US-12625163-B2 - Cantilever probe card device and climb-restricting probe

US12625163B2US 12625163 B2US12625163 B2US 12625163B2US-12625163-B2

Abstract

A climb-restricting probe includes an arm segment, a main segment located at one side of the arm segment, a testing segment connected to another side of the arm segment, and a climb-restricting ring. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction. The climb-restricting ring surrounds the main segment along a top edge of the soldering end portion and protrudes from an outer surface of the main segment. The climb-restricting ring has a restriction height along the predetermined direction. The restriction height is within a range from 3 μm to 50 μm. The climb-restricting ring can block a solder from climbing past the climb-restricting ring along the predetermined direction.

Inventors

HAO-YEN CHENG
Rong-Yang Lai
Chao-Hui Tseng
WEI-JHIH SU

Assignees

CHUNGHWA PRECISION TEST TECH. CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20240411
Priority Date: 20230518

Claims (10)

1 . A cantilever probe card device, comprising: a substrate including a plurality of soldering pads; a plurality of solders respectively disposed on the soldering pads; and a plurality of climb-restricting probes fixed onto the substrate and each including: an arm segment; a main segment located at one side of the arm segment, wherein the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction; a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment; and a climb-restricting ring surrounding the main segment along a top edge of the soldering end portion and protruding from an outer surface of the main segment; wherein, in each of the climb-restricting probes, the climb-restricting ring has a restriction height along the predetermined direction, and wherein the restriction height is within a range from 3 μm to 50 μm; wherein the soldering end portions of the main segments of the climb-restricting probes are respectively soldered and fixed onto the soldering pads of the substrate through the solders; and wherein, in each of the climb-restricting probes, the climb-restricting ring is capable of blocking the corresponding solder on the soldering end portion, such that the corresponding solder is unable to climb past the climb-restricting ring along the predetermined direction; wherein, in each of the climb-restricting probes, the climb-restricting ring protrudes from the outer surface of the main segment by a thickness that is within a range from 1 μm to 10 μm, and the climb-restricting ring is made of an organic insulation material.
2 . The cantilever probe card device according to claim 1 , wherein the soldering pads include a plurality of first soldering pads and a plurality of second soldering pads, wherein the first soldering pads are arranged in a first row along an arrangement direction perpendicular to the predetermined direction, and the second soldering pads are arranged in a second row along the arrangement direction, wherein the second row is parallel to and spaced apart from the first row, and wherein each of the climb-restricting probes includes: a plurality of first probes each having the main segment, the arm segment, and the testing segment, wherein the main segment, the arm segment, and the testing segment of each of the first probes are respectively defined as a first main segment, a first arm segment, and a first testing segment; and a plurality of second probes each having: the main segment defined as a second main segment and having a main height along the predetermined direction; an extending segment connected to the second main segment, wherein the extending segment has an extension height along the predetermined direction, and wherein the extension height is within a range from 5% to 80% of the main height; the arm segment defined as a second arm segment and connected to the extending segment; and the testing segment defined as a second testing segment, wherein the second testing segment has an upright shape along the predetermined direction and is connected to the second arm segment; wherein the first main segments of the first probes are fixed onto the first soldering pads, the second main segments of the second probes are fixed onto the second soldering pads, and the first testing segments of the first probes and the second testing segments of the second probes are arranged in one row along the arrangement direction; wherein, when the first testing segments of the first probes and the second testing segments of the second probes jointly abut against a device under test (DUT), each of the first probes is only deformed in the first arm segment, and each of the second probes is only deformed in the second arm segment.
3 . The cantilever probe card device according to claim 2 , wherein the first soldering pads of the first row are spaced apart from the second soldering pads of the second row by an offset distance along an extending direction that is perpendicular to the arrangement direction and the predetermined direction, and the extending segment of any one of the second probes has an extension distance along the extending direction, wherein the extension distance is within a range from 95% to 105% of the offset distance; and wherein, when the first testing segments of the first probes and the second testing segments of the second probes jointly abut against the DUT, a pressure generated in the first testing segment of any one of the first probes is within a range from 95% to 105% of a pressure generated in the second testing segment of any one of the second probes.
4 . The cantilever probe card device according to claim 2 , wherein any two of the second probes adjacent to each other are provided with one of the first probes therebetween, and any one of the first probes and an adjacent one of the second probes have a spacing along the arrangement direction, and wherein the spacing is within a range from 20 μm to 200 μm.
5 . The cantilever probe card device according to claim 1 , wherein each of the climb-restricting probes includes a light absorption coating layer; and wherein, in each of the climb-restricting probes, the testing segment includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment and that is covered by the light absorption coating layer, and the pinpoint portion is exposed from the light absorption coating layer, so that through the light absorption coating layer, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus.
6 . The cantilever probe card device according to claim 5 , wherein, in the observation process, the detection apparatus is operated by using light to irradiate on the climb-restricting probes for obtaining the observation point of each of the climb-restricting probes; and wherein, in each of the climb-restricting probes, a light absorption ratio of the light absorption coating layer corresponding to the light is greater than or equal to 60%.
7 . The cantilever probe card device according to claim 1 , wherein, in each of the climb-restricting probes, the testing segment includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment and that has a roughened surface arranged on an entirety of an outer surface thereof, the roughened surface having an arithmetic average roughness (Ra) within a range from 0.1 μm to 1 μm, so that through the roughened surface, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus.
8 . The cantilever probe card device according to claim 7 , wherein, in the observation process, the detection apparatus is operated by using light to irradiate on the climb-restricting probes for obtaining the observation point of each of the climb-restricting probes; and wherein, in each of the climb-restricting probes, the roughened surface is capable of scattering the light irradiated thereon.
9 . A climb-restricting probe, comprising: an arm segment; a main segment located at one side of the arm segment, wherein the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction; a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment; and a climb-restricting ring surrounding the main segment along a top edge of the soldering end portion and protruding from an outer surface of the main segment; wherein the climb-restricting ring has a restriction height along the predetermined direction, wherein the restriction height is within a range from 3 μm to 50 μm, and wherein the climb-restricting ring is capable of blocking a solder, such that the solder does not climb past the climb-restricting ring along the predetermined direction; wherein the climb-restricting probe includes a light absorption coating layer, and wherein the testing segment includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment and that is covered by the light absorption coating layer, and the pinpoint portion is exposed from the light absorption coating layer, so that through the light absorption coating layer, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus.
10 . A climb-restricting probe, comprising: an arm segment; a main segment located at one side of the arm segment, wherein the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction; a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment; and a climb-restricting ring surrounding the main segment along a top edge of the soldering end portion and protruding from an outer surface of the main segment; wherein the climb-restricting ring has a restriction height along the predetermined direction, wherein the restriction height is within a range from 3 μm to 50 μm, and wherein the climb-restricting ring is capable of blocking a solder, such that the solder does not climb past the climb-restricting ring along the predetermined direction; wherein the testing segment includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment and that has a roughened surface arranged on an entirety of an outer surface thereof, the roughened surface having an arithmetic average roughness (Ra) within a range from 0.1 μm to 1 μm, so that through the roughened surface, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION This application claims the benefit of priority to Taiwan Patent Application No. 112118411, filed on May 18, 2023. The entire content of the above identified application is incorporated herein by reference. Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference. FIELD OF THE DISCLOSURE The present disclosure relates to a cantilever probe card, and more particularly to a cantilever probe card device and a climb-restricting probe. BACKGROUND OF THE DISCLOSURE A conventional cantilever probe card includes a substrate and a plurality of cantilever probes that are mounted on the substrate and that have substantially the same shape. Each of the cantilever probes is fixed onto the substrate through one of solders. However, the solders tend to climb the cantilever probes at different heights, respectively, thereby causing the stability of the soldering process to be difficult to control. SUMMARY OF THE DISCLOSURE In response to the above-referenced technical inadequacies, the present disclosure provides a cantilever probe card device and a climb-restricting probe for effectively improving on the issues, such as solder-climbing, associated with conventional cantilever probe cards. In order to solve the above-mentioned problems, one of the technical aspects adopted by the present disclosure is to provide a cantilever probe card device, which includes a substrate, a plurality of solders, and a plurality of climb-restricting probes. The substrate includes a plurality of soldering pads. The solders are respectively disposed on the soldering pads. The climb-restricting probes are fixed onto the substrate, and each of the climb-restricting probes includes an arm segment, a main segment located at one side of the arm segment, a testing segment connected to another side of the arm segment, and a climb-restricting ring. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction. The climb-restricting ring surrounds the main segment along a top edge of the soldering end portion and protrudes from an outer surface of the main segment. In each of the climb-restricting probes, the climb-restricting ring has a restriction height along the predetermined direction. The restriction height is within a range from 3 μm to 50 μm. The soldering end portions of the main segments of the climb-restricting probes are respectively soldered and fixed onto the soldering pads of the substrate through the solders. In each of the climb-restricting probes, the climb-restricting ring is able to block the corresponding solder on the soldering end portion, so that the corresponding solder does not climb across the climb-restricting ring along the predetermined direction. In order to solve the above-mentioned problems, another one of the technical aspects adopted by the present disclosure is to provide a climb-restricting probe, which includes an arm segment, a main segment located at one side of the arm segment, a testing segment connected to another side of the arm segment, and a climb-restricting ring. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction. The climb-restricting ring surrounds the main segment along a top edge of the soldering end portion and protrudes from an outer surface of the main segment. The climb-restricting ring has a restriction height along the predetermined direction. The restriction height is within a range from 3 μm to 50 μm. The climb-restricting ring is able to block a solder from climbing, such that the solder does not climb past the climb-restricting ring along the predetermined direction. Therefore, in any one of the cantilever probe card device and the climb-restricting probe of the present disclosure, the main segment is provided with the climb-restricting ring at a specific position, so that a climbing height of the solder climbing on the climb-restricting probe can be precisely controlled for effectively maintaining the stability of the soldering process of the climb-restricting probe. These and other aspects of the present disclosure will become apparent from the following description of the embodiment tak