency and reliability of the etching effect. Traditional quality inspection methods mainly rely on surface observation and simple physical tests, making it difficult to analyze the microscopic structural state, stress distribution, and potential degradation risks within the material. In particular, existing detection technologies lack effective analytical methods for key quality indicators such as internal material density gradient changes, stress concentration regions, and phase transition characteristics. These detection blind spots often result in quality problems being discovered only in the later stages of material use, preventing early warning and preventive quality control, which severely impacts production stability and the consistency of product quality. SUMMARY The present disclosure provides a method for a quality inspection of an etching paste material based on a spectral response difference, aims to construct a multidimensional material characteristic analysis framework, deeply explore the spectral phase response patterns of etching paste materials, and establish a complete detection chain from the microstructure to the macroscopic performance of the material, thereby achieving precise, comprehensive, and intelligent quality detection of etching paste materials. To realize the above objective, the present disclosure provides a method for a quality inspection of an etching paste material based on a spectral response difference, including the following steps. Obtaining multi-band spectral signals and a material thickness from a surface of the etching paste material, performing a spectral tomography decomposition based on the multi-band spectral signals to obtain a layered spectral map of a internal of the etching paste material, combining the material thickness with the layered spectral map to generate material density gradient distribution values. Identifying a position of density mutation boundary based on the material density gradient distribution values, applying a specific frequency beam at the position of density mutation boundary to induce a resonance phenomenon and obtain the resonance response parameter of the etching paste material, generating stress field reconstruction data of the internal of the etching paste material based on the resonance response parameter. Determining coordinate of stress concentration point based on the stress field reconstruction data, performing a reverse optical tracking from the stress concentration point outward to obtain a defect formation path, generating degradation prediction data from the defect formation path. Establishing a self-organizing optical monitoring grid in potential defect regions based on the degradation data; performing an adaptive density adjustment on the self-organizing optical monitoring grid to obtain an optimized grid distribution, applying a differentiated spectral excitation to the optimized grid distribution to form a hierarchical spectral fingerprint library, generating a material state boundary recognition standard based on the hierarchical spectral fingerprint library. Detecting a phase transition critical point of the etching paste material based on the material state boundary recognition standard to obtain a phase transition boundary, applying a pulsed beam near the phase transition boundary to induce surface deformation of the etching paste material and obtain surface deformation response characteristics, generating material stability boundary parameters based on the surface deformation response characteristics. Constructing a multi-point linked defect blocking network based on the material stability boundary parameters, performing a defect analysis on the multi-point linked defect blocking network to form an interconnected optical energy field, monitoring a cooperativ