US-12625247-B2 - Semiconductor device package and a method of manufacturing the same

Abstract

At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.

Inventors

• Yuanhao Yu
• Chung Ju YU
• Wei-Fan Wu
• Chai-Chi Lin
• Hong Jie CHEN

Assignees

• ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Dates

Publication Date

20260512

Application Date

20210519

Claims (19)

1. 1 . An electronic apparatus, comprising: a first substrate having a first surface and a second surface opposite to the first surface; an antenna module including a first antenna disposed over the first surface of the first substrate and a first electronic component disposed under the second surface of the first substrate, the antenna module being configured to detect a movement of an object; a control module including a second electronic component disposed over the first surface of the first substrate and a sensor device disposed under the second surface of the first substrate, the control module being electrically connected to the antenna module by the first substrate; and a first molding encapsulant encapsulating the first antenna of the antenna module and the second electronic component of the control module, wherein the control module is configured to receive a signal from the antenna module and to control the electronic apparatus in response to the signal.
2. 2 . The electronic apparatus of claim 1 , wherein the first molding encapsulant connects the first antenna of the antenna module to a second molding encapsulant of the control module.
3. 3 . The electronic apparatus of claim 1 , wherein a portion of the first molding encapsulant is disposed between the first antenna of the antenna module and the second electronic component of the control module.
4. 4 . The electronic apparatus of claim 1 , wherein a first portion of the first molding encapsulant is disposed between the first substrate and the first antenna of the antenna module, and a second portion of the first molding encapsulant is disposed between the first substrate and the second electronic component of the control module.
5. 5 . The electronic apparatus of claim 1 , wherein a lateral surface of the first molding encapsulant is substantially aligned with a lateral surface of the first substrate.
6. 6 . The electronic apparatus of claim 1 , wherein the control module includes a second molding encapsulant encapsulating the second electronic component and a second antenna, and wherein the second antenna of the control module is disposed over the first surface of the first substrate.
7. 7 . The electronic apparatus of claim 6 , wherein a vertical projection of the sensor device overlaps a vertical projection of the second electronic component from a cross sectional perspective, and the sensor device is free from encapsulation by the first molding encapsulant.
8. 8 . The electronic apparatus of claim 7 , wherein the first substrate includes a waveguide and a radio hole exposing the waveguide, and the waveguide is connected to the sensor device.
9. 9 . The electronic apparatus of claim 8 , wherein the waveguide extends from the first surface to the second surface of the first substrate.
10. 10 . The electronic apparatus of claim 8 , wherein the radio hole and the sensor device are disposed at different sides of the waveguide.
11. 11 . The electronic apparatus of claim 6 , wherein an elevation of the first antenna of the antenna module is lower than the second antenna of the control module with respect to the first substrate.
12. 12 . The electronic apparatus of claim 6 , wherein the second molding encapsulant is encapsulated by the first molding encapsulant.
13. 13 . The electronic apparatus of claim 1 , wherein the antenna module comprises: a second substrate disposed under the second surface of the first substrate and supporting the first electronic component; and a third molding encapsulant disposed under the second surface of the first substrate and encapsulating the first electronic component of the antenna module.
14. 14 . The electronic apparatus of claim 13 , wherein the third molding encapsulant is spaced apart from the first substrate by the second substrate of the antenna module.
15. 15 . The electronic apparatus of claim 13 , further comprising a housing covering the first molding encapsulant and the third molding encapsulant.
16. 16 . The electronic apparatus of claim 15 , wherein the electronic apparatus is configured to be worn by a user, and the antenna module faces away from the user with respect to the first substrate.
17. 17 . The electronic apparatus of claim 15 , wherein the housing includes an upper portion and a lower portion, the antenna module and the control module are disposed in the lower portion, and the electronic apparatus further comprises a battery disposed within the upper portion.
18. 18 . The electronic apparatus of claim 17 , wherein the control module is closer to the upper portion than the antenna module.
19. 19 . The electronic apparatus of claim 1 , wherein a distance between the antenna module and an upper surface of the first molding encapsulant is greater than a distance between the control module and the upper surface of the first molding encapsulant.

Description

BACKGROUND 1. Technical Field The present disclosure relates to a semiconductor device package. More particularly, the present disclosure relates to a semiconductor device package having multiple antenna modules operating in different frequency bands. 2. Description of the Related Art Wearable devices, such as true wireless stereo (TWS) headphones, typically include antennas for transmitting and receiving radio frequency (RF) signals. The wearable devices can provide functionality of receiving a call and rejecting a call. As functionality of wearable devices increases, integration of more functional elements into the devices is a major industry priority. SUMMARY In some embodiments, according to one aspect, a wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal. In some embodiments, according to another aspect, a semiconductor device package comprises a first substrate, a first antenna, a detecting controller, a second antenna, and a wearable device controller. The first antenna is disposed on the first substrate. The detecting controller is disposed on the first substrate. The second antenna is disposed on the first substrate. The wearable device controller is disposed on the first substrate. The first antenna and the detecting controller are integrated into a detecting module and the second antenna and the wearable device controller into a control module. In some embodiments, according to another aspect, a method is disclosed for manufacturing a semiconductor device package. The method includes: providing a substrate, disposing a wearable device controller and a first antenna on the substrate; and disposing a gesture-detecting controller and a second antenna on the substrate, wherein the first antenna and the wearable device controller are integrated into a control module and the second antenna and the gesture-detecting controller are integrated into a detecting module. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 2 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 3 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 4 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 5 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 6 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 7 is a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 8 illustrates a layout of a semiconductor device package according to some embodiments of the present disclosure. FIG. 9 illustrates a cross-section of a semiconductor device package according to some embodiments of the present disclosure. FIG. 10A illustrates a perspective view of an electronic apparatus according to some embodiments of the present disclosure. FIG. 10B illustrates a perspective view of an electronic apparatus according to some embodiments of the present disclosure. FIG. 11A illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 11B illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 11C illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 11D illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 12A illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 12B illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 12C illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 13A illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 13B illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 13C illustrates a method of manufacturing a semiconductor device package according to some embodiments of the present disclosure. FIG. 14A illustrates a method of manufacturing a semiconductor device package according to some embodiments o