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US-12625161-B2 - Semiconductor module inspection device

US12625161B2US 12625161 B2US12625161 B2US 12625161B2US-12625161-B2

Abstract

A semiconductor module inspection device of the present disclosure includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate. In an embodiment, the first temperature control device and the second temperature control device have a Peltier element and a heat dissipation fin. In an embodiment, the semiconductor module inspection device further includes a chamber structure including a chamber upper portion connected to the heat dissipation surface of the first temperature control device, a chamber lower portion connected to the heat dissipation surface of the second temperature control device, and a purge mechanism for purging the chamber internal space with dried air.

Inventors

  • Masayuki Takahashi
  • Kentaro Honda

Assignees

  • NTT, INC.

Dates

Publication Date
20260512
Application Date
20210903

Claims (13)

  1. 1 . A semiconductor module inspection device, comprising: a printed circuit board (PCB) substrate; an integrated circuit (IC) socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate; a first temperature control device disposed in contact with an upper surface of the IC socket; a second temperature control device disposed in contact with a second main surface of the PCB substrate; and a chamber structure including a chamber upper portion in direct contact with a heat dissipation surface of the first temperature control device and a chamber lower portion in direct contact with a heat dissipation surface of the second temperature control device.
  2. 2 . The semiconductor module inspection device according to claim 1 , wherein the first temperature control device and the second temperature control device have a Peltier element and a heat dissipation fin.
  3. 3 . The semiconductor module inspection device according to claim 2 , wherein the first temperature control device and the second temperature control device further include a cooling fan.
  4. 4 . The semiconductor module inspection device according to claim 3 , wherein the chamber upper portion and the chamber lower portion are fitted to each other to form a chamber internal space, and the chamber structure includes a purge mechanism for purging the chamber internal space with dried air.
  5. 5 . The semiconductor module inspection device according to claim 4 , further comprising: a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein the first temperature control device includes the positioning pin, and a lid portion of the IC socket includes the pin receiver.
  6. 6 . The semiconductor module inspection device according to claim 3 , further comprising: a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein the first temperature control device includes the positioning pin, and a lid portion of the IC socket includes the pin receiver.
  7. 7 . The semiconductor module inspection device according to claim 2 , wherein the chamber upper portion and the chamber lower portion are fitted to each other to form a chamber internal space, and the chamber structure includes a purge mechanism for purging the chamber internal space with dried air.
  8. 8 . The semiconductor module inspection device according to claim 7 , further comprising: a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein the first temperature control device includes the positioning pin, and a lid portion of the IC socket includes the pin receiver.
  9. 9 . The semiconductor module inspection device according to claim 2 , further comprising: a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein the first temperature control device includes the positioning pin, and a lid portion of the IC socket includes the pin receiver.
  10. 10 . The semiconductor module inspection device according to claim 1 , wherein the chamber upper portion and the chamber lower portion are fitted to each other to form a chamber internal space, and the chamber structure includes a purge mechanism for purging the chamber internal space with dried air.
  11. 11 . The semiconductor module inspection device according to claim 10 , further comprising: a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein the first temperature control device includes the positioning pin, and a lid portion of the IC socket includes the pin receiver.
  12. 12 . The semiconductor module inspection device according to claim 1 , further comprising: a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver to be fitted with the positioning pin, wherein the first temperature control device includes the positioning pin, and a lid portion of the IC socket includes the pin receiver.
  13. 13 . A semiconductor module inspection device, comprising: a printed circuit board (PCB) substrate; an integrated circuit (IC) socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate; a first temperature control device disposed in contact with an upper surface of the IC socket; a second temperature control device disposed in contact with a second main surface of the PCB substrate; and a chamber structure including a chamber upper portion in direct contact with a heat dissipation surface of the first temperature control device and a chamber lower portion in direct contact with a heat dissipation surface of the second temperature control device, and wherein the chamber upper portion comprises an opening, and an edge of the opening of the chamber upper portion contacts an edge of the first temperature control device, and wherein the chamber lower portion comprises an opening, and an edge of the opening of the chamber lower portion contacts an edge of the second temperature control device.

Description

TECHNICAL FIELD The present disclosure relates to a semiconductor module inspection device. BACKGROUND ART In recent years, in order to cope with an increase in communication traffic, miniaturization, low power, and high speed of an optical communication transceiver have come to be required. The optical semiconductor module including the optical communication transceiver includes an optical modulator that converts an electrical signal into a transmission optical signal, a photodiode that converts a reception optical signal into an electrical signal, and an optical circuit chip that connects these components. In addition, an amplifier circuit for driving an optical modulator or a photodiode, a control circuit, and a digital signal processing circuit may also be included in the electronic/optical circuit. In recent years, research and development on optical semiconductor modules including a ball grid array (BGA) and a land grid array (LGA) as a small and high-speed input/output interface for an electrical signal has been conducted. Such an optical semiconductor module is called Co-packaged Optics, and has been actively researched and developed in recent years. (For example, Non Patent Literature 1) In shipment inspection of an optical semiconductor module including such a BGA, inspection using an IC socket is performed similarly to an integrated circuit (IC) or an IC module (IC package) including a general BGA not including an optical semiconductor such as a processor or an application specific integrated circuit (ASIC). The IC socket includes a contact pin, and various electrical characteristics can be inspected by bringing a terminal portion of the accommodated IC module into contact with the contact pin and allowing conduction. (Patent Literature 1) When an IC module is inspected in a temperature environment, a non-contact type temperature control device (environmental tester) that jets jet air at about −100° C. to 300° C. to an IC socket is used to change the ambient temperature environment for each IC socket in general. As a method of easily changing the temperature, a method of changing the upper surface temperature of the IC module by attaching a contact-type temperature control device such as a Peltier element or a fin to the upper portion of the IC socket is also used. CITATION LIST Patent Literature Patent Literature 1: JP 2020-194041 A Non Patent Literature Non Patent Literature 1: P. Maniotis et al., “Scaling HPC Networks with Co-Packaged Optics”, T3K.7, OFC2020, March 2020 SUMMARY OF INVENTION Since the jet air causes shaking of the optical fiber connected to the optical semiconductor module, there is a problem that an inspection result of the optical semiconductor module is affected. In addition, when the temperature control device is attached to the upper portion of the IC socket, there is a problem that a temperature distribution occurs in the optical semiconductor module. The present disclosure has been made in view of such a problem, and an object of the present disclosure is to provide a semiconductor module inspection device that is easily temperature-controllable and particularly suitable for an optical semiconductor module. In order to achieve such an object, a semiconductor module inspection device according to an embodiment of the present invention includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate. As described above, according to one embodiment of the present invention, it is possible to provide a semiconductor module inspection device that can be easily temperature-controlled, particularly suitable for an optical semiconductor module. BRIEF DESCRIPTION OF DRAWINGS FIG. 1a is a schematic configuration diagram of an environmental tester. FIG. 1b is a schematic configuration diagram of a semiconductor module inspection device including a temperature control device. FIG. 1c is a schematic configuration diagram of a semiconductor module inspection device including a thermostatic bath. FIG. 2 is a schematic configuration diagram of a semiconductor module inspection device according to an embodiment of the present invention. FIG. 3a is a schematic configuration diagram of a semiconductor module inspection device according to an embodiment of the present invention. FIG. 3b is a schematic configuration diagram of the semiconductor module inspection device according to an embodiment of the present invention. FIG. 4 is a schematic configuration diagram of a semiconductor module inspection device according to an embodiment of the present invention. DESCRIPTION OF EMBODIMENTS A detailed description of embodiments of the present invention will be described below with reference to the drawings. The same or similar r